Semiconductor device mounted in a housing having an increased cutoff frequency

Claim 2

A semiconductor device comprising: a metallic container comprising a bottom surface, a first pair of opposite side walls and a second pair of opposite side walls, said first pair of side walls being perpendicular to said second pair of side walls thereby forming a rectangular frame on said bottom surface, said container enclosing a radio frequency semiconductor circuit having a semiconductor element on said bottom surface; input and output terminals connected to said circuit and penetrating through said first pair of opposite side walls of said container; wherein said bottom surface includes a main space for mounting said radio frequency semiconductor circuit in the middle portion of the rectangular frame with respect to the direction parallel to the first pair of side walls and a supplementary space for mounting elements of a supplementary circuit in the end portions of the rectangular frame positioned to the side of said middle portion thereof; a cap covering said container; and metallic projection means formed inwardly and integral with said second pair of side walls, said projection means extending between said cap and said bottom surface and being disposed within said supplementary space to narrow the cross-section of the container in a direction parallel to said first pair of side walls thereby reducing the effective length of said container to reduce the cutoff wavelength thereof and thus increase the cutoff frequency thereof, wherein at least a portion of said supplementary space is formed to the side of each projection means.

Claim 3

A semiconductor device according to claim 1, wherein a metallic film, for an electrical terminal surrounded by an insulating member, penetrates through said projection means.

Claim 4

A semiconductor device comprising: a plurality of metallic containers, each metallic container comprising a bottom surface, a first pair of opposite side walls and a second pair of opposite side walls, said first pair of side walls being perpendicular to said second pair of side walls thereby forming a rectangular frame on said bottom surface, said container enclosing a radio frequency semiconductor circuit having a semiconductor element on said bottom surface; input and output terminals connected to said circuit and penetrating through said first pair of opposite side walls of each said container; wherein said bottom surface includes a main space for mounting said radio frequency semiconductor circuit in the middle portion of the rectangular frame with respect to the direction parallel to the first pair of side walls and a supplementary space for mounting elements of a supplementary circuit in the end portions of the rectangular frame positioned to the side of said middle portion thereof; a cap covering said each container; and metallic projection means formed inwardly and integral with said second pair of side walls, said projection means extending between said cap and said bottom surface and being disposed within said supplementary space to narrow the cross-section of each container in a direction parallel to said first pair of side walls thereby reducing the effective length of said container to reduce the cutoff wavelength thereof and thus increase the cutoff frequency thereof, wherein at least a portion of said supplementary space is formed to the side of each projection means; wherein said metallic containers are disposed side by side with said side walls having said input and output terminals of adjacent containers facing each other.

Claim 5

A semiconductor device comprising: a plurality of metallic containers, each metallic container comprising a bottom surface, a first pair of opposite side walls and a second pair of opposite side walls, said first pair of side walls being perpendicular to said second pair of side walls thereby forming a rectangular frame on said bottom surface, said container enclosing a radio frequency semiconductor circuit having a semiconductor element on said bottom surface; input and output terminals connected to said circuit and penetrating through said first pair of opposite side walls of each said container; wherein said bottom surface includes a main space for mounting said radio frequency semiconductor circuit in the middle portion of the rectangular frame with respect to the direction parallel to the first pair of side walls and a supplementary space for mounting elements of a supplementary circuit in the end portions of the rectangular frame positioned to the side of said middle portion thereof; a cap covering said each container; and metallic projection means formed inwardly and integral with said second pair of side walls, said projection means extending between said cap and said bottom surface and being disposed within said supplementary space to narrow the cross-section of each container in a direction parallel to said first pair of side walls thereby reducing the effective length of said container to reduce the cutoff wavelength thereof and thus increase the cutoff frequency thereof, wherein at least a portion of said supplementary space is formed to the side of each projection means; wherein said metallic containers are disposed side by side with said side walls having said input and output terminals of adjacent containers facing each other.