US3736170A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for improved adhesion of electroless copper to a polyimide surface
Assignee: International Business Machines Corp
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Filing: 1971-06-28
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Granted: 1973-05-29
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Expires: 1991-06-28
Abstract
Abstract A POLYIMIDE SURFACE IS PREPARED FOR METAL PLATING BY IMMERSION IN A QUATERNARY AMMONIUM HYDROXIDE COMPOUND SOLUTION SUCH AS, BENZYL TRIMETHYL AMMONIUM HYDROXIDE, TETRAMETHYL AMMONIUM HYDROXIDE, TETRAETHYL AMMONIUM HYDROXIDE AND THE LIKE THE RESULTANT HYDROLYED SULFACE IS ACTIVATED BY IMMERSION IN A SOLUTION OF HIGH FLUORIDE ION CONCENTRATION SUCH AS, KF, NAF, OR HF AND THEREAFTER IMMERSED IN AN ELECTROLESS DEPOSITION BATH FOR METAL PLATING THEREON. THE RESULTANT METAL FILM IS FOUND TO BE STRONGLY BONDED TO THE POLYIMIDE SURFACE.
Inventors
- 👤 J Lo
- 👤 M Orinik
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 16:04
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/20; C23C18/22
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-05-28 | 1976-11-27 | 1977-05-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-05-28 | 1980-11-27 | 1981-05-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-05-28 | 1984-11-27 | 1985-05-29 | $7700.00 | Window Closed / Lapsed |