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High temperature hetero-epitaxial pressure sensor

Assignee: Honeywell Inc
•
Filing: 1986-08-01
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Granted: 1987-11-10
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Expires: 2006-08-01
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Abstract

Abstract A high-temperature hetero-epitaxial piezo-resistive pressure sensor in which an epitaxial layer of a wide-bandgap semiconductor such as GaAs is grown onto a silicon wafer and the piezoresistors are implanted into the wide-bandgap layer.

Inventors

  • 👤 Obert N. Tufte

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-02 15:36
CPC Classifications
G; G01; G01L; G01L9/00; G01L9/0041; G01L9/0051; G01L9/0052; G01L9/0055

Claims Analysis

Total Claims: 12
Claim 1
Independent Claim 85 words
A high temperature hetero-epitaxial piezoresistive pressure sensor comprising: a single crystal silicon substrate, the silicon having a bandgap of about 1 eV; a thin-film epitaxial single crystal layer comprised of a wider bandgap semiconductor than said silicon substrate epitaxially grown on said silicon substrate, said semiconductor also being of a type having large piezoresistive effects; diffused or ion implanted piezoresistive resistors in said wider bandgap semiconductor layer; and, a cup like depression in said substrate forming a diaphragm at the location of said piezoresistive resistors.
Claim 2
Dependent Claim 85 words
A high temperature hetero-epitaxial piezoresistive pressure sensor comprising: a single crystal silicon substrate, the silicon having a bandgap of about 1 eV; a thin-film epitaxial single crystal layer comprised of a wider bandgap semiconductor than said silicon substrate epitaxially grown on said silicon substrate, said semiconductor also being of a type having large piezoresistive effects; diffused or ion implanted piezoresistive resistors in said wider bandgap semiconductor layer; and, a cup like depression in said substrate forming a diaphragm at the location of said piezoresistive resistors.
Claim 3
Dependent Claim 13 words
The sensor according to claim 1 in which the epitaxial layer is GaAs.
Claim 4
Dependent Claim 21 words
The sensor according to claim 2 in which the piezoresistive resistors are p-type and the epitaxial layer is semi-insulating or n-type.
Claim 5
Dependent Claim 19 words
The sensor according to claim 1 in which the epitaxial layer is Al x Ga 1-x As where 0<x≦1.
Claim 6
Dependent Claim 14 words
The sensor according to claim 4 in which the x>0.5 piezoresistive resistors are p-type.
Claim 7
Dependent Claim 15 words
The sensor according to claim 4 in which x>0.5 and the piezoresistive resistors are n-type.
Claim 8
Dependent Claim 36 words
The sensor according to claim 2 in which the GaAs layer is about 2 microns in thickness and in which the piezoresistive means are implanted into the GaAs layer to a depth of about 1 micron.
Claim 9
Dependent Claim 35 words
The sensor according to claim 1 in which the wider bandgap semiconductor layer is about 2 microns in thickness and into which the piezoresistive means are ion implanted to a depth of about 1 micron.
Claim 10
Dependent Claim 20 words
The sensor according to claim 1 in which the epitaxial layer has a piezoresistive coefficient >50×10 -12 cm 2 /dyne.
Claim 11
Dependent Claim 85 words
A high-temperature hetero-epitaxial piezoresistive pressure sensor comprising: a single crystal silicon substrate, the silicon having a bandgap of about 1 eV; a thin-film epitaxial single crystal layer of β-SiC having a wider bandgap semiconductor than said silicon substrate epitaxially grown on said silicon substrate, said semiconductor also being of a type having large piezoresistive effects; diffused or ion implanted piezoresistive resistors in said wider bandgap semiconductor layer; and, a cup like depression in said substrate forming a diaphragm at the location of said piezoresistive resistors.
Claim 12
Dependent Claim 85 words
A high-temperature hetero-epitaxial piezoresistive pressure sensor comprising: a single crystal silicon substrate, the silicon having a bandgap of about 1 eV; a thin-film epitaxial single crystal layer of β-SiC having a wider bandgap semiconductor than said silicon substrate epitaxially grown on said silicon substrate, said semiconductor also being of a type having large piezoresistive effects; diffused or ion implanted piezoresistive resistors in said wider bandgap semiconductor layer; and, a cup like depression in said substrate forming a diaphragm at the location of said piezoresistive resistors.

References Cited (Backward Citations)

US4003127A Cited
US4054497A Cited
JPS57159067A Cited
US4510671A Cited
US4503709A Cited
JPS6097677A Cited
US4654621A Cited
US4551394A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1990-11-09 1991-05-11 1991-11-10 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1994-11-09 1995-05-11 1995-11-10 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1998-11-09 1999-05-11 1999-11-10 $7700.00 Window Closed / Lapsed

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