Surface mountable integrated circuit package equipped with sockets

Claim 1

A semiconductor integrated circuit package for use in a system, said system having a circuit board equipped with upstanding socket pins, said package comprising a first and a second supplementary member affixed thereto for forming package leads into a predetermined configuration and for protecting that conformation once so formed, said first and second supplementary member each having an annular body defined by an inner surface and an outer surface, said first supplementary member having projections on said inner surface to space package leads, an edge of the inner surface in contact with said package leads and package leads wrapped around an end of said first supplementary member onto an opposite face of said member, effective to provide a physical engagement between said first supplementary member and said package leads such that said first supplementary member not only shapes said package leads into a predetermined conformation but helps retain them in that conformation once so formed, said second supplementary member having on the annular body an inner surface containing recessed sockets to nest the ends of said formed package leads such that the ends of said formed package leads frictionally engage said socket pins upstanding on the circuit board, said second supplementary member being removably mounted on said first supplementary member to shield the ends of said formed package leads from unwanted deformation and damage.