Patent US4742385A successfully refreshed from Google Patents.
US4742385A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multichip package having outer and inner power supply means
Assignee: NEC Corp
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Filing: 1986-08-05
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Granted: 1988-05-03
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Expires: 2006-08-05
Abstract
Abstract For uniform distribution of power to integrated circuit chips arranged on a substrate, a multichip package comprises a plurality of power feed contact pads on an outer portion of the substrate for coupling to an external power source and a pair of power feed pins on an inner portion of the substrate for coupling to the external power source. A conductive means is provided on the substrate for distributing power from the power feed contact pads and the power feed pins to the integrated circuit chips.
Inventors
- 👤 Mitsuo Kohmoto
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 23:12
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W70/611; H10W90/00
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
112 words
A multichip package comprising: a substrate; a plurality of integrated circuit chips mounted on one surface of said substrate; a plurality of power feed contact pads arranged on an outer portion of said substrate for coupling to an external power source; a plurality of signal feed contact pads arranged on said outer portion and respectively coupled to said chips for coupling to an external circuit; a pair of power feed pins mounted on the center portion of the area of said substrate for coupling to said external power source; and conductive means for uniformly distributing power from said power feed contact pads and said power feed pins to said integrated circuit chips.
Claim 2
Dependent Claim
112 words
A multichip package comprising: a substrate; a plurality of integrated circuit chips mounted on one surface of said substrate; a plurality of power feed contact pads arranged on an outer portion of said substrate for coupling to an external power source; a plurality of signal feed contact pads arranged on said outer portion and respectively coupled to said chips for coupling to an external circuit; a pair of power feed pins mounted on the center portion of the area of said substrate for coupling to said external power source; and conductive means for uniformly distributing power from said power feed contact pads and said power feed pins to said integrated circuit chips.
Claim 3
Dependent Claim
191 words
A multichip package comprising: a substrate; a plurality of integrated circuit chips mounted on one surface of said substrate; a plurality of power feed contact pads arranged on an outer portion of said substrate and a plurality of signal feed contact pads arranged on said outer portion and respectively coupled to said chips; a pair of power feed pins mounted on the center portion of the area of said substrate; conductive means for uniformly distributing power from said power feed contact pads and said power feed pins to said integrated circuit chips; a circuit board; means for securing said substrate on said circuit board; a plurality of power feed connectors on said circuit board respectively engageable with said power feed contact pads for coupling power from an external power source to said power feed contact pads and a plurality of signal feed connectors on said circuit board respectively engageable with said signal feed contact pads for coupling an external circuit to said chips; and a pair of sockets on said circuit board engageable respectively with said power feed pins for coupling power from said external source to said power feed pins.
Claim 4
Dependent Claim
191 words
A multichip package comprising: a substrate; a plurality of integrated circuit chips mounted on one surface of said substrate; a plurality of power feed contact pads arranged on an outer portion of said substrate and a plurality of signal feed contact pads arranged on said outer portion and respectively coupled to said chips; a pair of power feed pins mounted on the center portion of the area of said substrate; conductive means for uniformly distributing power from said power feed contact pads and said power feed pins to said integrated circuit chips; a circuit board; means for securing said substrate on said circuit board; a plurality of power feed connectors on said circuit board respectively engageable with said power feed contact pads for coupling power from an external power source to said power feed contact pads and a plurality of signal feed connectors on said circuit board respectively engageable with said signal feed contact pads for coupling an external circuit to said chips; and a pair of sockets on said circuit board engageable respectively with said power feed pins for coupling power from said external source to said power feed pins.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-05-03 | 1991-11-02 | 1992-05-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-05-03 | 1995-11-02 | 1996-05-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-05-03 | 1999-11-02 | 2000-05-03 | $7700.00 | Window Closed / Lapsed |