Patent US4762174A successfully refreshed from Google Patents.
US4762174A
Expired / Lapsed
US
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Heat sink
Assignee: Individual
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Filing: 1986-04-11
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Granted: 1988-08-09
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Expires: 2006-04-11
Abstract
Abstract A heat sink is provided comprising a mixture of electrically non-conductive particles of microcrystalline material, such as diamond or cubic boron nitride, and an electrically non-conductive filler material, such as a fluorocarbon or paraffin, which fills the voids between said particles. The heat sink has a thermal conductivity that is non-linear with temperature and which has a positive coefficient such that the thermal conductivity increases with increasing temperature.
Inventors
- 👤 Raymonde G. C. Artus
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 12:12
CPC Classifications
C; C09; C09K; C09K5/00; C09K5/02; C09K5/06; C09K5/063
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
106 words
A heat sink comprising a sealed cell packed with a stiff paste consisting essentially of a mixture of electrically non-conductive particles of at least one microcrystalline material selected from the group consisting of diamond, cubic boron nitride, sapphire and silicon carbide and an electrically non-conductive filler material which fills the voids between the particles of the microcrystalline material, the particles being of a concentration to produce in the heat sink a thermal conductivity that is non-linear with temperature and which has a positive coefficient such that the thermal conductivity increases with increasing temperature, and wherein the mean particle to particle distance is about 0.1μ or less.
Claim 2
Dependent Claim
106 words
A heat sink comprising a sealed cell packed with a stiff paste consisting essentially of a mixture of electrically non-conductive particles of at least one microcrystalline material selected from the group consisting of diamond, cubic boron nitride, sapphire and silicon carbide and an electrically non-conductive filler material which fills the voids between the particles of the microcrystalline material, the particles being of a concentration to produce in the heat sink a thermal conductivity that is non-linear with temperature and which has a positive coefficient such that the thermal conductivity increases with increasing temperature, and wherein the mean particle to particle distance is about 0.1μ or less.
Claim 3
Dependent Claim
18 words
A heat sink according to claim 1, wherein the particle concentration is in excess of 50% by volume.
Claim 4
Dependent Claim
18 words
A heat sink according to claim 1, wherein the particle concentration is in excess of 60% by volume.
Claim 5
Dependent Claim
25 words
A heat sink according to claim 1, wherein the filler material is selected from the group comprising silicone oils, fluorocarbons and paraffins or mixtures thereof.
Claim 6
Dependent Claim
28 words
A heat sink according to claim 1, wherein an array of electrically connected micro-chips is embedded in the said mixture so as to be in thermal contact therewith.
Claim 7
Dependent Claim
85 words
A heat sink comprising a sealed cell packed with a mixture of electrically non-conductive particles of microcrystalline material and an electrically non-conductive filler material which fills the voids between said particles, the particle concentration in said mixture being in excess of 50% by volume and the mean particle to particle distance being about 0.1μ or less to produce in the heat sink a thermal conductivity that is non-linear with temperture and which has a positive coefficient such that the thermal conductivity increases with increasing temperature.
Claim 8
Dependent Claim
85 words
A heat sink comprising a sealed cell packed with a mixture of electrically non-conductive particles of microcrystalline material and an electrically non-conductive filler material which fills the voids between said particles, the particle concentration in said mixture being in excess of 50% by volume and the mean particle to particle distance being about 0.1μ or less to produce in the heat sink a thermal conductivity that is non-linear with temperture and which has a positive coefficient such that the thermal conductivity increases with increasing temperature.
Claim 9
Dependent Claim
108 words
A macro-chip comprising a heat sink consisting of a sealed cell packed with a mixture of electrically non-conductive particles of microcrystalline material and an electrically non-conductive filler material which fills the voids between said particles, the particle concentration in said mixture being in excess of 50% by volume and the mean particle to particle distance being about 0.1μ or less to produce in the heat sink a thermal conductivity that is non-linear with temperature and which has a positive coefficient such that the thermal conductivity increases with increasing temperature, and an array of electrically connected micro-chips embedded in said mixture so as to be in thermal contact therewith.
Claim 10
Dependent Claim
108 words
A macro-chip comprising a heat sink consisting of a sealed cell packed with a mixture of electrically non-conductive particles of microcrystalline material and an electrically non-conductive filler material which fills the voids between said particles, the particle concentration in said mixture being in excess of 50% by volume and the mean particle to particle distance being about 0.1μ or less to produce in the heat sink a thermal conductivity that is non-linear with temperature and which has a positive coefficient such that the thermal conductivity increases with increasing temperature, and an array of electrically connected micro-chips embedded in said mixture so as to be in thermal contact therewith.
References Cited (Backward Citations)
US1751939A
Cited
GB578869A
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US2550452A
Cited
US3386015A
Cited
US4299715A
Cited
FR2480488A1
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-08-09 | 1992-02-08 | 1992-08-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-08-09 | 1996-02-08 | 1996-08-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-08-09 | 2000-02-08 | 2000-08-09 | $7700.00 | Window Closed / Lapsed |