Patent US4712535A successfully refreshed from Google Patents.
US4712535A
Expired / Lapsed
US
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Method and apparatus for severing wafers
Assignee: Hitachi Ltd
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Filing: 1986-06-04
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Granted: 1987-12-15
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Expires: 2006-06-04
Abstract
Abstract A method and an apparatus for severing a workpiece into wafer slices, wherein the inclined surface to be cut can be processed to remove protrusions or impressions which occur around the cut surface. The workpiece has a front end portion which is cut by a cutting tool and a rear end portion which is inclined with respect to the central position of the surface of the workpiece to be cut. This central position is the center of rotation about which the workpiece is rotated to generate a cone shape. When the workpiece is fed axially for cutting to obtain wafers, the central position of the workpiece surface to be cut is held at a constant position so that the workpiece can be cut continuously at a constant angle of inclination. The front end portion of the wafer being cut is rotated while being pulled in a direction from the workpiece until the completion of the severing operation. Then, when the severing has been completed, the process wafer is rotated and pressed toward the workpiece so that protrusions, impressions or grooves can be removed from around the central portion of the cut end portion.
Inventors
- 👤 Masayasu Fujisawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 20:12
CPC Classifications
B; B28; B28D; B28D5/00; B28D5/0058; B28D5/02; B28D5/022; B28D5/028; Y; Y10; Y10T; Y10T82/00; Y10T82/16; Y10T82/16426; Y10T82/16442
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
168 words
A method of severing an end portion of an ingot into wafers and the like by means of a cutting tool, comprising the steps of holding a front end portion of the ingot, cutting the end portion of the ingot until a portion remains between a cut end surface from which a wafer is formed and the remainder of the ingot, controlling the stress applied to a remaining portion between the cut end surface of the ingot from which a wafer is formed and the remainder of the ingot just before severing the cut end surface so as to pull the wafer at a right angle relative to the plane of the cut end surface, severing the remaining portion between the ingot and the cut end surface to form the wafer, moving the cut surface of the separated wafer toward the remainder of the ingot while rotating the wafer, and pressing the wafer against the cutting tool to remove any undesired remaining material caused by the severing operation.
Claim 2
Independent Claim
168 words
A method of severing an end portion of an ingot into wafers and the like by means of a cutting tool, comprising the steps of holding a front end portion of the ingot, cutting the end portion of the ingot until a portion remains between a cut end surface from which a wafer is formed and the remainder of the ingot, controlling the stress applied to a remaining portion between the cut end surface of the ingot from which a wafer is formed and the remainder of the ingot just before severing the cut end surface so as to pull the wafer at a right angle relative to the plane of the cut end surface, severing the remaining portion between the ingot and the cut end surface to form the wafer, moving the cut surface of the separated wafer toward the remainder of the ingot while rotating the wafer, and pressing the wafer against the cutting tool to remove any undesired remaining material caused by the severing operation.
Claim 3
Independent Claim
114 words
A method of severing an end portion of an ingot into wafers and the like by means of a cutting tool, comprising the steps of holding the ingot at a predetermined angle of inclination to an axis perpendicular to a plane along which severing takes place, reciprocating the cutting tool along the severing plane, rotating the ingot about the axis from a central point at around the severing plane to generate a conical surface whose apex is at the central point, holding a front end portion of the ingot which is to be severed into a wafer, and severing the rotating ingot at the predetermined angle of inclination by means of the cutting tool.
Claim 4
Independent Claim
114 words
A method of severing an end portion of an ingot into wafers and the like by means of a cutting tool, comprising the steps of holding the ingot at a predetermined angle of inclination to an axis perpendicular to a plane along which severing takes place, reciprocating the cutting tool along the severing plane, rotating the ingot about the axis from a central point at around the severing plane to generate a conical surface whose apex is at the central point, holding a front end portion of the ingot which is to be severed into a wafer, and severing the rotating ingot at the predetermined angle of inclination by means of the cutting tool.
Claim 5
Independent Claim
171 words
A method of severing an end portion of an ingot into wafers and the like, comprising the steps of holding the ingot at a predetermined angle of inclination to an axis perpendicular to a plane along which severing takes place, reciprocating the cutting tool along the severing plane, rotating the ingot about the axis from a central point at around the severing plane to generate a conical surface, holding a front end portion of the ingot to be severed into a wafer, severing with the cutting tool the rotating ingot at the predetermined angle of inclination until a portion remains between the ingot and the front end portion, controlling the stress applied to the remaining portion so as to pull the wafer away from the ingot in a direction perpendicular to the severing plane, severing the remaining portion while the front end portion is rotated, and pressing the wafer toward the ingot and against the cutting tool to remove any undesired material remaining on the wafer caused by the severing operation.
Claim 6
Independent Claim
171 words
A method of severing an end portion of an ingot into wafers and the like, comprising the steps of holding the ingot at a predetermined angle of inclination to an axis perpendicular to a plane along which severing takes place, reciprocating the cutting tool along the severing plane, rotating the ingot about the axis from a central point at around the severing plane to generate a conical surface, holding a front end portion of the ingot to be severed into a wafer, severing with the cutting tool the rotating ingot at the predetermined angle of inclination until a portion remains between the ingot and the front end portion, controlling the stress applied to the remaining portion so as to pull the wafer away from the ingot in a direction perpendicular to the severing plane, severing the remaining portion while the front end portion is rotated, and pressing the wafer toward the ingot and against the cutting tool to remove any undesired material remaining on the wafer caused by the severing operation.
Claim 7
Dependent Claim
21 words
A method of severing according to claim 1 or claim 2, wherein the cutting tool rotatingly reciprocates in the same plane.
Claim 8
Independent Claim
149 words
An apparatus for severing ingots into wafers and the like, comprising means for rotating an ingot, means for feeding the ingot in an axial direction, cutting tool means, means for rotating the cutting tool means about an axis parallel the rotational axis of the ingot rotating means, means for feeding the ingot and the cutting tool means, wherein the ingot feeding means has an axis perpendicular to a rotational axis of the cutting tool rotating means, means for supporting a front end portion of the ingot such that the ingot is inclined with respect to the rotational axis of the ingot rotating means, means for rotating the supporting means about a central point of a cut surface of the ingot, and means for axially moving the front end portion away from and toward the ingot which is rotated and cut at an angle of inclination to its own axis.
Claim 9
Independent Claim
149 words
An apparatus for severing ingots into wafers and the like, comprising means for rotating an ingot, means for feeding the ingot in an axial direction, cutting tool means, means for rotating the cutting tool means about an axis parallel the rotational axis of the ingot rotating means, means for feeding the ingot and the cutting tool means, wherein the ingot feeding means has an axis perpendicular to a rotational axis of the cutting tool rotating means, means for supporting a front end portion of the ingot such that the ingot is inclined with respect to the rotational axis of the ingot rotating means, means for rotating the supporting means about a central point of a cut surface of the ingot, and means for axially moving the front end portion away from and toward the ingot which is rotated and cut at an angle of inclination to its own axis.
Claim 10
Dependent Claim
44 words
An apparatus according to claim 5, wherein means is provided for controlling stress applied to an uncut portion remaining between the ingot and the front end portion by pulling the front end portion at an angle relative to the plane of the cut surface.
Claim 11
Dependent Claim
36 words
An apparatus according to claim 6, wherein means is provided for pressing the front end portion, after separation from the ingot, toward the ingot and against the cutting tool means while rotating the front end portion.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-12-14 | 1991-06-15 | 1991-12-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-12-14 | 1995-06-15 | 1995-12-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-12-14 | 1999-06-15 | 1999-12-15 | $7700.00 | Window Closed / Lapsed |