Duplex glass preforms for hermetic glass-to-metal sealing

Claim 2

A duplex glass preform for forming hermetic glass-to-metal seals, comprising: a glass matrix, said glass matrix having a peripheral interfacing surface for glass-to-metal sealing; a dispersion zone in at least one end of said glass matrix, said dispersion zone extending inwardly from a surface of said at least one end into said glass matrix for a predetermined depth; a substantially ceramic-free zone intermediate said dispersion zone and said peripheral interfacing surface; and a plurality of ceramic particles selectively distributed in said dispersion zone of said glass matrix to form a ceramic particle density gradient therein, and wherein said ceramic particle density gradient has a maximum value at said surface and gradually decreases to a near zero value at said predetermined depth.

Claim 3

The duplex glass preform according to claim 1 wherein said glass matrix further comprises a hard glass matrix.

Claim 4

The duplex glass preform according to claim 2 wherein said plurality of ceramic particles further comprises a plurality of alumina particles.

Claim 5

The duplex glass preform according to claim 1 wherein said predetermined depth is a value selected from a range of values of about 3 mils to about 15 mils.

Claim 6

The duplex glass preform according to claim 4 wherein said value is about 5 mils.

Claim 7

The duplex glass preform according to claim 1 wherein said plurality of ceramic particles further comprises a plurality of size-graded ceramic particles having a gradation range of coarse to fine, and wherein said size-graded ceramic particles are selectively distributed so that said coarse to fine gradation range corresponds to said ceramic particle density gradient.

Claim 8

The duplex glass preform according to claim 6 wherein said coarse to fine gradation range is about 200 microns to about 50 microns.

Claim 9

The duplex glass preform according to claim 1 wherein said glass matrix further includes at least one terminal bore therethrough substantially parallel to said peripheral interfacing surface, and wherein said at least one terminal bore has an interfacing surface for glass-to-metal sealing, and further including a ceramic-free zone intermediate said terminal bore interfacing surface and said dispersion zone.

Claim 10

The duplex glass preform according to claim 8 wherein said glass matrix further includes a plurality of conductive metallic particles homogeneously distributed in solid solution therein such that said duplex glass preform is electrically conductive.

Claim 11

The duplex glass preform according to claim 9 wherein said plurality of conductive metallic particles further comprises a plurality of nickel-cobalt-iron particles.

Claim 12

The duplex glass preform according to claim 1 further including a dispersion zone in said glass matrix in opposed relation to said dispersion zone in said at least one end.

Claim 13

A hermetic glass-to-metal sealed package for microcircuit chips, comprising: a duplex glass preform, said duplex glass preform further comprising a glass matrix having a peripheral interfacing surface and at least one terminal bore therethrough substantially parallel to said peripheral interfacing surface, said terminal bore having an interfacing surface, a dispersion zone in at least one end of said glass matrix, said dispersion extending inwardly from a surface of said at least one end into said glass matrix for a predetermined depth, a first substantially ceramic-free zone intermediate said dispersion zone and said peripheral interfacing surface, a second substantially ceramic-free zone intermediate said dispersion zone and said terminal bore interfacing surface, and a plurality of ceramic particles selectively distributed in said dispersion zone of said glass matrix to form a ceramic particle density gradient therein, and wherein said ceramic particle density gradient has a maximum value at said surface and gradually decreases to a zero value at said predetermined depth; a terminal pin correspondingly disposed in said at least one terminal bore and hermetically sealed thereto; and a body having at least one aperture therein adapted to receive said duplex glass preform, and wherein said duplex glass preform is hermetically sealed in said body.

Claim 14

A hermetic glass-to-metal sealed package for microcircuit chips, comprising: a duplex glass preform, said duplex glass preform further comprising a glass matrix having a peripheral interfacing surface and at least one terminal bore therethrough substantially parallel to said peripheral interfacing surface, said terminal bore having an interfacing surface, a dispersion zone in at least one end of said glass matrix, said dispersion extending inwardly from a surface of said at least one end into said glass matrix for a predetermined depth, a first substantially ceramic-free zone intermediate said dispersion zone and said peripheral interfacing surface, a second substantially ceramic-free zone intermediate said dispersion zone and said terminal bore interfacing surface, and a plurality of ceramic particles selectively distributed in said dispersion zone of said glass matrix to form a ceramic particle density gradient therein, and wherein said ceramic particle density gradient has a maximum value at said surface and gradually decreases to a zero value at said predetermined depth; a terminal pin correspondingly disposed in said at least one terminal bore and hermetically sealed thereto; and a body having at least one aperture therein adapted to receive said duplex glass preform, and wherein said duplex glass preform is hermetically sealed in said body.

Claim 15

The hermetic package according to claim 12 wherein said glass matrix further comprises a hard glass matrix.

Claim 16

The hermetic package according to claim 12 wherein said plurality of ceramic particles further comprises a plurality of alumina particles.

Claim 17

The hermetic package according to claim 12 wherein said terminal pin and said body is an alloy selected from a group of iron-nickel-cobalt and nickel-iron alloys.

Claim 18

The hermetic package according to claim 15 wherein said terminal pin is plated with nickel and further plated with a metal selected from a group noble metals, plating being done in such manner that a surface on said terminal pin corresponding to said terminal bore interfacing surface remains unplated.

Claim 19

The hermetic package according to claim 12 wherein said glass matrix further includes a plurality of conductive metallic particles homogeneously distributed in solid solution therein such that said duplex glass preform acts as an electrically conductive pathway between said terminal pin and said body.

Claim 20

The hermetic package according to claim 17 wherein said terminal pin and exposed surfaces of said glass matrix are plated with nickel and further plated with a metal selected from the nobel metal group.

Claim 21

The hermetic package according to claim 12 further including a dispersion zone in said glass matrix in opposed relation to said dispersion zone in said at least one end.

Claim 22

The hermetic package according to claim 12 wherein said plurality of ceramic particles further comprises a plurality of size-graded ceramic particles having a gradation range of coarse to fine, and wherein said size-graded ceramic particles are selectively distributed so that said coarse to fine gradation range corresponds to said ceramic particle density gradient.