Heat activatable adhesive or sealant compositions
Abstract
Abstract A heat activatable adhesive or sealant organic resin composition comprising (1) a liquid, ethylenically unsaturated monomer, oligomer or prepolymer of the formula: <IMAGE> wherein R is H or CH3, R1 is an organic moiety and n is at least 2, (2) a thermal initiator selected from the group consisting of substituted or unsubstituted pinacols, azo compounds, thiurams, organic peroxides and mixtures thereof, and (3) a thermoplastic adhesive material selected from the group consisting of polyesters, polyvinyl acetals, polyamides, butadiene-acrylonitrile copolymers, styrene-butadiene copolymers, styrene-isoprene copolymers, styrene-ethylene-butylene copolymers, ethylene-vinyl acetate copolymers, ethylene-ethyl acrylate copolymers, ethylene propylene diene monomer and mixtures thereof. The composition after application to the parts to be bonded or sealed forms a thermoset bond or seal on application of heat thereto, preferably by electromagnetic techniques including dielectric and induction heating.
Inventors
- 👤 Bahram Siadat
- 👤 Charles R. Morgan
Bibliographic Details
Claims Analysis
Total Claims: 5References Cited (Backward Citations)
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| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1990-11-30 | 1991-06-01 | 1991-12-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-11-30 | 1995-06-01 | 1995-12-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-11-30 | 1999-06-01 | 1999-12-01 | $7700.00 | Window Closed / Lapsed |