Semiconductor laser device having a semiconductor substrate, a laser chip thereon and spaced photo-detecting portions

Claim 2

A semiconductor laser device comprising: a semiconductor substrate; a semiconductor laser chip mounted on a surface of said semiconductor substrate at one region; and a plurality of photo-detecting portions for receiving laser light emitted from said semiconductor laser chip provided on the surface of said semiconductor substrate at another region separated from said semiconductor laser chip; said plurality of photo-detecting portions including first and second photo-detecting portions, each provided in regions divided by a predetermined line extending from said laser chip for receiving laser light from said laser chip.

Claim 3

A semiconductor laser device comprising: a semiconductor substrate: a semiconductor laser chip mounted on a surface of said semiconductor substrate at one region; and a plurality of photo-detecting portions for receiving laser light emitted from said semiconductor laser chip provided on the surface of said semiconductor substrate at another region separated from said semiconductor laser chip; wherein said device is elongated, said region at which said chip is mounted is adjacent one end of said device and said region at which said photo-detecting portions are provided is at the other end of said device; and wherein said photo-detecting portions include a central, a left and a right photo-detector portion, and photo-detecting portions are symmetrical about a first longitudinal central line extending through said central photo-detecting portion.

Claim 4

A semiconductor laser device comprising: a semiconductor substrate: a semiconductor laser chip mounted on a surface of said semiconductor substrate at one region; and a plurality of photo-detecting portions for receiving laser light emitted from said semiconductor laser chip provided on the surface of said semiconductor substrate at another region separated from said semiconductor laser chip; wherein said device is elongated, said region at which said chip is mounted is adjacent one end of said device and said region at which said photo-detecting portions are provided is at the other end of said device; and wherein said photo-detecting portions include a central, a left and a right photo-detector portion, and photo-detecting portions are symmetrical about a first longitudinal central line extending through said central photo-detecting portion.

Claim 5

A semiconductor device as claimed in claim 2, wherein said laser chip includes a stripe and said chip and said stripe are symmetrical about a second central line and said first and second central lines are adapted to be colinear.

Claim 6

A semiconductor device as in claim 3, wherein said left and right photo-detecting portions are of substantially the same size and shape and said central photo-detecting portion is larger than said left or right photo-detecting portions.

Claim 7

A device as in claim 4, wherein said photo-detecting portions are rectangularly shaped and said central photo-detecting portion is wider than said left or right photo-detecting portion.

Claim 8

A device as in claim 5, wherein said central photo-detecting portion is provided with a wire bonding region along the first central line and remote from said chip.

Claim 9

A device as in claim 3, wherein each of said photo-detecting portions is triangularly shaped, with said left and right photo-detecting portions being of substantially the same size and mirror-image shape and the central photo-detecting portion is larger than each of the left and right photo-detecting portions and of a different shape.

Claim 10

A semiconductor laser device comprising: a semiconductor substrate; a semiconductor laser chip mounted on a surface of said semiconductor substrate at one region; and a plurality of photo-detecting portions for receiving laser light emitted from said semiconductor laser chip provided on the surface of said semiconductor substrate at another region separated from said semiconductor laser chip; wherein said device is elongated, said region at which said chip is mounted is adjacent one end of said device and said region at which said photo-detecting portions are provided is at the other end of said device, said device further includes left and right photo-detecting portions of the same size and shape, which are laterally spaced from each other and which are symmetric about a first longitudinal central line extending between said left and right portions in the space therebetween.

Claim 11

A semiconductor laser device comprising: a semiconductor substrate; a semiconductor laser chip mounted on a surface of said semiconductor substrate at one region; and a plurality of photo-detecting portions for receiving laser light emitted from said semiconductor laser chip provided on the surface of said semiconductor substrate at another region separated from said semiconductor laser chip; wherein said device is elongated, said region at which said chip is mounted is adjacent one end of said device and said region at which said photo-detecting portions are provided is at the other end of said device, said device further includes left and right photo-detecting portions of the same size and shape, which are laterally spaced from each other and which are symmetric about a first longitudinal central line extending between said left and right portions in the space therebetween.

Claim 12

A device as in claim 8, wherein there is provided a wire bonding region which includes portions of the left and right photo-detecting portions and overlies said first center line.

Claim 13

A device as in claim 8, wherein said photo-detecting diodes are each rectangularly shaped and of the same size and shape.

Claim 14

A semiconductor laser device comprising: a semiconductor substrate; a semiconductor laser chip mounted on a surface of said semiconductor substrate at one region; and a plurality of photo-detecting portions for receiving laser light emitted from said semiconductor laser chip provided on the surface of said semiconductor substrate at another region separated from said semiconductor laser chip; wherein said device is elongated, said region at which said chip is mounted is adjacent one end of said device and said region at which said photo-detecting portions are provided is at the other end of said device; and wherein said photo-detecting portions include a pair of rectangularly shaped photo-detecting portions, each laterally arranged on said substrate with one photo-detecting portion adjacent the end of said substrate, the other photo-detecting portion intermediate the chip and said one photo-detecting portion and said photo-detecting portions being longitudinally spaced from each other.

Claim 15

A semiconductor laser device comprising: a semiconductor substrate; a semiconductor laser chip mounted on a surface of said semiconductor substrate at one region; and a plurality of photo-detecting portions for receiving laser light emitted from said semiconductor laser chip provided on the surface of said semiconductor substrate at another region separated from said semiconductor laser chip; wherein said device is elongated, said region at which said chip is mounted is adjacent one end of said device and said region at which said photo-detecting portions are provided is at the other end of said device; and wherein said photo-detecting portions include a pair of rectangularly shaped photo-detecting portions, each laterally arranged on said substrate with one photo-detecting portion adjacent the end of said substrate, the other photo-detecting portion intermediate the chip and said one photo-detecting portion and said photo-detecting portions being longitudinally spaced from each other.

Claim 16

A semiconductor laser device as in claim 11, wherein said device is provided with a wire bonding region which overlies portions of each photodiodes and the space therebetween.