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US4734299A
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Sensitizing agent for electroless plating and method for sensitizing substrate with the agent
Assignee: Resonac Corp
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Filing: 1985-07-01
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Granted: 1988-03-29
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Expires: 2005-07-01
Abstract
Abstract A sensitizing agent for electroless plating which comprises a solution of at least one of palladium (II), silver (I), copper (I), copper (II), and nickel (II) compounds in an amide and a method for sensitizing substrates made of plastics or ceramics which comprises treating the substrates with the sensitizing agent, followed by treating them with a reducing solution, are provided.
Inventors
- 👤 Isao Matuzaki
- 👤 Kenzi Tonoki
- 👤 Takehiko Ishibashi
- 👤 Haruki Yokono
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 16:49
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/20; C23C18/28; H; H05; H05K; H05K3/00; H05K3/40; H05K3/42; H05K3/422
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
81 words
A sensitizing agent which does not chemically attack copper oxide for electroless plating which consists of water or alcohol and a solution of at least one metal compound of a metal selected from the group consisting of palladium (II), silver (I), copper (I), copper (III), and nickel (II) dissolved in an amide; said agent having a pH in the range of 11 to 13 and the concentration of the metal compound in the agent being from 0.01 to 1.0% by weight.
Claim 2
Dependent Claim
81 words
A sensitizing agent which does not chemically attack copper oxide for electroless plating which consists of water or alcohol and a solution of at least one metal compound of a metal selected from the group consisting of palladium (II), silver (I), copper (I), copper (III), and nickel (II) dissolved in an amide; said agent having a pH in the range of 11 to 13 and the concentration of the metal compound in the agent being from 0.01 to 1.0% by weight.
Claim 3
Dependent Claim
26 words
The sensitizing agent of claim 1, wherein the amide is at least one member selected from the group consisting of formamide, dimethylformamide, diethylformamide, dimethylacetamide and dimethylacrylamide.
Claim 4
Dependent Claim
40 words
The sensitizing agent of claim 2, wherein said metal compound is at least one member selected from the group consisting of a chloride, fluoride, a bromide, an iodide, a nitride, a sulfate, an oxide and a sulfide of said metal.
Claim 5
Independent Claim
113 words
A method for sensitizing a substrate to be electroless-plated which comprises treating the substrate with a sensitizing agent which does not chemically attack copper oxide, said agent consisting of water or alcohol and a solution of at least one metal compound of a metal selected from the group consisting of palladium (II), silver (I), copper (I), copper (II) and nickel (II) dissolved in an amide, said agent having a pH in the range of 11 to 13 and concentration of the metal compound in the agent being from 0.01 to 1.0% by weight; and thereafter treating the substrate with a reducing solution to provide a metallic form of said metal on said substrate.
Claim 6
Independent Claim
113 words
A method for sensitizing a substrate to be electroless-plated which comprises treating the substrate with a sensitizing agent which does not chemically attack copper oxide, said agent consisting of water or alcohol and a solution of at least one metal compound of a metal selected from the group consisting of palladium (II), silver (I), copper (I), copper (II) and nickel (II) dissolved in an amide, said agent having a pH in the range of 11 to 13 and concentration of the metal compound in the agent being from 0.01 to 1.0% by weight; and thereafter treating the substrate with a reducing solution to provide a metallic form of said metal on said substrate.
Claim 7
Dependent Claim
25 words
The method of claim 4, wherein the amide is at least one member selected from the group consisting of formamide, dimethylformamide, diethylformamide, dimethylacetamide and dimethylacrylamide.
Claim 8
Dependent Claim
40 words
The method of claim 5, wherein said metal compound is at least one member selected from the group consisting of a chloride, a fluoride, a bromide, an iodide, a nitrite, a sulfate, an oxide, and a sulfide of the metal.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-03-29 | 1991-09-28 | 1992-03-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-03-29 | 1995-09-28 | 1996-03-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-03-29 | 1999-09-28 | 2000-03-29 | $7700.00 | Window Closed / Lapsed |