Metallized polymers

Claim 2

A process for the deposition of metal layers onto at least one polymeric surface having electroactive sites therein comprising contacting said at least one polymeric surface with a first solution wherein at least 10 molar percent of all negative charge intercalation ions within said first solution are selected from the group consisting of monoatomic ions and complexed transition metals as negative charge intercalation ions and wherein the half-wave potential of said at least 10 molar percent of said negative charge intercalation ions is negative with respect to the half-wave potential of the electroactive sites in said polymer surface, thereby reducing the polymer of said at least one polymeric surface without substantial plating of metal onto said at least one polymeric surface, then contacting said at least one surface of the reduced polymer with a second solution having reducible metal cations therein so that the reduced polymer of said at least one polymeric surface reduces the metallic ion to form metal in a form selected from the group consisting of metal film on said at least one polymer surface and metal particles within said at least one polymer surface.

Claim 3

The process of claim 1 wherein said monatomic ions and transition metal complexes as negative charge intercalation ions comprise at least 60 molar percent of all negative charge intercalation ions in said first solution.

Claim 4

The process of claim 1 wherein said monoatomic ions and transition metal complexes as negative charge intercalation ions comprise at least 90 molar percent of all negative charge intercalation ions in said first solution.

Claim 5

The process of claim 1 wherein said monatomic ions and transition metal complexes as negative charge intercalation ions comprise 100 molar percent of the negative charge intercalation ions in said first solution and said first solution is free of Zintl complexes and Zintl anions.

Claim 6

The process of claim 1 wherein said ions are selected from Te 2- ions, and Co(I) and V(II) complexes.

Claim 7

The process of claim 2 wherein said ions are selected from Te 2- ions, and Co(I) and V(II) complexes.

Claim 8

The process of claim 3 wherein said ions are selected from Co(I) and V(II) complexes.

Claim 9

The process of claim 4 wherein said ions are selected from Te 2- ions, and Co(I) and V(II) complexes.

Claim 10

The process of claim 1 wherein metal particles are deposited within the polymer of said at least one polymeric surface.

Claim 11

The process of claim 9 wherein at least some of said metal particles are deposited at a depth greater than 1 micron.

Claim 12

The process of claim 4 wherein metal particles are deposited within the polymer of said at least one polymeric surface.

Claim 13

The process of claim 11 wherein at least some of said metal particles are deposited at a depth greater than 1 micron.

Claim 14

The process of claim 5 wherein metal particles are deposited within the polymer of said at least one polymeric surface.

Claim 15

The process of claim 8 wherein metal particles are deposited within the polymer of said at least one polymeric surface.

Claim 16

The process of claim 14 wherein at least some of said metal particles are deposited at a depth greater than 1 micron.

Claim 17

The process of claim 1 wherein said polymer of said at least one polymeric surface contains imide electroactive sites.

Claim 18

The process of claim 4 wherein said polymer of said at least one polymeric surface contains pyromellitimide electroactive sites.

Claim 19

The process of claim 15 wherein said polymer of said at least one polymeric surface contains pyromellitimide electroactive sites.

Claim 20

The process of claim 1 wherein said polymer of said at least one polymeric surface contains pyromellitimide electroactive sites.

Claim 21

The process of claim 1 wherein said polymer of said at least one polymeric surface comprises polyimide.

Claim 22

The process of claim 15 wherein said polymer of said at least one polymeric surface comprises polyimide.

Claim 23

The process of claim 1 wherein after at least 25% of the reduced polymer is oxidized by the metallic ion to form metal, a second metallization process is begun.

Claim 24

The process of claim 1 wherein after at least 50% of the reduced polymer is oxidized by the metallic ion to form metal, a second metallization process is begun.

Claim 25

The process of claim 1 wherein after at least 90% of the reduced polymer is oxidized by the metallic ion to form metal, a second metallization process is begun.

Claim 26

The process of claim 1 wherein after substantially all of the reduced polymer is oxidized by the metallic ion to form metal, a second metallization process is begun.

Claim 27

The process of claim 5 wherein after at least 25% of the reduced polymer is oxidized by the metallic ion to form metal, a second metallization process is begun.

Claim 28

The process of claim 8 wherein after substantially all of the reduced polymer is oxidized by the metallic ion to form metal, a second metallization process is begun.

Claim 29

The process of claim 10 wherein after at least 25% of the reduced polymer is oxidized by the metallic ion to form metal, a second metallization process is begun.

Claim 30

The process of claim 11 wherein after at least 90% of the reduced polymer is oxidized by the metallic ion to form metal, a second metallization process is begun.

Claim 31

The process of claim 15 wherein after substantially all of the reduced polymer is oxidized by the metallic ion to form metal, a second metallization process is begun.

Claim 32

The process of claim 16 wherein after at least 25% of the reduced polymer is oxidized by the metallic ion to form metal, a second metallization process is begun.

Claim 33

The process of claim 17 wherein after at least 25% of the reduced polymer is oxidized by the metallic ion to form metal, a second metallization process is begun.

Claim 34

The process of claim 18 wherein after at least 25% of the reduced polymer is oxidized by the metallic ion to form metal, a second metallization process is begun.

Claim 35

The process of claim 16 wherein after at least 90% of the reduced polymer is oxidized by the metallic ion to form metal, a second metallization process is begun.

Claim 36

The process of claim 18 wherein after at least 90% of the reduced polymer is oxidized by the metallic ion to form metal, a second metallization process is begun.

Claim 37

The process of claim 16 wherein after substantially all of the reduced polymer is oxidized by the metallic ion to form metal, a second metallization process is begun.

Claim 38

The process of claim 18 wherein after substantially all of the reduced polymer is oxidized by the metallic ion to form metal, a second metallization process is begun.

Claim 39

A process for the deposition of metal layers onto at least one polymeric surface having electroactive sites therein comprising contacting said at least one polymeric surface with a first solution wherein at least 10 molar percent of all negative charge intercalation ions within said first solution are selected from the group consisting of monoatomic ions and complexed transition metals as negative charge intercalation ions and wherein the half-wave potential of said at least 10 molar percent of said negative charge intercalation ions is negative with respect to the half-wave potential of the polymer in said polymer surface, thereby reducing the polymer of said at least one polymeric surface without substantial plating of metal onto said at least one polymeric surface, then contacting said at least one surface of the reduced polymer with a second solution having reducible metal cations therein so that the reduced polymer of said at least one polymeric surface reduces the metallic ion to form metal in a form selected from the group consisting of metal film on said at least one polymer surface and metal particles within said at least one polymer surface, said at least 10 molar percent of said negative charge intercalation ions being exclusive of Zintl complexes and Zintl anions.

Claim 40

A process for the deposition of metal layers onto at least one polymeric surface having electroactive sites therein comprising contacting said at least one polymeric surface with a first solution wherein at least 10 molar percent of all negative charge intercalation ions within said first solution are selected from the group consisting of monoatomic ions and complexed transition metals as negative charge intercalation ions and wherein the half-wave potential of said at least 10 molar percent of said negative charge intercalation ions is negative with respect to the half-wave potential of the polymer in said polymer surface, thereby reducing the polymer of said at least one polymeric surface without substantial plating of metal onto said at least one polymeric surface, then contacting said at least one surface of the reduced polymer with a second solution having reducible metal cations therein so that the reduced polymer of said at least one polymeric surface reduces the metallic ion to form metal in a form selected from the group consisting of metal film on said at least one polymer surface and metal particles within said at least one polymer surface, said at least 10 molar percent of said negative charge intercalation ions being exclusive of Zintl complexes and Zintl anions.

Claim 41

A process for the deposition of meta layers onto at least one polymeric surface hasving electroactive sites therein comprising contacting said at least one polymeric surface with a first ionic solution wherein the ions are selected from the group consisting of Co(I) and V(II) complexes, thereby reducing the polymer of said at least one polymeric surfaces without substantial plating of metal onto sasid at least one polymeric surace, then contacting said at least one polymeric surface with a second solution having reducible metal cations therein so that the reduced polymer of said at least one polymeric surface reduces the metallic ions tO form metal in a form selected from the group consisting of metal film on said at leat one polymer surface and metal particles within said at least one polymer surface.

Claim 42

A process for the deposition of meta layers onto at least one polymeric surface hasving electroactive sites therein comprising contacting said at least one polymeric surface with a first ionic solution wherein the ions are selected from the group consisting of Co(I) and V(II) complexes, thereby reducing the polymer of said at least one polymeric surfaces without substantial plating of metal onto sasid at least one polymeric surace, then contacting said at least one polymeric surface with a second solution having reducible metal cations therein so that the reduced polymer of said at least one polymeric surface reduces the metallic ions tO form metal in a form selected from the group consisting of metal film on said at leat one polymer surface and metal particles within said at least one polymer surface.