Method for densifying leadframe conductor spacing

Claim 1

The method of fabricating a lead frame assembly, having bifurcated conductors with outer lead end regions of first thickness joined to a common tie-bar and inner lead end regions extending inwardly at a second thickness less than the first thickness to the assembly center portion, from a precut metal foil workpiece having first and second major surfaces spaced apart at a workpiece thickness, comprising the steps of: applying a first step hardened photoresist pattern to the first and second major surfaces of the workpiece to expose on the first major surface a first area corresponding in size to the sum area of the center portion, the conductor inner end regions, and the gaps between inner end regions of adjacent conductors, and to expose on the second major surface a first area corresponding to the sum area only of the center portion and to said inner end region gaps; first step etching both major surfaces simultaneously to remove approximately one-quarter of the workpiece thickness from each exposed area; removing said first step photoresist pattern and applying a second step hardened photoresist pattern to again expose said first area of the first major surface and to expose a second area of the first major surface corresponding in size to the area of the gaps between outer end regions of adjacent conductors, and to expose on the second major surface a second area likewise corresponding in size to the area of said outer end region gaps, in register with said second area of the first major surface; and second step etching both major surfaces simultaneously to remove one-half the workpiece material thickness from said exposed areas on each major surface, to provide the bifurcated conductor leadframe assembly.

Claim 2

The method of fabricating a lead frame assembly, having bifurcated conductors with outer lead end regions of first thickness joined to a common tie-bar and inner lead end regions extending inwardly at a second thickness less than the first thickness to the assembly center portion, from a precut metal foil workpiece having first and second major surfaces spaced apart at a workpiece thickness, comprising the steps of: applying a first step hardened photoresist pattern to the first and second major surfaces of the workpiece to expose on the first major surface a first area corresponding in size to the sum area of the center portion, the conductor inner end regions, and the gaps between inner end regions of adjacent conductors, and to expose on the second major surface a first area corresponding to the sum area only of the center portion and to said inner end region gaps; first step etching both major surfaces simultaneously to remove approximately one-quarter of the workpiece thickness from each exposed area; removing said first step photoresist pattern and applying a second step hardened photoresist pattern to again expose said first area of the first major surface and to expose a second area of the first major surface corresponding in size to the area of the gaps between outer end regions of adjacent conductors, and to expose on the second major surface a second area likewise corresponding in size to the area of said outer end region gaps, in register with said second area of the first major surface; and second step etching both major surfaces simultaneously to remove one-half the workpiece material thickness from said exposed areas on each major surface, to provide the bifurcated conductor leadframe assembly.