Patent US4717066A successfully refreshed from Google Patents.
US4717066A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of bonding conductors to semiconductor devices
Assignee: Nokia Bell Labs
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Filing: 1986-02-24
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Granted: 1988-01-05
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Expires: 2006-02-24
Abstract
Abstract Disclosed is a method of forming strong bonds between gold spheres and contact pads on semiconductor devices and the resulting product. The spheres are formed by establishing ball bonds with wire bonding techniques and then severing the wire. The wire material is a gold alloy including palladium which forms a weakened portion above the ball bond so that the wire can be easily broken off.
Inventors
- 👤 Tsvi Goldenberg
- 👤 Lawrence A. Greenberg
- 👤 Kenneth P. Moll
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 19:23
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/464; H10W70/465; B; B23; B23K; B23K20/00; B23K20/002; B23K20/004; B23K20/005; B23K20/007; H10W72/00; H10W72/071; H10W72/077; H10W72/701; H10W72/01; H10W72/012; H10W72/01221; H10W72/01225; H10W72/0711; H10W72/07141; H10W72/072; H10W72/07231; H10W72/07232; H10W72/07236; H10W72/07251; H10W72/20; H10W72/251; H10W72/252; H10W72/90; H10W72/951; H10W72/952
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
53 words
A method of forming a contact portion on a metal pad comprising the steps of forming a ball on one end of a conductive wire, bonding the ball to the metal pad and severing the wire from the ball, characterized in that the wire material comprises 97-99 percent gold and 1-3 percent palladium.
Claim 2
Independent Claim
53 words
A method of forming a contact portion on a metal pad comprising the steps of forming a ball on one end of a conductive wire, bonding the ball to the metal pad and severing the wire from the ball, characterized in that the wire material comprises 97-99 percent gold and 1-3 percent palladium.
Claim 3
Independent Claim
50 words
A method of forming a contact portion on a metal pad comprising the steps of forming a ball on one end of a conductive wire, bonding the ball to the metal and severing the wire from the ball, characterized in that the wire material consists essentially of gold and palladium.
Claim 4
Independent Claim
50 words
A method of forming a contact portion on a metal pad comprising the steps of forming a ball on one end of a conductive wire, bonding the ball to the metal and severing the wire from the ball, characterized in that the wire material consists essentially of gold and palladium.
Claim 5
Dependent Claim
39 words
The method according to claim 1 or 2 wherein the pad is disposed on a substrate and the substrate is heated to a temperature within the range 175-300 degrees C. during the bonding of the ball to the pad.
Claim 6
Dependent Claim
14 words
The method according to claim 1 or 2 wherein the metal pad comprises aluminum.
Claim 7
Dependent Claim
23 words
The method according to claim 1 or 2 further comprising bonding a conductive lead supported by an insulating tape onto the contact portion.
Claim 8
Dependent Claim
18 words
The method according to claim 1 or 2 wherein the metal pad is formed over a semiconductor substrate.
Claim 9
Independent Claim
92 words
A method of making electrical contact to an MOS semiconductor chip including an aluminum pad on one major surface comprising the steps of: providing a conductive wire consisting essentially of gold and palladium, and forming a ball on one end of the wire; bonding the ball to the metal pad by heating the semiconductor substrate in the range 175-300 degrees C. while contacting the ball to the pad; severing the wire from the ball by pulling on the wire; and bonding a conductive lead supported by an insulated tape onto the ball.
Claim 10
Independent Claim
92 words
A method of making electrical contact to an MOS semiconductor chip including an aluminum pad on one major surface comprising the steps of: providing a conductive wire consisting essentially of gold and palladium, and forming a ball on one end of the wire; bonding the ball to the metal pad by heating the semiconductor substrate in the range 175-300 degrees C. while contacting the ball to the pad; severing the wire from the ball by pulling on the wire; and bonding a conductive lead supported by an insulated tape onto the ball.
Claim 11
Dependent Claim
31 words
The method according to claim 7 wherein the wire is provided in a support tube and the wire is severed from the ball by only an upward movement of the tube.
References Cited (Backward Citations)
US4330329A
Cited
US4434347A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-01-04 | 1991-07-06 | 1992-01-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-01-04 | 1995-07-06 | 1996-01-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-01-04 | 1999-07-06 | 2000-01-05 | $7700.00 | Window Closed / Lapsed |