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US4751194A Expired / Lapsed US ⏱️ 0.0 years remaining

Structures including quantum well wires and boxes

Assignee: Nokia Bell Labs
•
Filing: 1986-06-27
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Granted: 1988-06-14
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Expires: 2006-06-27
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Abstract

Abstract A method of fabricating quantum well wires and boxes is described in which interdiffusion in a semiconductor having a compositional profile is enhanced by the presence of defects created by ion implantation in localized regions.

Inventors

  • 👤 Joel B. Cibert
  • 👤 Arthur C. Gossard
  • 👤 Stephen J. Pearton
  • 👤 Pierre M. Petroff

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-26 07:38
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/20; H10P14/38; H10P14/3824; B; B82; B82Y; B82Y10/00; B82Y20/00; H10D; H10D62/00; H10D62/80; H10D62/81; H10D62/812; H10D62/813; H10D62/814; H10D62/815; H10D62/8181; H10P30/00; H10P30/20; H10P30/22; H01; H01S; H01S5/00; H01S5/30; H01S5/34; H01S5/3413; Y; Y10; Y10S; Y10S438/00; Y10S438/936; Y10S438/962

Claims Analysis

Total Claims: 11
Claim 1
Independent Claim 99 words
A method of fabricating a semiconductor structure comprising the steps of implanting a species into localized regions of a semiconductor body having a compositional profile, said compositional profile comprising first and second heterojunctions thereby forming a potential well region, said species being implanted into said potential well region which comprises one or more quantum well wires, said implanting having a dose level less than the amorphization threshold, and creating defects, said semiconductor comprising at least two species, and rapidly annealing said semiconductor structure to thereby cause interdiffusion of at least two species of said semiconductor via defect enhanced mechanisms.
Claim 2
Independent Claim 99 words
A method of fabricating a semiconductor structure comprising the steps of implanting a species into localized regions of a semiconductor body having a compositional profile, said compositional profile comprising first and second heterojunctions thereby forming a potential well region, said species being implanted into said potential well region which comprises one or more quantum well wires, said implanting having a dose level less than the amorphization threshold, and creating defects, said semiconductor comprising at least two species, and rapidly annealing said semiconductor structure to thereby cause interdiffusion of at least two species of said semiconductor via defect enhanced mechanisms.
Claim 3
Dependent Claim 17 words
A method as recited in claim 1 in which said semiconductor body comprises Group III-V compound semiconductors.
Claim 4
Dependent Claim 15 words
A method as recited in claim 2 in which said Group III-V semiconductors comprise GaAlAs.
Claim 5
Dependent Claim 14 words
A method as recited in claim 3 in which said implanted species comprises Ga.
Claim 6
Dependent Claim 14 words
A method as recited in claim 1 in which said wires have varying widths.
Claim 7
Independent Claim 109 words
A method of fabricating a semiconductor structure comprising the steps of implanting a species into localized regions of a semiconductor body having a compositional profile, said compositional profile comprising first and second heterojunctions thereby forming a potential well region, said species being implanted into said potential well region, said regions comprising lines having varying widths, said implanting having a dose level less than the amorphization threshold, and creating defects, said semiconductor comprising at least two species, and rapidly annealing said semiconductor structure to thereby cause interdiffusion of at least two species of said semiconductor via defect enhanced mechanisms, said annealing produces a laterally varying bandgap of said semiconductor body.
Claim 8
Independent Claim 109 words
A method of fabricating a semiconductor structure comprising the steps of implanting a species into localized regions of a semiconductor body having a compositional profile, said compositional profile comprising first and second heterojunctions thereby forming a potential well region, said species being implanted into said potential well region, said regions comprising lines having varying widths, said implanting having a dose level less than the amorphization threshold, and creating defects, said semiconductor comprising at least two species, and rapidly annealing said semiconductor structure to thereby cause interdiffusion of at least two species of said semiconductor via defect enhanced mechanisms, said annealing produces a laterally varying bandgap of said semiconductor body.
Claim 9
Dependent Claim 20 words
A method as recited in claim 1 in which said implanting produces a plurality of boxes in said semiconductor body.
Claim 10
Dependent Claim 15 words
A method as recited in claim 7 in which said boxes comprise quantum well boxes.
Claim 11
Dependent Claim 9 words
A device fabricated by the method of claim 1.

References Cited (Backward Citations)

US4194935A Cited
US4503447A Cited
US4575924A Cited
US4581621A Cited
US4591889A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1991-06-14 1991-12-14 1992-06-14 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1995-06-14 1995-12-14 1996-06-14 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1999-06-14 1999-12-14 2000-06-14 $7700.00 Window Closed / Lapsed

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