US4762174A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Heat sink
Assignee: Individual
•
Filing: 1986-04-11
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Granted: 1988-08-09
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Expires: 2006-04-11
Abstract
Abstract A heat sink is provided comprising a mixture of electrically non-conductive particles of microcrystalline material, such as diamond or cubic boron nitride, and an electrically non-conductive filler material, such as a fluorocarbon or paraffin, which fills the voids between said particles. The heat sink has a thermal conductivity that is non-linear with temperature and which has a positive coefficient such that the thermal conductivity increases with increasing temperature.
Inventors
- 👤 Raymonde G. C. Artus
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 00:58
CPC Classifications
C; C09; C09K; C09K5/00; C09K5/02; C09K5/06; C09K5/063
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
106 words
A heat sink comprising a sealed cell packed with a stiff paste consisting essentially of a mixture of electrically non-conductive particles of at least one microcrystalline material selected from the group consisting of diamond, cubic boron nitride, sapphire and silicon carbide and an electrically non-conductive filler material which fills the voids between the particles of the microcrystalline material, the particles being of a concentration to produce in the heat sink a thermal conductivity that is non-linear with temperature and which has a positive coefficient such that the thermal conductivity increases with increasing temperature, and wherein the mean particle to particle distance is about 0.1μ or less.
Claim 2
Dependent Claim
106 words
A heat sink comprising a sealed cell packed with a stiff paste consisting essentially of a mixture of electrically non-conductive particles of at least one microcrystalline material selected from the group consisting of diamond, cubic boron nitride, sapphire and silicon carbide and an electrically non-conductive filler material which fills the voids between the particles of the microcrystalline material, the particles being of a concentration to produce in the heat sink a thermal conductivity that is non-linear with temperature and which has a positive coefficient such that the thermal conductivity increases with increasing temperature, and wherein the mean particle to particle distance is about 0.1μ or less.
Claim 3
Dependent Claim
18 words
A heat sink according to claim 1, wherein the particle concentration is in excess of 50% by volume.
Claim 4
Dependent Claim
18 words
A heat sink according to claim 1, wherein the particle concentration is in excess of 60% by volume.
Claim 5
Dependent Claim
25 words
A heat sink according to claim 1, wherein the filler material is selected from the group comprising silicone oils, fluorocarbons and paraffins or mixtures thereof.
Claim 6
Dependent Claim
28 words
A heat sink according to claim 1, wherein an array of electrically connected micro-chips is embedded in the said mixture so as to be in thermal contact therewith.
Claim 7
Dependent Claim
85 words
A heat sink comprising a sealed cell packed with a mixture of electrically non-conductive particles of microcrystalline material and an electrically non-conductive filler material which fills the voids between said particles, the particle concentration in said mixture being in excess of 50% by volume and the mean particle to particle distance being about 0.1μ or less to produce in the heat sink a thermal conductivity that is non-linear with temperture and which has a positive coefficient such that the thermal conductivity increases with increasing temperature.
Claim 8
Dependent Claim
85 words
A heat sink comprising a sealed cell packed with a mixture of electrically non-conductive particles of microcrystalline material and an electrically non-conductive filler material which fills the voids between said particles, the particle concentration in said mixture being in excess of 50% by volume and the mean particle to particle distance being about 0.1μ or less to produce in the heat sink a thermal conductivity that is non-linear with temperture and which has a positive coefficient such that the thermal conductivity increases with increasing temperature.
Claim 9
Dependent Claim
108 words
A macro-chip comprising a heat sink consisting of a sealed cell packed with a mixture of electrically non-conductive particles of microcrystalline material and an electrically non-conductive filler material which fills the voids between said particles, the particle concentration in said mixture being in excess of 50% by volume and the mean particle to particle distance being about 0.1μ or less to produce in the heat sink a thermal conductivity that is non-linear with temperature and which has a positive coefficient such that the thermal conductivity increases with increasing temperature, and an array of electrically connected micro-chips embedded in said mixture so as to be in thermal contact therewith.
Claim 10
Dependent Claim
108 words
A macro-chip comprising a heat sink consisting of a sealed cell packed with a mixture of electrically non-conductive particles of microcrystalline material and an electrically non-conductive filler material which fills the voids between said particles, the particle concentration in said mixture being in excess of 50% by volume and the mean particle to particle distance being about 0.1μ or less to produce in the heat sink a thermal conductivity that is non-linear with temperature and which has a positive coefficient such that the thermal conductivity increases with increasing temperature, and an array of electrically connected micro-chips embedded in said mixture so as to be in thermal contact therewith.
References Cited (Backward Citations)
US1751939A
Cited
GB578869A
Cited
US2550452A
Cited
US3386015A
Cited
US4299715A
Cited
FR2480488A1
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-08-09 | 1992-02-08 | 1992-08-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-08-09 | 1996-02-08 | 1996-08-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-08-09 | 2000-02-08 | 2000-08-09 | $7700.00 | Window Closed / Lapsed |