Patent FR1509112A successfully refreshed from Google Patents.
Patent US4759491A successfully refreshed from Google Patents.
US4759491A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for applying bonding material to component leads
Assignee: AT&T Inc
•
Filing: 1987-05-18
•
Granted: 1988-07-26
•
Expires: 2007-05-18
Abstract
Abstract A controlled amount of a solder is applied to the tip (18) of each lead (14) of a multi-lead component (10) by first placing a solder sphere (30) in each of a plurality of cavities (24) arranged in a baseplate (22) in the same pattern as the tips of the leads. Thereafter, the tips of the leads of the component are placed in contact with the solder spheres while, at the same time, at least a pair of leads are each engaged by a separate one of a pair of alignment pins (32) rising upwardly from the baseplate. The alignment pins serve to constrain the lateral movement of the component, thereby maintaining the leads thereof in alignment with the solder spheres when the solder spheres are reflowed to bond to the tips of the leads.
Inventors
- 👤 John R. Fisher
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 11:49
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0444; B; B23; B23K; B23K3/00; B23K3/06; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H05K3/3426; H05K3/3465; H05K3/3478; H05K7/00; H05K7/02; H05K7/10; H05K7/1015; H05K7/1023; B23K2101/00; B23K2101/36; B23K2101/42; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10689; H05K2201/10954; H05K2201/10984; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0113; H05K2203/03; H05K2203/0338; H05K2203/04; H05K2203/041; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
148 words
A method of fabricating an article comprising the steps of: applying a controlled amount of a bonding material to the conductors on a component by placing each conductor in contact with bonding material seated in each of a set of cavities in a plate arranged in the same pattern as the conductors and then reflowing the bonding material; and thereafter bonding each conductor to a substrate, characterized in that: each conductor is a lead having a tip placed in contact with the bonding material in each cavity; and at least each of a pair of said leads is engaged with a separate one of a pair of alignment pins, respectively, each rising upwardly from the plate adjacent to a pair of cavities, so that the alignment pins constrain the lateral movement of the component to maintain said leads in alignment with said bonding material during the reflow thereof.
Claim 2
Independent Claim
148 words
A method of fabricating an article comprising the steps of: applying a controlled amount of a bonding material to the conductors on a component by placing each conductor in contact with bonding material seated in each of a set of cavities in a plate arranged in the same pattern as the conductors and then reflowing the bonding material; and thereafter bonding each conductor to a substrate, characterized in that: each conductor is a lead having a tip placed in contact with the bonding material in each cavity; and at least each of a pair of said leads is engaged with a separate one of a pair of alignment pins, respectively, each rising upwardly from the plate adjacent to a pair of cavities, so that the alignment pins constrain the lateral movement of the component to maintain said leads in alignment with said bonding material during the reflow thereof.
Claim 3
Dependent Claim
44 words
The method according to claim 1, characterized in that each of said pair of alignment pins engages said component after the component has descended a predetermined distance to limit the extent to which said leads sink into said bonding material during the reflow thereof.
Claim 4
Dependent Claim
53 words
The method according to claim 1, characterized in that each of said pair of leads is engaged by a separate one of said pair of alignment pins by placing said tips of the leads in contact with said bonding material such that each of a pair of said leads straddles each alignment pin.
Claim 5
Dependent Claim
58 words
The method according to claim 1, characterized in that: each of said pair of leads of said component is engaged by each of said pair of alignment pins by placing the tips of said leads in contact with the bonding material such that each of said alignment pins engages a corner of each of said pair of leads.
Claim 6
Dependent Claim
39 words
The method according to claim 1, characterized in that the bonding material preferentially bonds to each lead rather than to the base plate, and that following the reflow of said bonding material, said component is separated from the baseplate.
Claim 7
Dependent Claim
96 words
The method according to claim 1, characterized in that prior to placing the tips of the leads in contact with the bonding material seated in the cavities, a template is placed on said baseplate so that the pattern of cavities lies inside a central opening in the template and the alignment pins are each received in a corresponding notch in the periphery of the template central opening, and thereafter, the component is placed within the central opening of the template which aids in aligning the tips of the leads with the bonding material in each cavity.
Claim 8
Independent Claim
248 words
A method of fabricating an article comprising the steps of: applying a controlled amount of a solder to the tip of each conductor of a component by placing each conductor in contact with each of a plurality of solder spheres seated in each of a plurality of cavities in a plate arranged in the same pattern as the conductor and reflowing the solder spheres; and thereafter solder bonding each said lead of said component to a circuit board, characterized in that: each conductor is a lead whose tip is placed in contact with the solder sphere in each cavity; prior to placing the tips of the leads in contact with the solder spheres, a template, having a central opening with notches in the periphery thereof, is placed on the baseplate such that the pattern of cavities lies within the template central opening and each of a plurality of alignment pins rising upwardly from the base plate adjacent to the cavities seats in a notch in the periphery of the central opening, the template aiding in the alignment of the tips of the leads with the solder spheres; and at least each of a pair of said leads is engaged with a separate one of a pair of the alignment pins when the lead tips are placed in contact with the solder spheres, so that the alignment pins constrain the lateral movement of said component, thereby maintaining said leads in alignment with the solder spheres during the reflow thereof.
Claim 9
Independent Claim
248 words
A method of fabricating an article comprising the steps of: applying a controlled amount of a solder to the tip of each conductor of a component by placing each conductor in contact with each of a plurality of solder spheres seated in each of a plurality of cavities in a plate arranged in the same pattern as the conductor and reflowing the solder spheres; and thereafter solder bonding each said lead of said component to a circuit board, characterized in that: each conductor is a lead whose tip is placed in contact with the solder sphere in each cavity; prior to placing the tips of the leads in contact with the solder spheres, a template, having a central opening with notches in the periphery thereof, is placed on the baseplate such that the pattern of cavities lies within the template central opening and each of a plurality of alignment pins rising upwardly from the base plate adjacent to the cavities seats in a notch in the periphery of the central opening, the template aiding in the alignment of the tips of the leads with the solder spheres; and at least each of a pair of said leads is engaged with a separate one of a pair of the alignment pins when the lead tips are placed in contact with the solder spheres, so that the alignment pins constrain the lateral movement of said component, thereby maintaining said leads in alignment with the solder spheres during the reflow thereof.
Claim 10
Dependent Claim
44 words
The method according to claim 7, characterized in that each of said pair of alignment pins engages the component after the component has descended a predetermined distance to limit the extent to which said leads sink into said solder spheres during the reflow thereof.
Claim 11
Dependent Claim
39 words
The method according to claim 7, characterized in that the bonding material preferentially bonds to each lead rather than to the base plate, and that following the reflow of said bonding matrial, said component is separated from the baseplate.
Claim 12
Dependent Claim
49 words
The method according to claim 7, characterized in that each of said leads is engaged by each of said pair of alignment pins by placing said tips of the leads in contact with said solder spheres such that each of a pair of leads straddles each said alignment pin.
Claim 13
Dependent Claim
56 words
The method according to claim 7, characterized in that: each of said pair of leads of said component is engaged by each of said pair of alignment pins by placing the tips of said leads in contact with said solder spheres such that a corner of each lead is captured by each of said alignment pins.
Claim 14
Dependent Claim
118 words
Apparatus for applying a controlled amount of bonding material to the tip of at least one lead of a multi-lead component comprising: a baseplate having a plurality of cavities in a major surface thereof arranged in the same pattern as that of the leads for holding a quantity of bonding material therein, characterized in that each of a plurality of alignment pins rises upwardly from the baseplate adjacent to a pair of the cavities to engage each of a plurality of leads of said component upon the placement of the tips of the leads in contact with the bonding material in a separate one of the cavities in said baseplate to constrain the lateral movement of said component.
Claim 15
Dependent Claim
118 words
Apparatus for applying a controlled amount of bonding material to the tip of at least one lead of a multi-lead component comprising: a baseplate having a plurality of cavities in a major surface thereof arranged in the same pattern as that of the leads for holding a quantity of bonding material therein, characterized in that each of a plurality of alignment pins rises upwardly from the baseplate adjacent to a pair of the cavities to engage each of a plurality of leads of said component upon the placement of the tips of the leads in contact with the bonding material in a separate one of the cavities in said baseplate to constrain the lateral movement of said component.
Claim 16
Dependent Claim
37 words
The apparatus according to claim 12, characterized in that each said alignment pin includes means thereon to engage said component to limit the distance which each said lead sinks into said bonding material during the reflow thereof.
Claim 17
Dependent Claim
70 words
The apparatus according to claim 12, characterized in that said apparatus further includes a template having a central opening therein sized to receive the component, the central opening also having a plurality of notches in the periphery thereof to accommodate each of the alignment pins when the template is placed in intimate contact with the baseplate so that the central opening in said template is in registration with said cavities.
Claim 18
Independent Claim
223 words
A method of repairing a circuit board having at least one defective component which has each of a plurality of leads bonded to a separate one of a plurality of metallized areas on the surface of the circuit board comprising the steps of: removing the defective component from the circuit board; and bonding each of the leads of a replacement component to the pads on the circuit board previously bonded to the defective component wherein each lead of said replacement component has a controlled amount of bonding material applied thereto by a process including the steps of: applying a controlled amount of bonding material to the tips of each of the leads of the replacement component by placing the tips of the leads in contact with bonding material seated in each of a plurality of cavities in a plate arranged the same as the pattern of the leads; and reflowing the bonding material, characterized in that each of a pair of leads is engaged by a separate one of a pair of alignment pins, each rising upwardly from the plate, when the tips of the leads are placed in contact with the bonding material so that said alignment pins constrain the lateral movement of said component to maintain said tips of said leads in alignment with the bonding material during the reflow thereof.
Claim 19
Independent Claim
223 words
A method of repairing a circuit board having at least one defective component which has each of a plurality of leads bonded to a separate one of a plurality of metallized areas on the surface of the circuit board comprising the steps of: removing the defective component from the circuit board; and bonding each of the leads of a replacement component to the pads on the circuit board previously bonded to the defective component wherein each lead of said replacement component has a controlled amount of bonding material applied thereto by a process including the steps of: applying a controlled amount of bonding material to the tips of each of the leads of the replacement component by placing the tips of the leads in contact with bonding material seated in each of a plurality of cavities in a plate arranged the same as the pattern of the leads; and reflowing the bonding material, characterized in that each of a pair of leads is engaged by a separate one of a pair of alignment pins, each rising upwardly from the plate, when the tips of the leads are placed in contact with the bonding material so that said alignment pins constrain the lateral movement of said component to maintain said tips of said leads in alignment with the bonding material during the reflow thereof.
Claim 20
Independent Claim
118 words
A method for fabricating an article comprising the steps of: applying a controlled amount of bonding material to the conductors on a component by placing each conductor in contact with bonding material seated in each of a set of cavities in a plate arranged in the same pattern as the conductors; then reflowing the bond material; and thereafter bonding each conductor to a substrate, characterized in that: a relative motion is imparted between the conductors on the component and the plate to bring the conductors into contact with the bonding material while simultaneously constraining the lateral movement of the conductors with alignment pins affixed to the plate so the conductors are maintained in alignment with the bonding material.
Claim 21
Independent Claim
118 words
A method for fabricating an article comprising the steps of: applying a controlled amount of bonding material to the conductors on a component by placing each conductor in contact with bonding material seated in each of a set of cavities in a plate arranged in the same pattern as the conductors; then reflowing the bond material; and thereafter bonding each conductor to a substrate, characterized in that: a relative motion is imparted between the conductors on the component and the plate to bring the conductors into contact with the bonding material while simultaneously constraining the lateral movement of the conductors with alignment pins affixed to the plate so the conductors are maintained in alignment with the bonding material.
References Cited (Backward Citations)
DE2714483A1
Cited
DE2728330A1
Cited
SU710793A1
Cited
US4439918A
Cited
US4396140A
Cited
US4638938A
Cited
US4646435A
Cited
US4657172A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-07-26 | 1992-01-25 | 1992-07-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-07-26 | 1996-01-25 | 1996-07-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-07-26 | 2000-01-25 | 2000-07-26 | $7700.00 | Window Closed / Lapsed |