Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
250 words
A method of fabricating an X-Y matrix for an electrophoretic display, comprising the steps of: (a) depositing a thin layer of indium-tin-oxide (ITO) on a carrier plate of glass, (b) etching said layer to form a vertical line pattern indicative of a Y access grid, (c) depositing a first thin layer of photoresist material over said vertical line pattern, (d) masking said first thin layer of photoresist according to a horizontal line pattern, (e) treating said masked layer to photolithographically form a series of depressions in said first photoresist layer with said depressions forming a horizontal line pattern with each horizontal line defined by a raised photoresist area between depressions, (f) plating said photoresist layer with a conductive metal to completely fill said depressions while covering said raised area to form a smooth top metal surface, (g) depositing a second layer of photoresist over said smooth top metal surface, (h) masking said second layer of photoresist according to said horizontal line pattern, (i) treating said masked second layer to photolithographically form a series of depressions in said second photoresist layer with said depressions forming a second horizontal line pattern congruent to said first horizontal line pattern, (j) removing all of said photoresist and plating located in said depressions including all of said photoresist in said second layer to obtain said horizontal line pattern over said vertical line pattern with each horizontal line separated from associated vertical lines by a thin layer of photoresist indicative of said raised area between depressions.
Claim 2
Independent Claim
250 words
A method of fabricating an X-Y matrix for an electrophoretic display, comprising the steps of: (a) depositing a thin layer of indium-tin-oxide (ITO) on a carrier plate of glass, (b) etching said layer to form a vertical line pattern indicative of a Y access grid, (c) depositing a first thin layer of photoresist material over said vertical line pattern, (d) masking said first thin layer of photoresist according to a horizontal line pattern, (e) treating said masked layer to photolithographically form a series of depressions in said first photoresist layer with said depressions forming a horizontal line pattern with each horizontal line defined by a raised photoresist area between depressions, (f) plating said photoresist layer with a conductive metal to completely fill said depressions while covering said raised area to form a smooth top metal surface, (g) depositing a second layer of photoresist over said smooth top metal surface, (h) masking said second layer of photoresist according to said horizontal line pattern, (i) treating said masked second layer to photolithographically form a series of depressions in said second photoresist layer with said depressions forming a second horizontal line pattern congruent to said first horizontal line pattern, (j) removing all of said photoresist and plating located in said depressions including all of said photoresist in said second layer to obtain said horizontal line pattern over said vertical line pattern with each horizontal line separated from associated vertical lines by a thin layer of photoresist indicative of said raised area between depressions.
Claim 3
Dependent Claim
17 words
The method according to claim 1, wherein the step of plating employs the electroless deposition of nickel.
Claim 4
Dependent Claim
19 words
The method according to claim 1, wherein the step of depositing said photoresist is depositing a phenolic resin photoresist.
Claim 5
Dependent Claim
34 words
The method according to claim 1, including the further steps of: securing a conductive plate above said vertical and horizontal line pattern with a space therebetween, and filling said space with an electrophoretic dispersion.