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US4756467A Expired / Lapsed US ⏱️ 0.0 years remaining

Solderable elements and method for forming same

Assignee: Carlisle Corp
•
Filing: 1986-04-03
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Granted: 1988-07-12
•
Expires: 2006-04-03
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Abstract

Abstract A wire having enhanced solderability characteristics is formed by applying a very thin uniform coat of silver to a clean copper wire substrate. A coat of tin is plated on top of the silver. Heat treatment causes the silver and tin to form an interface alloy. The device can be other than a wire and the substrate can be other than copper.

Inventors

  • 👤 Myron D. Schatzberg

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-03 11:48
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/001; B23K1/00; B23K1/20; B23K35/007; C; C25; C25D; C25D5/00; C25D5/10; C25D7/00; C25D7/06; C25D7/0607; H; H01; H01R; H01R43/00; H01R43/02; B23K2101/00; B23K2101/36; B23K2101/38; C25D5/48; C25D5/50; H01R4/00; H01R4/02; Y; Y10; Y10S; Y10S428/00; Y10S428/922; Y10S428/9265; Y10S428/929; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12708; Y10T428/12715; Y10T428/12771; Y10T428/12861; Y10T428/12882

Claims Analysis

Total Claims: 22
Claim 1
Independent Claim 84 words
The method of forming solderable connectors comprising the steps of: applying a thin uniform coat of silver to a clean substrate, applying a tin coat on top of said silver coat, and diffusing said silver and said tin into each other at a temperature and for a time sufficient to create an interface alloy between said silver and said tin such that the outermost layer of said solderable connector is tin and the layer immediately below said tin layer is said interface alloy layer.
Claim 2
Independent Claim 84 words
The method of forming solderable connectors comprising the steps of: applying a thin uniform coat of silver to a clean substrate, applying a tin coat on top of said silver coat, and diffusing said silver and said tin into each other at a temperature and for a time sufficient to create an interface alloy between said silver and said tin such that the outermost layer of said solderable connector is tin and the layer immediately below said tin layer is said interface alloy layer.
Claim 3
Dependent Claim 17 words
The method of claim 1 wherein substantially all of said silver is part of said interface alloy.
Claim 4
Dependent Claim 47 words
The method of claim 1 wherein: the temperature applied during said step of diffusing is at least high enough to cause silver and tin to diffuse into one another but lower than a temperature which will cause silver and the substrate to substantially diffuse into one another.
Claim 5
Dependent Claim 10 words
The method of claim 3 wherein said substrate is copper.
Claim 6
Dependent Claim 18 words
The method of claim 4 wherein said temperature during said step of diffusing is approximately 195 degrees centigrade.
Claim 7
Dependent Claim 17 words
The method of claim 1 wherein said step of applying a silver coat comprises an electro-deposition process.
Claim 8
Dependent Claim 44 words
The method of claim 1 wherein said substrate is wire and further comprising the step of: drawing down said wire to a predetermined size after said step of applying a tin coat; said step of diffusing including the annealing of said drawn down wire.
Claim 9
Dependent Claim 25 words
The method of claim 1 wherein the weight of silver on said substrate is substantially no greater than 0.15% of the weight of said substrate.
Claim 10
Dependent Claim 47 words
The method of claim 7 wherein: the temperature applied during said step of diffusing is at least high enough to cause silver and tin to diffuse into one another but lower than a temperature which will cause silver and the substrate to substantially diffuse into one another.
Claim 11
Dependent Claim 43 words
A connector having enhanced solderability characteristics consisting essentially of: a substrate, a tin coat on the outer surface of said connector, and a silver-tin alloy generated by the diffusion of silver and tin along the interface between said substrate and said tin coat.
Claim 12
Dependent Claim 43 words
A connector having enhanced solderability characteristics consisting essentially of: a substrate, a tin coat on the outer surface of said connector, and a silver-tin alloy generated by the diffusion of silver and tin along the interface between said substrate and said tin coat.
Claim 13
Dependent Claim 21 words
The connector of claim 10 wherein: said substrate is copper and there is substantially no diffusion of silver into said copper.
Claim 14
Dependent Claim 17 words
The connector of claim 10 wherein substantially all of said silver is part of said interface alloy.
Claim 15
Dependent Claim 17 words
The connector of claim 11 wherein substantially all of said silver is part of said interface alloy.
Claim 16
Dependent Claim 10 words
The connector of claim 10 wherein said substrate is wire.
Claim 17
Dependent Claim 11 words
The connector of claim 11 wherein said substrate is a wire.
Claim 18
Dependent Claim 11 words
The connector of claim 13 wherein said substrate is a wire.
Claim 19
Dependent Claim 29 words
The connector of claim 10 wherein: the weight of silver in said connector is substantially no more than one-quarter of one percent (0.25%) of the weight of said connector.
Claim 20
Dependent Claim 29 words
The connector of claim 13 wherein: the weight of silver in said connector is substantially no more than one-quarter of one percent (0.25%) of the weight of said connector.
Claim 21
Dependent Claim 29 words
The connector of claim 14 wherein: the weight of silver in said connector is substantially no more than one-quarter of one percent (0.25%) of the weight of said connector.
Claim 22
Dependent Claim 29 words
The connector of claim 16 wherein: the weight of silver in said connector is substantially no more than one-quarter of one percent (0.25%) of the weight of said connector.

References Cited (Backward Citations)

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US2239771A Cited
US2294482A Cited
US2417967A Cited
US3097965A Cited
US3314771A Cited
JPS5398072A Cited
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JPS5878312A Cited
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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1991-07-12 1992-01-11 1992-07-12 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1995-07-12 1996-01-11 1996-07-12 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1999-07-12 2000-01-11 2000-07-12 $7700.00 Window Closed / Lapsed

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