Thermoplastic pressure-sensitive adhesive composition

Claim 1

A thermoplastic pressure-sensitive adhesive composition comprising as essential elements: (1) 100 parts of a shock absorbing and adhesion improving styrene-isoprene-styrene block copolymer having a melt index of 0.2 to 22 g per 10 minutes; (2) 50 to 800 parts of a tackifying resinous constituent consisting of: (a) 50 up to 500 parts of aliphatic hydrocarbon resin, having a softening point (ring and ball) of about 100° C., and (b) 0 to 300 parts of C 8 -aromatic resin, or terpenephenolic resin, or a combination thereof, having a softening point (ring and ball) of up to 200° C., (3) 1 to 300 parts of a copolyetheresteramide consisting of a product resulting from the polycondensation of an α,ω-dicarboxylic polyamide or copolyamide having a number average molecular weight of 300 to 15,000, employed in an amount of 90 to 5% by weight and of an aliphatic α, ω-dihydroxylated polyoxyalkylene having a number average molecular weight of 100 to 6,000, employed in an amount of 10 to 95% by weight, the said polycondensation product having a softening point (ring and ball) of between 80° and 210° C. and a viscosity in the molten state of 10 to 2,000 Pa.s at 200° C.; (4) up to 200 parts of tackifying naphthenic oil; (5) up to 300 parts of fillers.