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US4755428A Expired / Lapsed US ⏱️ 0.0 years remaining

Polyimide powder and method for producing the same

Assignee: Nitto Denko Corp
•
Filing: 1986-04-18
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Granted: 1988-07-05
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Expires: 2006-04-18
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Abstract

Abstract A polyimide powder which can provide a molding having excellent both strength and heat resistance by heat-press molding, and a method for producing such polyimide powder are disclosed. The polyimide powder comprises spherical polyimide particles having a particle size distribution of from 0.5 to 20 μm and a mean particle diameter of from 1 to 15 μm, and comprising a repeating unit represented by the formula ##STR1## wherein Ar represents an aromatic diamine residue.

Inventors

  • 👤 Yuzuru Noda
  • 👤 Keizo Mizobe
  • 👤 Masanori Imai

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 00:41
CPC Classifications
C; C08; C08J; C08J3/00; C08J3/12; C08J3/14; C08G; C08G73/00; C08G73/06; C08G73/10; C08G73/1057; C08G73/1064; C08G73/1067; C08G73/1071; C08G73/1075; C08G73/1078; C08G73/1085; C08J2379/00; C08J2379/04; C08J2379/08; Y; Y10; Y10T; Y10T428/00; Y10T428/29; Y10T428/2982; Y10T428/31504; Y10T428/31721

Claims Analysis

Total Claims: 3
Claim 1
Independent Claim 149 words
A polyimide powder having pleats formed on the outer circumferential surface thereof comprising spherical polyimide particles having a particle size distribution of from 0.5 to 20 μm and a mean particle diameter of from 1 to 15 μm, and comprising a repeating unit represented by the formula ##STR6## wherein Ar represent an aromatic diamine residue, which polyimide powder is formed by the process which comprises: preparing a solution of a high molecular weight polyamide acid obtained by reacting biphenyltetracarboxylic dianhydrides and an aromatic diamino compound; heating the solution to a temperature of from 140°to 250° C. to imidate the polyamide acid while simultaneously removing condensation water produced by the imidation from the solution, thereby precipitating polyimide articles to yield a slurry; separating the polyimide particles from the slurry; and drying the polyimide particles by heating at a temperature of from 100°to 400° C. to thereby obtain said polyimide powder.
Claim 2
Dependent Claim 149 words
A polyimide powder having pleats formed on the outer circumferential surface thereof comprising spherical polyimide particles having a particle size distribution of from 0.5 to 20 μm and a mean particle diameter of from 1 to 15 μm, and comprising a repeating unit represented by the formula ##STR6## wherein Ar represent an aromatic diamine residue, which polyimide powder is formed by the process which comprises: preparing a solution of a high molecular weight polyamide acid obtained by reacting biphenyltetracarboxylic dianhydrides and an aromatic diamino compound; heating the solution to a temperature of from 140°to 250° C. to imidate the polyamide acid while simultaneously removing condensation water produced by the imidation from the solution, thereby precipitating polyimide articles to yield a slurry; separating the polyimide particles from the slurry; and drying the polyimide particles by heating at a temperature of from 100°to 400° C. to thereby obtain said polyimide powder.
Claim 3
Dependent Claim 13 words
A molded product formed by heat-press molding the polyimide product of claim 1.

References Cited (Backward Citations)

GB903272A Cited
GB981543A Cited
US3249588A Cited
GB1237432A Cited
US4473525A Cited
GB2037305A Cited
EP0046074A2 Cited
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US4520071A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1991-07-05 1992-01-04 1992-07-05 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1995-07-05 1996-01-04 1996-07-05 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1999-07-05 2000-01-04 2000-07-05 $7700.00 Window Closed / Lapsed

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