Patent US4729426A successfully refreshed from Google Patents.
US4729426A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Bonded clip heat sink
Assignee: Thermalloy Inc
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Filing: 1986-03-06
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Granted: 1988-03-08
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Expires: 2006-03-06
Abstract
Abstract A heat sink having a clip bonded thereon for resiliently securing the heat sink to an electronic device package. The clip includes an integral standoff directly bonded to the heat sink for spacing the clip from the heat sink. Preferably the heat sink and clip are surface treated before use.
Inventors
- 👤 Howard G. Hinshaw
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 06:18
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/60; H10W40/641
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
96 words
A heat sink for use in dissipating heat from an electronic device package comprising: (a) a body constructed of heat conducting material and adapted for rapid dissipation of heat therefrom; (b) a clip constructed of resilient material bonded to said heat sink body and adapted to grip an electronic device package to secure the electonic device package to said heat sink body and in thermal contact therewith, said clip having a first portion including an integral standoff formed thereon which is bonded to said body and spaces said first portion of said clip from said body.
Claim 2
Dependent Claim
96 words
A heat sink for use in dissipating heat from an electronic device package comprising: (a) a body constructed of heat conducting material and adapted for rapid dissipation of heat therefrom; (b) a clip constructed of resilient material bonded to said heat sink body and adapted to grip an electronic device package to secure the electonic device package to said heat sink body and in thermal contact therewith, said clip having a first portion including an integral standoff formed thereon which is bonded to said body and spaces said first portion of said clip from said body.
Claim 3
Dependent Claim
29 words
A heat sink as defined in claim 1 wherein said clip includes a pair of side flanges adapted for sliding contact with opposing sides of the electronic device package.
Claim 4
Dependent Claim
35 words
A heat sink as defined in claim 2 wherein said clip includes a tang adapted to contact the electronic device package at the end thereof furthest inserted between said clip and said heat sink body.
Claim 5
Dependent Claim
37 words
A heat sink as defined in claim 2 wherein said clip includes a tang adapted to engage an aperture in the electronic device package and prevent relative longitudinal movement between the device package and the heat sink.
Claim 6
Dependent Claim
17 words
A heat sink as defined in claim 1 wherein said body and said clip are surface treated.
Claim 7
Dependent Claim
63 words
A clip for securing an electronic device package in thermal contact with a heat sink comprising: (a) an elongated body of resilient material having a first end and a second end; (b) an integral standoff formed in said first end adapted to be bonded to said heat sink and to space the remainder of said body from the surface of said heat sink.
Claim 8
Dependent Claim
63 words
A clip for securing an electronic device package in thermal contact with a heat sink comprising: (a) an elongated body of resilient material having a first end and a second end; (b) an integral standoff formed in said first end adapted to be bonded to said heat sink and to space the remainder of said body from the surface of said heat sink.
Claim 9
Dependent Claim
13 words
A clip as defined in claim 6 wherein said clip is surface treated.
Claim 10
Dependent Claim
25 words
A clip as defined in claim 6 including a pair of side flanges adapted for sliding contact with opposing sides of an electronic device package.
Claim 11
Dependent Claim
25 words
A clip as defined in claim 8 including a tang for contact with an electronic device package inserted between said clip and a heat sink.
Claim 12
Dependent Claim
41 words
A clip as defined in claim 8 including a tang adapted to engage an aperture in an electronic device package inserted between said clip and a heat sink to prevent relative longitudinal movement between the device package and the heat sink.
Claim 13
Dependent Claim
86 words
A heat sink for use in dissipating heat from an electronic device package comprising: (a) a body constructed of heat conducting material and adapted for rapid dissipation of heat therefrom; (b) a clip adapted to be affixed to said body and to secure an electronic device package adjacent the surface of said body constructed of resilient material, said clip having a first portion defining an integral standoff with the face thereof bonded to said body and supporting the remainder of said clip spaced from said body.
Claim 14
Dependent Claim
86 words
A heat sink for use in dissipating heat from an electronic device package comprising: (a) a body constructed of heat conducting material and adapted for rapid dissipation of heat therefrom; (b) a clip adapted to be affixed to said body and to secure an electronic device package adjacent the surface of said body constructed of resilient material, said clip having a first portion defining an integral standoff with the face thereof bonded to said body and supporting the remainder of said clip spaced from said body.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-03-08 | 1991-09-07 | 1992-03-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-03-08 | 1995-09-07 | 1996-03-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-03-08 | 1999-09-07 | 2000-03-08 | $7700.00 | Window Closed / Lapsed |