← Back to Patent Explorer
US4745036A Expired / Lapsed US ⏱️ 0.0 years remaining

Jumper chip for semiconductor devices

Assignee: Cominco Electronic Materials Inc
•
Filing: 1986-10-17
•
Granted: 1988-05-17
•
Expires: 2006-10-17
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract In the manufacture of semiconductor device packages, a jumper chip, comprising a substrate and a gold alloy attached thereto, with improved bonding characteristics is provided. By applying a coating of gold on both sides of the gold alloy prior to attaching the gold alloy to the substrate, the bonding of the gold alloy to the substrate and to the gold coating of the cavity in a device package is improved. Scrubbing of the jumper chip on the gold coating of the cavity is obviated. The additional gold layers applied to the gold alloy are distinct and visible on a photograph of a cross-section of the jumper chip.

Inventors

  • 👤 Robert L. Trevison
  • 👤 William E. McKee
  • 👤 Larry B. Hunnel

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-04 00:46
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/02; H10W70/20; H10W70/24; H10W70/60; H10W70/62; H10W70/66; H10W72/00; H10W72/50; H10W72/59; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12528; Y10T428/12736; Y10T428/1275; Y10T428/12757; Y10T428/12771; Y10T428/12861; Y10T428/12889

Claims Analysis

Total Claims: 3
Claim 1
Independent Claim 168 words
A jumper chip for semiconductor devices consisting of a substrate made of a material chosen from the group consisting of iron-nickel binary alloys and iron-nickel-cobalt ternary alloys; a surface layer made of a material chosen from the group consisting of aluminum and aluminum-silicon alloys on one side of said substrate, a gold-alloy layer having a gold layer on opposite sides thereof, one of said gold layers having a distinct thickness and being intermediate the other side of said substrate and said gold-alloy layer; said gold-alloy layer being made of alloys chosen from the group consisting of gold-germanium binary alloys, gold-silicon binary alloys and gold-germanium-silicon ternary alloys, said gold-silicon binary alloys and said gold-germanium-silicon ternary alloys containing silicon in an amount in the range of about 0.3 to 4% by weight and said gold-germanium binary alloys and said gold-germanium-silicon ternary alloys containing germanium in an amount of less than about 12% by weight; said surface layer, said substrate, said gold layers and said gold-alloy layer being integral and contiguous.
Claim 2
Dependent Claim 168 words
A jumper chip for semiconductor devices consisting of a substrate made of a material chosen from the group consisting of iron-nickel binary alloys and iron-nickel-cobalt ternary alloys; a surface layer made of a material chosen from the group consisting of aluminum and aluminum-silicon alloys on one side of said substrate, a gold-alloy layer having a gold layer on opposite sides thereof, one of said gold layers having a distinct thickness and being intermediate the other side of said substrate and said gold-alloy layer; said gold-alloy layer being made of alloys chosen from the group consisting of gold-germanium binary alloys, gold-silicon binary alloys and gold-germanium-silicon ternary alloys, said gold-silicon binary alloys and said gold-germanium-silicon ternary alloys containing silicon in an amount in the range of about 0.3 to 4% by weight and said gold-germanium binary alloys and said gold-germanium-silicon ternary alloys containing germanium in an amount of less than about 12% by weight; said surface layer, said substrate, said gold layers and said gold-alloy layer being integral and contiguous.
Claim 3
Dependent Claim 23 words
A jumper chip as claimed in claim 1, wherein said distinct thickness is in the range of about 20 to 60 micro inches.

References Cited (Backward Citations)

US3850688A Cited
US4142202A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1991-05-17 1991-11-16 1992-05-17 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1995-05-17 1995-11-16 1996-05-17 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1999-05-17 1999-11-16 2000-05-17 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag