US4725374A
Expired / Lapsed
US
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Process and apparatus for etching copper base materials
Assignee: Olin Corp
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Filing: 1987-01-12
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Granted: 1988-02-16
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Expires: 2007-01-12
Abstract
Abstract A solution for etching copper or a copper base material, the solution consisting essentially of peroxydisulfuric acid, being present in an amount of from about 0.5N up to about 6.0N, with chloride or fluoride present in an amount of from about 10 ppm up to about 500 ppm, and the balance water is described.
Inventors
- 👤 Michael J. Pryor
- 👤 Andrew J. Brock
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 16:43
CPC Classifications
C; C23; C23F; C23F1/00; C23F1/46; C23F1/10; C23F1/14; C23F1/16; C23F1/18; C23G; C23G1/00; C23G1/02; C23G1/10; C23G1/103; C23G1/36; H; H05; H05K; H05K3/00; H05K3/38; H05K3/382
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
55 words
A solution for etching copper or copper base materials consisting essentially of peroxydisulfuric acid in an effective amount for etching copper or copper based materials up to about 6.0N, a halide addition in an effective amount for decreasing the rate of decomposition of the persulfate values, up to about 500 ppm, and the balance water.
Claim 2
Dependent Claim
55 words
A solution for etching copper or copper base materials consisting essentially of peroxydisulfuric acid in an effective amount for etching copper or copper based materials up to about 6.0N, a halide addition in an effective amount for decreasing the rate of decomposition of the persulfate values, up to about 500 ppm, and the balance water.
Claim 3
Dependent Claim
22 words
The solution of claim 1 further comprising said peroxydisulfuric acid being present in an amount of from about 0.2N to about 5.5N.
Claim 4
Dependent Claim
22 words
The solution of claim 1 further comprising said peroxydisulfuric acid being present in an amount of from about 0.5N to about 2.0N.
Claim 5
Dependent Claim
22 words
The solution of claim 1 further consisting essentially of a halide selected from the group consisting of a chloride and a fluoride.
Claim 6
Dependent Claim
47 words
A solution for etching copper or copper based materials consisting essentially of peroxydisulfuric acid in an effective amount for etching copper or copper based materials, up to about 6.0N, a halide addition in an amount from about 10 ppm to about 500 ppm, and the balance water.
Claim 7
Dependent Claim
47 words
A solution for etching copper or copper based materials consisting essentially of peroxydisulfuric acid in an effective amount for etching copper or copper based materials, up to about 6.0N, a halide addition in an amount from about 10 ppm to about 500 ppm, and the balance water.
Claim 8
Dependent Claim
22 words
The solution of claim 5 further comprising said peroxydisulfuric acid being present in an amount of from about 0.2N to about 5.5N.
Claim 9
Dependent Claim
21 words
The solution of claim 5 further comprising said peroxydisulfuric acid being present in an amount from about 0.5N to about 2.0N.
Claim 10
Dependent Claim
22 words
The solution of claim 5 further consisting essentially of a halide selected from the group consisting of a chloride and a fluoride.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-02-15 | 1991-08-17 | 1992-02-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-02-15 | 1995-08-17 | 1996-02-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-02-15 | 1999-08-17 | 2000-02-16 | $7700.00 | Window Closed / Lapsed |