US4719255A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Epoxy resin composition for encapsulation of semi-conductor device
Assignee: Toshiba Corp
•
Filing: 1985-07-31
•
Granted: 1988-01-12
•
Expires: 2005-07-31
Abstract
Abstract An epoxy resin composition for encapsulation of semiconductor device comprises the components (a), (b), (c) and at least one of the components (d) and (e) as shown below: (a) 100 parts by weight of an epoxy resin having at least 2 epoxy groups in one molecule; (b) 8 to 65 parts by weight of a novolak type phenolic resin with an ortho ratio less than 50%; (c) 1.2 to 40 parts by weight of a polyvinyl acetal compound; (d) 0.8 to 30 parts by weight of a silicone oil; and (e) 4 to 80 parts by weight of a rubber-modified phenolic resin. The described epoxy resins composition for encapsulation of semiconductor devices can retain its high glass transition temperature in the cured product and also has low modulus of elasticity, as well as excellent humidity resistance and thermal shock resistance.
Inventors
- 👤 Akira Yoshizumi
- 👤 Hisayuki Hirai
- 👤 Kazutaka Matsumoto
- 👤 Shinetsu Fujieda
- 👤 Michiya Higashi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 16:13
CPC Classifications
H; H01; H01B; H01B3/00; H01B3/18; H01B3/30; H01B3/40; C; C08; C08L; C08L29/00; C08L29/14; C08L61/00; C08L61/04; C08L63/00; C08L91/00; H10; H10W; H10W74/00; H10W74/40; H10W74/47; C08L2203/00; C08L2203/20; C08L2203/206; C08L2205/00; C08L2205/03
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
137 words
An epoxy resin composition for encapsulation of semiconductor device, comprising the components (a), (b), (c) and at least one of the components (d) and (e) as shown below: (a) 100 parts by weight of an epoxy resin having at least two epoxy groups in one molecule; (b) 8 to 65 parts by weight of a novolak phenolic resin with an ortho ratio less than 50%; (c) 1.2 to 4.0 parts by weight of a polyvinyl acetal resin; (d) 0.8 to 30 parts by weight of a silicone oil; (e) 4 to 80 parts by weight of a rubber-modified phenolic resin, which resin (e) is distinct from resin (b); and (f) silica powder in an amount ranging between about 260 to 850 parts by weight, said resin composition having a glass transition temperature of 150° C. or higher.
Claim 2
Dependent Claim
137 words
An epoxy resin composition for encapsulation of semiconductor device, comprising the components (a), (b), (c) and at least one of the components (d) and (e) as shown below: (a) 100 parts by weight of an epoxy resin having at least two epoxy groups in one molecule; (b) 8 to 65 parts by weight of a novolak phenolic resin with an ortho ratio less than 50%; (c) 1.2 to 4.0 parts by weight of a polyvinyl acetal resin; (d) 0.8 to 30 parts by weight of a silicone oil; (e) 4 to 80 parts by weight of a rubber-modified phenolic resin, which resin (e) is distinct from resin (b); and (f) silica powder in an amount ranging between about 260 to 850 parts by weight, said resin composition having a glass transition temperature of 150° C. or higher.
Claim 3
Dependent Claim
24 words
An epoxy resin composition according to claim 1, wherein the component (a) is an epoxy resin with an epoxy equivalent of 100 to 300.
Claim 4
Dependent Claim
25 words
An epoxy resin composition according to claim 1, wherein the component (b) is a novolak phenolic resin with a hydroxyl equivalent of 100 to 150.
Claim 5
Dependent Claim
22 words
An epoxy composition according to claim 1, wherein the component (d) has a viscosity of 500 to 1,000,000 cP at 20° C.
Claim 6
Dependent Claim
19 words
An epoxy resin composition according to claim 1, wherein the composition comprises the components (a), (b), (c) and (d).
Claim 7
Dependent Claim
19 words
An epoxy resin composition according to claim 1, wherein the composition comprises the components (a), (b), (c) and (e).
Claim 8
Dependent Claim
19 words
An epoxy resin composition according to claim 6, wherein the composition further comprises a curing accelerator and silica powder.
Claim 9
Dependent Claim
17 words
An epoxy resin composition according to claim 6, wherein the component (a) is a novolak epoxy resin.
Claim 10
Dependent Claim
25 words
An epoxy resin composition according to claim 8, wherein the component (a) is a novolak epoxy resin having an epoxy equivalent of 175 to 220.
Claim 11
Dependent Claim
17 words
An epoxy resin composition according to claim 6, wherein the component (b) is a phenolic novolak resin.
Claim 12
Dependent Claim
16 words
An epoxy resin composition according to claim 5, wherein the component (c) is polyvinyl butyral resin.
Claim 13
Dependent Claim
20 words
An epoxy resin composition according to claim 1, wherein the composition comprises the components (a), (b), (c), (d) and (e).
Claim 14
Dependent Claim
153 words
An epoxy resin composition for encapsulation of semiconductor device having a glass transition temperature of 150° C. or more, comprising the components (a), (b), (c) and at least one of the components (d) and (e) as shown below: (a) 100 parts by weight of an epoxy resin having at least two epoxy groups in one molecule, said epoxy resin is substituted with 0 to 20 parts by weight of a brominated phenol novolak epoxy resin; (b) 12 to 55 parts by weight of a novolak phenolic resin with an ortho ratio less than 50%; (c) 5 to 30 parts by weight of a polyvinyl acetal resin; (d) 1.6 to 6 parts by weight of a silicone oil; (e) 8 to 60 parts by weight of a rubber-modified phenolic resin, which resin (e) is distinct from resin (b); and (f) silica powder in an amount ranging between about 260 to 850 parts by weight.
Claim 15
Dependent Claim
153 words
An epoxy resin composition for encapsulation of semiconductor device having a glass transition temperature of 150° C. or more, comprising the components (a), (b), (c) and at least one of the components (d) and (e) as shown below: (a) 100 parts by weight of an epoxy resin having at least two epoxy groups in one molecule, said epoxy resin is substituted with 0 to 20 parts by weight of a brominated phenol novolak epoxy resin; (b) 12 to 55 parts by weight of a novolak phenolic resin with an ortho ratio less than 50%; (c) 5 to 30 parts by weight of a polyvinyl acetal resin; (d) 1.6 to 6 parts by weight of a silicone oil; (e) 8 to 60 parts by weight of a rubber-modified phenolic resin, which resin (e) is distinct from resin (b); and (f) silica powder in an amount ranging between about 260 to 850 parts by weight.
References Cited (Backward Citations)
US3098054A
Cited
US3057614A
Cited
US3838094A
Cited
US3932689A
Cited
US4304880A
Cited
JPS57184242A
Cited
US4379916A
Cited
JPS5887121A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-01-11 | 1991-07-13 | 1992-01-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-01-11 | 1995-07-13 | 1996-01-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-01-11 | 1999-07-13 | 2000-01-12 | $7700.00 | Window Closed / Lapsed |