US4706100A
Expired / Lapsed
US
⏱️ 0.0 years remaining
High temperature hetero-epitaxial pressure sensor
Assignee: Honeywell Inc
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Filing: 1986-08-01
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Granted: 1987-11-10
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Expires: 2006-08-01
Abstract
Abstract A high-temperature hetero-epitaxial piezo-resistive pressure sensor in which an epitaxial layer of a wide-bandgap semiconductor such as GaAs is grown onto a silicon wafer and the piezoresistors are implanted into the wide-bandgap layer.
Inventors
- 👤 Obert N. Tufte
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 10:26
CPC Classifications
G; G01; G01L; G01L9/00; G01L9/0041; G01L9/0051; G01L9/0052; G01L9/0055
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
85 words
A high temperature hetero-epitaxial piezoresistive pressure sensor comprising: a single crystal silicon substrate, the silicon having a bandgap of about 1 eV; a thin-film epitaxial single crystal layer comprised of a wider bandgap semiconductor than said silicon substrate epitaxially grown on said silicon substrate, said semiconductor also being of a type having large piezoresistive effects; diffused or ion implanted piezoresistive resistors in said wider bandgap semiconductor layer; and, a cup like depression in said substrate forming a diaphragm at the location of said piezoresistive resistors.
Claim 2
Dependent Claim
85 words
A high temperature hetero-epitaxial piezoresistive pressure sensor comprising: a single crystal silicon substrate, the silicon having a bandgap of about 1 eV; a thin-film epitaxial single crystal layer comprised of a wider bandgap semiconductor than said silicon substrate epitaxially grown on said silicon substrate, said semiconductor also being of a type having large piezoresistive effects; diffused or ion implanted piezoresistive resistors in said wider bandgap semiconductor layer; and, a cup like depression in said substrate forming a diaphragm at the location of said piezoresistive resistors.
Claim 3
Dependent Claim
13 words
The sensor according to claim 1 in which the epitaxial layer is GaAs.
Claim 4
Dependent Claim
21 words
The sensor according to claim 2 in which the piezoresistive resistors are p-type and the epitaxial layer is semi-insulating or n-type.
Claim 5
Dependent Claim
19 words
The sensor according to claim 1 in which the epitaxial layer is Al x Ga 1-x As where 0<x≦1.
Claim 6
Dependent Claim
14 words
The sensor according to claim 4 in which the x>0.5 piezoresistive resistors are p-type.
Claim 7
Dependent Claim
15 words
The sensor according to claim 4 in which x>0.5 and the piezoresistive resistors are n-type.
Claim 8
Dependent Claim
36 words
The sensor according to claim 2 in which the GaAs layer is about 2 microns in thickness and in which the piezoresistive means are implanted into the GaAs layer to a depth of about 1 micron.
Claim 9
Dependent Claim
35 words
The sensor according to claim 1 in which the wider bandgap semiconductor layer is about 2 microns in thickness and into which the piezoresistive means are ion implanted to a depth of about 1 micron.
Claim 10
Dependent Claim
20 words
The sensor according to claim 1 in which the epitaxial layer has a piezoresistive coefficient >50×10 -12 cm 2 /dyne.
Claim 11
Dependent Claim
85 words
A high-temperature hetero-epitaxial piezoresistive pressure sensor comprising: a single crystal silicon substrate, the silicon having a bandgap of about 1 eV; a thin-film epitaxial single crystal layer of β-SiC having a wider bandgap semiconductor than said silicon substrate epitaxially grown on said silicon substrate, said semiconductor also being of a type having large piezoresistive effects; diffused or ion implanted piezoresistive resistors in said wider bandgap semiconductor layer; and, a cup like depression in said substrate forming a diaphragm at the location of said piezoresistive resistors.
Claim 12
Dependent Claim
85 words
A high-temperature hetero-epitaxial piezoresistive pressure sensor comprising: a single crystal silicon substrate, the silicon having a bandgap of about 1 eV; a thin-film epitaxial single crystal layer of β-SiC having a wider bandgap semiconductor than said silicon substrate epitaxially grown on said silicon substrate, said semiconductor also being of a type having large piezoresistive effects; diffused or ion implanted piezoresistive resistors in said wider bandgap semiconductor layer; and, a cup like depression in said substrate forming a diaphragm at the location of said piezoresistive resistors.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-11-09 | 1991-05-11 | 1991-11-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-11-09 | 1995-05-11 | 1995-11-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-11-09 | 1999-05-11 | 1999-11-10 | $7700.00 | Window Closed / Lapsed |