US4459330A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electroless metal plating of plastics
Assignee: United States Department of Energy
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Filing: 1982-09-20
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Granted: 1984-07-10
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Expires: 2002-09-20
Abstract
Abstract Process for plating main group metals on aromatic polymers is carried out by the use of a nonaqueous solution of a salt of an alkali metal in a positive valence state and a main group metal in a negative valence state with contact between the solution and polymer providing a redox reaction causing the deposition of the main group metal and the reduction of the polymer. Products from the process exhibit useful decorative and electrical properties.
Inventors
- 👤 Lawrence J. Krause
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 08:30
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/31; H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/032; H05K1/0333; H05K1/0346; H05K3/00; H05K3/10; H05K3/18; H05K3/181
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
157 words
An electroless plating process for plating at least one main group metal on a surface of a polymeric substrate comprising the steps of forming a nonaqueous solution containing a metallic salt of an alkali metal in a positive valence state and at least one main group metal in a negative valence state, the main group metal being selected from the group consisting of Ge, Sn, Pb, As, Sb, Bi, Si and Te, selecting an aromatic polymeric substrate reducible by the solubilized salt and resistant to degration during the reaction, and carrying out a redox reaction between the salt in solution and the substrate by contacting the solution with the substrate for a sufficient time to oxidize and deposit the main group metal in elemental form to produce a plated substrate, the alkali metal being retained in the plated substrate with the substrate being negatively charged with electrons transferred from the main group metal during the redox reaction.
Claim 2
Dependent Claim
157 words
An electroless plating process for plating at least one main group metal on a surface of a polymeric substrate comprising the steps of forming a nonaqueous solution containing a metallic salt of an alkali metal in a positive valence state and at least one main group metal in a negative valence state, the main group metal being selected from the group consisting of Ge, Sn, Pb, As, Sb, Bi, Si and Te, selecting an aromatic polymeric substrate reducible by the solubilized salt and resistant to degration during the reaction, and carrying out a redox reaction between the salt in solution and the substrate by contacting the solution with the substrate for a sufficient time to oxidize and deposit the main group metal in elemental form to produce a plated substrate, the alkali metal being retained in the plated substrate with the substrate being negatively charged with electrons transferred from the main group metal during the redox reaction.
Claim 3
Dependent Claim
13 words
The process of claim 1 wherein the solution contains a nonaqueous polar solvent.
Claim 4
Dependent Claim
15 words
The process of claim 2 wherein the solvent is ethylenediamine, dimethylformamide, ammonia, or mixtures thereof.
Claim 5
Dependent Claim
17 words
The process of claim 2 wherein the polymeric substrate contains electron withdrawing groups adjacent to aromatic groups.
Claim 6
Dependent Claim
22 words
The process of claim 2 wherein the polymer substrate is composed of an aromatic polyimide, polysulfone or copolymer of styrene and vinylpyridine.
Claim 7
Dependent Claim
11 words
The process of claim 5 wherein the polymer is a polyimide.
Claim 8
Dependent Claim
25 words
The process of claim 5 wherein the redox reaction is carried out in an inert atmosphere and at temperatures in the range of 0°-50° C.
Claim 9
Dependent Claim
91 words
An electroless plating process for plating a surface of a polymeric substrate comprising the steps of forming a solution containing a metallic cluster of potassium in a positive valence state and tin in a negative valence state in an ethylenediamine solvent, contacting the solution with an aromatic polyimide substrate under an inert atmosphere at a temperature in the range of 20°-30° C. for about 10-100 seconds to oxidize and deposit the tin in elemental form to produce a plated polyimide substrate, and removing the plated substrate from contact with the solution.
Claim 10
Dependent Claim
91 words
An electroless plating process for plating a surface of a polymeric substrate comprising the steps of forming a solution containing a metallic cluster of potassium in a positive valence state and tin in a negative valence state in an ethylenediamine solvent, contacting the solution with an aromatic polyimide substrate under an inert atmosphere at a temperature in the range of 20°-30° C. for about 10-100 seconds to oxidize and deposit the tin in elemental form to produce a plated polyimide substrate, and removing the plated substrate from contact with the solution.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-07-10 | 1988-01-09 | 1988-07-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-07-10 | 1992-01-09 | 1992-07-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-07-10 | 1996-01-09 | 1996-07-10 | $7700.00 | Window Closed / Lapsed |