Claims Analysis
Total Claims: 50
Claim 1
Independent Claim
211 words
An improved method of forming a photoconductive member, comprising: providing a substrate; providing a source of microwave energy; providing an enclosed reaction vessel; operatively disposing said substrate in said vessel; coupling microwave energy from said source into the interior of said vessel; introducing into said vessel at least one reaction gas, said reaction gas including at least one semiconductor element to be deposited; energizing said source of microwave energy to generate a plasma in said vessel and to deposit semiconductor alloy material from said reaction gas onto said substrate; evacuating said vessel to an operating pressure about an order of magnitude below conventional RF deposition pressure; depositing a bottom blocking layer onto said substrate by adding at least one dopant to said reaction gas; depositing a substantially intrinsic, amorphous photoconductive layer onto said blocking layer said photoconductive layer having a first density of defect states; changing at least one deposition parameter so as to deposit an enhancement layer atop said photoconductive layer, said enhancement layer having a second density of defect states less than said first density of defect states; and depositing a hard top stabilizing layer atop said enhancement layer, said hard top stabilizing layer formed from a reaction gas which includes at least one of carbon, nitrogen or oxygen.
Claim 2
Dependent Claim
211 words
An improved method of forming a photoconductive member, comprising: providing a substrate; providing a source of microwave energy; providing an enclosed reaction vessel; operatively disposing said substrate in said vessel; coupling microwave energy from said source into the interior of said vessel; introducing into said vessel at least one reaction gas, said reaction gas including at least one semiconductor element to be deposited; energizing said source of microwave energy to generate a plasma in said vessel and to deposit semiconductor alloy material from said reaction gas onto said substrate; evacuating said vessel to an operating pressure about an order of magnitude below conventional RF deposition pressure; depositing a bottom blocking layer onto said substrate by adding at least one dopant to said reaction gas; depositing a substantially intrinsic, amorphous photoconductive layer onto said blocking layer said photoconductive layer having a first density of defect states; changing at least one deposition parameter so as to deposit an enhancement layer atop said photoconductive layer, said enhancement layer having a second density of defect states less than said first density of defect states; and depositing a hard top stabilizing layer atop said enhancement layer, said hard top stabilizing layer formed from a reaction gas which includes at least one of carbon, nitrogen or oxygen.
Claim 3
Dependent Claim
15 words
The method as defined in claim 1 wherein said reaction gas contains at least silicon.
Claim 4
Dependent Claim
15 words
The method as defined in claim 1 wherein said reaction gas contains at least hydrogen.
Claim 5
Dependent Claim
16 words
The method as defined in claim 3 wherein said reaction gas further contains at least fluorine.
Claim 6
Dependent Claim
15 words
The method as defined in claim 1 wherein said reaction gas contains at least fluorine.
Claim 7
Dependent Claim
18 words
The method as defined in claim 1 including depositing said bottom blocking layer by adding a p-type dopant.
Claim 8
Dependent Claim
24 words
The method as defined in claim 6 including depositing said bottom blocking layer from a reaction gas mixture including silicon, fluorine, hydrogen and boron.
Claim 9
Dependent Claim
42 words
The method as defined in claim 7 including depositing about 200 to 2000 Angstroms of said bottom blocking layer onto said substrate from a reaction gas mixture of SiH 4 , SiF 4 , B 2 H 6 and H 2 .
Claim 10
Dependent Claim
23 words
The method as defined in claim 6 including depositing said bottom blocking layer from a reaction gas mixture including silicon, hydrogen and boron.
Claim 11
Dependent Claim
39 words
The method as defined in claim 9 including depositing about 200 to 2000 Angstroms of said bottom blocking layer onto said substrate from a reaction gas mixture of SiH 4 , B 2 H 6 and H 2 .
Claim 12
Dependent Claim
29 words
The method as defined in claim 1 including depositing said bottom blocking layer with an effective power density in the range of 0.1 to 1.0 watts per cubic centimeter.
Claim 13
Dependent Claim
33 words
The method as defined in claim 1 including depositing said bottom blocking layer at a deposition rate of at least 100 Angstroms per second at an operating pressure of less than 0.1 Torr.
Claim 14
Dependent Claim
25 words
The method as defined in claim 1 including depositing said photoconductive layer from a reaction gas mixture including silicon, fluorine, hydrogen and a p-type dopant.
Claim 15
Dependent Claim
38 words
The method as defined in claim 13 including depositing about 10 to 25 microns of said photoconductive layer from a reaction gas mixture of SiH 4 , SiF 4 , B 2 H 6 and H 2 .
Claim 16
Dependent Claim
24 words
The method as defined in claim 1 including depositing said photoconductive layer from a reaction gas mixture including silicon, hydrogen and a p-type dopant.
Claim 17
Dependent Claim
35 words
The method as defined in claim 15 including depositing about 10 to 25 microns of said photoconductive layer from a reaction gas mixture of SiH 4 , B 2 H 6 and H 2 .
Claim 18
Dependent Claim
28 words
The method as defined in claim 1 including depositing said photoconductive layer with an effective power density in the range of 0.1 to 1.0 watts per cubic centimeter.
Claim 19
Dependent Claim
32 words
The method as defined in claim 1 including depositing said photoconductive layer at a deposition rate of at least 100 Angstroms per second at an operating pressure of less than 0.1 Torr.
Claim 20
Dependent Claim
18 words
The method as defined in claim 1 including depositing said bottom blocking layer by adding an n-type dopant.
Claim 21
Dependent Claim
24 words
The method as defined in claim 19 including depositing said bottom blocking layer from a reaction gas mixture including silicon, fluorine, hydrogen and phosphorus.
Claim 22
Dependent Claim
40 words
The method as defined in claim 20 including depositing about 200 to 2000 Angstroms of said bottom blocking layer onto said substrate from a reaction gas mixture of SiH 4 , SiF 4 , PH 3 and H 2 .
Claim 23
Dependent Claim
23 words
The method as defined in claim 19 including depositing said bottom blocking layer from a reaction gas mixture including silicon, hydrogen and phosphorus.
Claim 24
Dependent Claim
37 words
The method as defined in claim 22 including depositing about 200 to 2000 Angstroms of said bottom blocking layer onto said substrate from a reaction gas mixture of SiH 4 , PH 3 and H 2 .
Claim 25
Dependent Claim
23 words
The method as defined in claim 1 including depositing said second photoconductive layer from a reaction gas mixture including silicon, fluorine and hydrogen.
Claim 26
Dependent Claim
30 words
The method as defined in claim 24 including depositing about 10 to 25 microns of said photoconductive layer from a reaction gas mixture of SiH 4 and SiF 4 .
Claim 27
Dependent Claim
21 words
The method as defined in claim 1 including depositing said photoconductive layer from a reaction gas mixture including silicon and hydrogen.
Claim 28
Dependent Claim
27 words
The method as defined in claim 26 including depositing about 10 to 25 microns of said photoconductive layer from a reaction gas mixture of SiH 4 .
Claim 29
Dependent Claim
30 words
The method as defined in claim 1 including depositing said stabilizing layer from a reaction gas mixture including silicon, fluorine, hydrogen and at least one of carbon, nitrogen or oxygen.
Claim 30
Dependent Claim
33 words
The method as defined in claim 28 including depositing about 50 to 1000 Angstroms of said stabilizing layer from a reaction gas mixture of SiH 4 , SiF 4 and CH 4 .
Claim 31
Dependent Claim
29 words
The method as defined in claim 1 including depositing said stabilizing layer from a reaction gas mixture including silicon, hydrogen and at least one of carbon, nitrogen or oxygen.
Claim 32
Dependent Claim
30 words
The method as defined in claim 30 including depositing about 200 to 1000 Angstroms of said stabilizing layer from a reaction gas mixture of SiH 4 and CH 4 .
Claim 33
Dependent Claim
27 words
The method as defined in claim 1 including depositing said stabilizing layer with a power density in the range of 0.2 to 1.2 watts per cubic centimeter.
Claim 34
Dependent Claim
23 words
The method as defined in claim 1 including depositing said stabilizing layer at a deposition rate of at least 30 Angstroms per second.
Claim 35
Dependent Claim
22 words
The method as defined in claim 1 including depositing said enhancement layer from a mixture including silicon, hydrogen and a p-type dopant.
Claim 36
Dependent Claim
21 words
The method as defined in claim 34 including depositing said enhancement layer from a mixture including silicon, hydrogen, fluorine and boron.
Claim 37
Dependent Claim
37 words
The method as defined in claim 35 including depositing about a depletion width of said enhancement layer from a reaction gas mixture of SiH 4 , SiF 4 , B 2 H 6 and H 2 .
Claim 38
Dependent Claim
18 words
The method as defined in claim 36 including depositing about 1000 to 4000 Angstroms of said enhancement layer.
Claim 39
Dependent Claim
19 words
The method as defined in claim 1 including depositing said enhancement layer from a mixture including silicon and hydrogen.
Claim 40
Dependent Claim
20 words
The method as defined in claim 1 including depositing said enhancement layer from a mixture including silicon, hydrogen and fluorine.
Claim 41
Dependent Claim
29 words
The method as defined in claim 39 including depositing about a depletion width of said enhancement layer from a reaction gas mixture of SiH 4 and SiF 4 .
Claim 42
Dependent Claim
18 words
The method as defined in claim 1 including depositing about 1000 to 4000 Angstroms of said enhancement layer.
Claim 43
Dependent Claim
17 words
The method as defined in claim 1 including depositing said enhancement layer as a substantially intrinsic layer.
Claim 44
Independent Claim
96 words
A method of manufacturing a photoconductive member utilizing microwave energy, said member comprising an electrically conductive substrate member, a bottom blocking layer on the substrate member, and a photoconductive layer on the bottom blocking layer the improved method including the steps of: utilizing microwave energy to generate a plasma so as to deposit the bottom blocking layer as a positively or negatively doped, polycrystalline layer of semiconductor alloy material upon the substrate member at an operating pressure about an order of magnitude at conventional RF deposition pressure; depositing a photoconductive layer on the bottom blocking layer.
Claim 45
Independent Claim
96 words
A method of manufacturing a photoconductive member utilizing microwave energy, said member comprising an electrically conductive substrate member, a bottom blocking layer on the substrate member, and a photoconductive layer on the bottom blocking layer the improved method including the steps of: utilizing microwave energy to generate a plasma so as to deposit the bottom blocking layer as a positively or negatively doped, polycrystalline layer of semiconductor alloy material upon the substrate member at an operating pressure about an order of magnitude at conventional RF deposition pressure; depositing a photoconductive layer on the bottom blocking layer.
Claim 46
Dependent Claim
40 words
The method as defined in claim 43, including the further step of; utilizing microwave energy to deposit above the photoconductive layer the top stabilizing layer from a reaction gas mixture which includes at least one of oxygen, carbon or nitrogen.
Claim 47
Dependent Claim
85 words
The method as defined in claim 44, wherein the manufacture includes the further steps of; disposing the substrate member in the deposition region of an evacuable deposition chamber; providing a source of microwave energy in operative communication with the deposition region; evacuating the deposition chamber to a pressure less than atmospheric; introducing a semiconductor containing process gas mixture into the deposition region; and energizing the source of microwave energy so as to deposit said bottom blocking layer, said photoconductive layer and said top stabilizing layer.
Claim 48
Dependent Claim
28 words
The method as defined in claim 45, including the further step of utilizing microwave energy to an enhancement layer between the photoconductive layer and the top stabilizing layer.
Claim 49
Dependent Claim
25 words
The method as defined in claim 43, wherein the step of depositing a doped, polycrystalline semiconductor alloy layer comprises depositing a p-doped silicon:hydrogen:fluorine alloy layer.
Claim 50
Dependent Claim
26 words
The method as defined in claim 43, wherein the step of depositing a doped, polycrystalline semiconductor alloy layer comprises depositing an n-doped silicon:hydrogen: fluorine alloy layer.