US4754243A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Microwave component mounting
Assignee: TE Connectivity Corp
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Filing: 1986-01-21
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Granted: 1988-06-28
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Expires: 2006-01-21
Abstract
Abstract A method of making a microwave semiconductor component and concurrently forming therewith a mounting membrane adapted for positioning the semiconductor component in an RF transmission medium such as a waveguide. Substantially concurrently with the deposition of a metallic film in connection with forming a semiconductor elements, there is deposited a metallic membrane on the base silicon substrate and outside of the circuit element. The outer periphery of the base substrate is removed to expose the membrane. The metallic membrane is preferably of gold.
Inventors
- 👤 Albert L. Armstrong
- 👤 William Moroney
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 19:26
CPC Classifications
H; H10; H10W; H10W44/00; H10W44/20; H03; H03G; H03G11/00; H03G11/02; H03G11/025
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
131 words
In combination, a microwave semiconductor component having a mounting membrane concurrently formed therewith, and an RF transmission medium including different joinable waveguide sections, said mounting membrane adapted for positioning the microwave semiconductor component in said RF transmission medium, said microwave semiconductor component comprising, a semiconductor circuit element including a base substrate and a thin metallic film that defines part of the circuit element and that is deposited over the base substrate, and a peripheral metallic film over the base substrate and outboard of the circuit element, the periphery of the base substrate being removed to expose the peripheral metallic film, said peripheral metallic film forming said mounting membrane and means clamping the peripheral metallic film between said waveguide sections for positioning said semiconductor circuit element inside of said RF transmission medium.
Claim 2
Dependent Claim
131 words
In combination, a microwave semiconductor component having a mounting membrane concurrently formed therewith, and an RF transmission medium including different joinable waveguide sections, said mounting membrane adapted for positioning the microwave semiconductor component in said RF transmission medium, said microwave semiconductor component comprising, a semiconductor circuit element including a base substrate and a thin metallic film that defines part of the circuit element and that is deposited over the base substrate, and a peripheral metallic film over the base substrate and outboard of the circuit element, the periphery of the base substrate being removed to expose the peripheral metallic film, said peripheral metallic film forming said mounting membrane and means clamping the peripheral metallic film between said waveguide sections for positioning said semiconductor circuit element inside of said RF transmission medium.
Claim 3
Dependent Claim
14 words
A combination as set forth in claim 1 wherein the metallic film comprises gold.
Claim 4
Dependent Claim
37 words
A combination as set forth in claim 1 including a plurality of semiconductor circuit elements and wherein the peripheral metallic film associated with each circuit element extends to define a gap with the adjacent peripheral metallic films.
Claim 5
Dependent Claim
31 words
A combination as set forth in claim 3 wherein the circuit elements are individually readily separable upon removal of the outer periphery of the base substrate associated with each circuit element.
Claim 6
Dependent Claim
19 words
A combination as set forth in claim 1 including a circuit run for conductive coupling from the cirucit element.
Claim 7
Dependent Claim
29 words
A combination as set forth in claim 1 wherein the depositing of the peripheral metallic film is carried out substantially concurrently with the depositing of the circuit metallic film.
Claim 8
Dependent Claim
35 words
A combinationa s set forth in claim 1 wherein the peripheral metallic film has opposite metallic surfaces exposed to permit the peripheral metallic film to be clamped between facing walls of the joinable waveguide sections.
Claim 9
Dependent Claim
39 words
A combination as set forth in claim 1 wherein said semiconductor circuit element is formed of a thickness greater than said peripheral metallic element and of a cross-sectional dimension to fit with close tolerance in said RF transmission medium.
Claim 10
Dependent Claim
29 words
A combination as set forth in claim 8 wherein said semiconductor circuit element defines a shoulder adapted to fit snugly into the inner dimensions of the RF transmission medium.
Claim 11
Dependent Claim
125 words
In combination, a microwave semiconductor component having a mounting membrane concurrently formed therewith, and an RF transmission medium including different sections, said mounting membrane adapted for positioning the microwave semiconductor component in said RF transmission medium, said microwave semiconductor component comprising a semiconductor circut element including a base substrate and a thin metallic film that defines part of the circuit element and that is deposited over the base substrate, and a peripheral metallic film outboard of the circuit element, said peripheral metallic element forming the mounting membrane and adapted to be clamped between said RF transmission medium sections, said peripheral metallic film having exposed opposite metallic surfaces that permit the peripheral metallic film to be clamped between facing walls of the RF transmission medium sections.
Claim 12
Dependent Claim
125 words
In combination, a microwave semiconductor component having a mounting membrane concurrently formed therewith, and an RF transmission medium including different sections, said mounting membrane adapted for positioning the microwave semiconductor component in said RF transmission medium, said microwave semiconductor component comprising a semiconductor circut element including a base substrate and a thin metallic film that defines part of the circuit element and that is deposited over the base substrate, and a peripheral metallic film outboard of the circuit element, said peripheral metallic element forming the mounting membrane and adapted to be clamped between said RF transmission medium sections, said peripheral metallic film having exposed opposite metallic surfaces that permit the peripheral metallic film to be clamped between facing walls of the RF transmission medium sections.
Claim 13
Dependent Claim
39 words
A combination as set forth in claim 10 wherein said semiconductor circuit element is formed of a thickness greater than said peripheral metallic element and of a cross-sectional dimension to fit with close tolerance in said RF transmission medium.
Claim 14
Dependent Claim
29 words
A combination as set forth in claim 11 wherein said semiconductor circuit element defines a shoulder adapted to fit snugly into the inner dimensions of the RF transmission medium.
Claim 15
Dependent Claim
14 words
A combination as set forth in claim 10 wherein the metallic film comprises gold.
Claim 16
Dependent Claim
37 words
A combination as set forth in claim 13 including a plurality of semiconductor circuit elements and wherein the peripheral metallic film associated with each circuit element extends to define a gap with the adjacent peripheral metallic films.
Claim 17
Dependent Claim
31 words
A combination as set forth in claim 14 wherein the circuit elements are individually readily separable upon removal of the outer periphery of the base substrate associated with each circuit element.
Claim 18
Dependent Claim
19 words
A combination as set forth in claim 10 including a circuit run for conductive coupling from the circuit element.
Claim 19
Dependent Claim
29 words
A combination as set forth in claim 10 wherein the depositing of the peripheral metallic film is carried out substantially concurrently with the depositing of the circuit metallic film.
Claim 20
Dependent Claim
43 words
A combination as set forth in claim 10 wherein the thin metallic film defining part of the circuit element and the peripheral metallic film are deposited substantially concurrently and the periphery of the base substrate is removed to expose the peripheral metallic film.
Claim 21
Dependent Claim
28 words
A combination as set forth in claim 18 wherein the depositing of the peripheral metallic film is carried out separately from the depositing of the thin metallic film.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-06-28 | 1991-12-28 | 1992-06-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-06-28 | 1995-12-28 | 1996-06-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-06-28 | 1999-12-28 | 2000-06-28 | $7700.00 | Window Closed / Lapsed |