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US4717461A Expired / Lapsed US ⏱️ 0.0 years remaining

System and method for processing workpieces

Assignee: Machine Technology Inc
•
Filing: 1986-09-15
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Granted: 1988-01-05
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Expires: 2006-09-15
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Abstract

Abstract A method of processing a plurality of semiconductor wafers from a wafer cassette including a wafer transfer housing and one or more processing chambers. A wafer is removed from its cassette and transported through the transfer housing into one or more processing chambers for etching, deposition or other such operations. The processed wafer is replaced into its cassette after being transported back through the wafer transfer housing.

Inventors

  • 👤 Thomas L. Strahl
  • 👤 Lawrence T. Lamont, Jr.
  • 👤 Carl T. Peterson
  • 👤 Hobart A. Brown
  • 👤 Lonnie W. McCormick
  • 👤 Roderick C. Mosely

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-27 06:12
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/30; H10P72/34; H10P72/3402; H10P72/3411; H10P72/70; H10P72/76; H10P72/7604; H10P72/7608; Y; Y10; Y10S; Y10S414/00; Y10S414/135; Y10S414/137; Y10S414/139; Y10S438/00; Y10S438/907; Y10S438/908

Claims Analysis

Total Claims: 15
Claim 1
Independent Claim 102 words
A method of processing a plurality of workpieces comprising placing a plurality of workpieces in a first chamber adjacent to a transfer region, moving a workpiece out of the first chamber into the transfer region when the first chamber is closed to the ambient atmosphere, advancing the workpiece through the transfer region and into a second chamber, processing the workpiece in the second chamber, returning the workpiece through the transfer region to the first chamber, and repeating the moving, advancing, processing and returning steps for each workpiece of the plurality until all of the workpieces have been processed in the second chamber.
Claim 2
Independent Claim 102 words
A method of processing a plurality of workpieces comprising placing a plurality of workpieces in a first chamber adjacent to a transfer region, moving a workpiece out of the first chamber into the transfer region when the first chamber is closed to the ambient atmosphere, advancing the workpiece through the transfer region and into a second chamber, processing the workpiece in the second chamber, returning the workpiece through the transfer region to the first chamber, and repeating the moving, advancing, processing and returning steps for each workpiece of the plurality until all of the workpieces have been processed in the second chamber.
Claim 3
Dependent Claim 14 words
A method as set forth in claim 1, wherein said workpieces are semiconductor wafers.
Claim 4
Dependent Claim 49 words
A method as set forth in claim 1, further including the step of transferring each workpiece to a workpiece carrier at a first zone in the transfer region after the workpiece has been moved out of said first chamber and before the workpiece is directed into the second chamber.
Claim 5
Dependent Claim 37 words
A method as set forth in claim 1, further including the step of rotating the workpiece in the second chamber as the processing step is being performed to place the workpiece in a predetermined orientation for processing.
Claim 6
Dependent Claim 56 words
A method as set forth in claim 1, further including the step of rotating the workpiece in one direction about a first axis as the processing step is being performed, and rocking the workpiece about a second axis generally perpendicular to the first axis as the workpiece rotates about said first axis in said one direction.
Claim 7
Dependent Claim 20 words
A method as set forth in claim 1, wherein said processing step includes depositing a thin film on the workpiece.
Claim 8
Dependent Claim 41 words
A method as set forth in claim 1, further including the step of transferring a workpiece from the second chamber to a third chamber, and processing the workpiece in the third chamber before the workpiece is returned to the transfer region.
Claim 9
Dependent Claim 38 words
A method as set forth in claim 1, further including the step of evacuating the first and second chambers and the transfer region before the workpiece is transferred from the first chamber to the second chamber for processing.
Claim 10
Dependent Claim 87 words
A method as set forth in claim 1, wherein the step of advancing the workpiece through the transfer region includes shifting the workpiece out of the first chamber to a first location, rotating the workpiece at said location through a predetermined angle, directing the workpiece to a first zone in the transfer region, releasably coupling the workpiece to a carrier, moving the carrier and workpiece attached thereto to a second zone aligned with the second chamber, and moving the carrier and workpiece thereon into the second chamber.
Claim 11
Dependent Claim 58 words
A method as set forth in claim 9, wherein said returning step includes shifting the carrier from the second chamber to the central zone, separating the workpiece from the carrier, shifting the separated workpiece to the first location, moving the workpiece until it is aligned with the first chamber, and shifting the aligned workpiece into the first chamber.
Claim 12
Dependent Claim 30 words
A method as set forth in claim 9, further including the step of releasably gripping the workpiece at the outer periphery thereof to secure the same workpiece to the carrier.
Claim 13
Dependent Claim 30 words
A method as set forth in claim 11, further including the step of releasing the gripping action to allow the workpiece to be placed onto and separated from the carrier.
Claim 14
Dependent Claim 23 words
A method as set forth in claim 1, wherein said processing step includes sputtering a thin film on a face of the workpiece.
Claim 15
Dependent Claim 15 words
A method as set forth in claim 13, wherein said workpiece comprises a semiconductor wafer.

References Cited (Backward Citations)

US4405435A Cited
US4587002A Cited
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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1991-01-04 1991-07-06 1992-01-05 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1995-01-04 1995-07-06 1996-01-05 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1999-01-04 1999-07-06 2000-01-05 $7700.00 Window Closed / Lapsed

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