US4746896A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Layered film resistor with high resistance and high stability
Assignee: Philips North America LLC
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Filing: 1986-05-08
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Granted: 1988-05-24
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Expires: 2006-05-08
Abstract
Abstract A high stability, high resistance metal film resistor having layered metallic films deposited and annealed such that one layer has a positive TCR and a negative TCR Slope, while a second layer has a negative TCR and a positive TCR Slope, thereby yielding a resistive film having TCR and a TCR Slope approaching zero.
Inventors
- 👤 James G. Mcquaid
- 👤 Stanley L. Bowlin
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 01:51
CPC Classifications
H; H01; H01C; H01C3/00; H01C17/00; H01C17/22; H01C17/232; H01C7/00; H01C7/06; H01C7/18; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49082; Y10T29/49099
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
74 words
A high stability metal film having a sheet resistance of 2000 to 15000 ohms per square comprising: an insulative substrate; a first layer of a first conductive metal having a positive TCR and a negative TCR Slope reactively deposited on said substrate and annealed; a second layer of a second conductive metal having a negative TCR and a positive TCR Slope deposited coextensively over said annealed first layer and annealed with said first layer.
Claim 2
Dependent Claim
74 words
A high stability metal film having a sheet resistance of 2000 to 15000 ohms per square comprising: an insulative substrate; a first layer of a first conductive metal having a positive TCR and a negative TCR Slope reactively deposited on said substrate and annealed; a second layer of a second conductive metal having a negative TCR and a positive TCR Slope deposited coextensively over said annealed first layer and annealed with said first layer.
Claim 3
Dependent Claim
25 words
The film of claim 1 wherein said first layer is a CrSi metal film derived by reactively sputtered Cr-Si in an argon and nitrogen atmosphere.
Claim 4
Dependent Claim
18 words
The film of claim 1 wherein said second layer is NiCrAl and said NiCrAl is sputtered in argon.
Claim 5
Dependent Claim
21 words
The film of claim 1 wherein said second layer is a NiCrAl derived by reactively sputtered NiCrAl in argon and nitrogen.
Claim 6
Dependent Claim
98 words
A metal film resistor of high stability having a sheet resistance of 2000 to 15000 ohms per square which comprises: an insulative substrate; a first layer of a CrSi film derived by reactive sputtering in a nitrogen atmosphere and annealed by heating at a temperature of about 500° C. in air, said layer having a positive TCR and a negative TCR slope; a second layer of a NiCrAl alloy film applied over said first layer and annealed by heating at a temperature of about 300° in air, said layer having a negative TCR and a positive TCR slope.
Claim 7
Dependent Claim
98 words
A metal film resistor of high stability having a sheet resistance of 2000 to 15000 ohms per square which comprises: an insulative substrate; a first layer of a CrSi film derived by reactive sputtering in a nitrogen atmosphere and annealed by heating at a temperature of about 500° C. in air, said layer having a positive TCR and a negative TCR slope; a second layer of a NiCrAl alloy film applied over said first layer and annealed by heating at a temperature of about 300° in air, said layer having a negative TCR and a positive TCR slope.
Claim 8
Dependent Claim
29 words
A metal film resistor as claimed in claim 5 in which the combined effect of the two layers is a TCR near zero and a TCR slope of zero.
Claim 9
Independent Claim
130 words
The method of making a high stability resistive film having a sheet resistance of 2000 to 15000 ohms per square which comprises the steps of: selecting an insulative substrate; reactively depositing a first conductive layer of a CrSi film on said substrate in an atmosphere comprising argon and nitrogen, said film having a positive TCR and a negative TCR slope; subjecting said film bearing substrate to a temperature of 500° C. for a period of time sufficient to anneal the deposited film; depositing a second conductive film of a NiCrAl alloy over said first conductive layer, said film having a negative TCR and a positive TCR slope; and subjecting the layered substrate to a temperature of 300° C. for a period of time sufficient to anneal the second conductive film.
Claim 10
Independent Claim
130 words
The method of making a high stability resistive film having a sheet resistance of 2000 to 15000 ohms per square which comprises the steps of: selecting an insulative substrate; reactively depositing a first conductive layer of a CrSi film on said substrate in an atmosphere comprising argon and nitrogen, said film having a positive TCR and a negative TCR slope; subjecting said film bearing substrate to a temperature of 500° C. for a period of time sufficient to anneal the deposited film; depositing a second conductive film of a NiCrAl alloy over said first conductive layer, said film having a negative TCR and a positive TCR slope; and subjecting the layered substrate to a temperature of 300° C. for a period of time sufficient to anneal the second conductive film.
Claim 11
Dependent Claim
27 words
The method of claim 7 in which the combined effect of the two annealed film layers is a TCR near zero and a TCR slope of zero.
Claim 12
Independent Claim
88 words
The method of making a high stability resistive film comprising the steps of: selecting an insulative substrate; reactively depositing a first conductive metal film on said substrate wherein said first conductive metal film has a positive TCR and a negative TCR Slope; annealing said first conductive film; depositing a second conductive metal film coextensively over said first conductive metal film, wherein said second conductive metal film has a negative TCR and a positive TCR Slope; annealing said second conductive metal film together with said first conductive metal film.
Claim 13
Independent Claim
88 words
The method of making a high stability resistive film comprising the steps of: selecting an insulative substrate; reactively depositing a first conductive metal film on said substrate wherein said first conductive metal film has a positive TCR and a negative TCR Slope; annealing said first conductive film; depositing a second conductive metal film coextensively over said first conductive metal film, wherein said second conductive metal film has a negative TCR and a positive TCR Slope; annealing said second conductive metal film together with said first conductive metal film.
References Cited (Backward Citations)
US2935717A
Cited
US3325258A
Cited
US3356982A
Cited
US3462723A
Cited
DE1640089A1
Cited
US3673539A
Cited
US4019168A
Cited
US3996551A
Cited
US4104607A
Cited
GB1586857A
Cited
US4520342A
Cited
US4454495A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-05-24 | 1991-11-23 | 1992-05-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-05-24 | 1995-11-23 | 1996-05-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-05-24 | 1999-11-23 | 2000-05-24 | $7700.00 | Window Closed / Lapsed |