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US4704186A Expired / Lapsed US ⏱️ 0.0 years remaining

Recessed oxide method for making a silicon-on-insulator substrate

Assignee: RCA Corp
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Filing: 1986-02-19
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Granted: 1987-11-03
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Expires: 2006-02-19
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Abstract

Abstract A plurality of first cavities is formed in the planar surface of a silicon substrate. A first oxide region of predetermined thickness is formed in each of the first cavities such that each of the first oxide regions has a surface which is coplanar with the substrate surface. A layer of monocrystalline silicon is then epitaxially deposited over the planar first oxide region/substrate surface. Second cavities are then formed through the monocrystalline silicon layer and into the substrate adjacent the first oxide regions, extending to a depth equal to approximately one-half that of the first oxide regions. The second cavities are then thermally oxidized so as to form second oxide regions therein, these second oxide regions being coplanar with the first oxide regions. Silicon is next epitaxially deposited on those portions of the monocrystalline silicon layer remaining on the first oxide regions so as to yield a continuous monocrystalline silicon sheet over the first and second oxide regions.

Inventors

  • 👤 Lubomir L. Jastrzebski

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 06:32
CPC Classifications
H; H10; H10P; H10P90/00; H10P90/19; H10P90/1904; H10P90/1906; H10W; H10W10/00; H10W10/01; H10W10/061; H10W10/10; H10W10/181; H10W10/011; H10W10/014; H10W10/17; Y; Y10; Y10S; Y10S117/00; Y10S117/901; Y10S117/902; Y10S148/00; Y10S148/117; Y10S148/159

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 174 words
A method for forming an electrically isolated layer of monocrystalline silicon on a silicon substrate, comprising: (a) providing a silicon substrate having a substantially planar surface; (b) forming a plurality of first cavities in said surface; (c) forming a first oxide region only in each of the first cavities, by thermal oxidation each of the first oxide regions having a surface which is coplanar with the substrate surface; (d) epitaxially depositing a layer of monocrystalline silicon over the planar first oxide region/substrate surface; (e) forming second cavities through the monocrystalline silicon layer and into the substrate adjacent the first oxide regions, to a depth equal to approximately one-half that of the first oxide regions; (f) thermally oxidizing only the second cavities so as to form second oxide regions therein, the second oxide regions being coplanar with the first oxide regions; and (g) epitaxially depositing silicon on those portions of the monocrystalline silicon layer on the first oxide regions so as to form a continuous monocrystalline silicon sheet over the first and second oxide regions.
Claim 2
Independent Claim 174 words
A method for forming an electrically isolated layer of monocrystalline silicon on a silicon substrate, comprising: (a) providing a silicon substrate having a substantially planar surface; (b) forming a plurality of first cavities in said surface; (c) forming a first oxide region only in each of the first cavities, by thermal oxidation each of the first oxide regions having a surface which is coplanar with the substrate surface; (d) epitaxially depositing a layer of monocrystalline silicon over the planar first oxide region/substrate surface; (e) forming second cavities through the monocrystalline silicon layer and into the substrate adjacent the first oxide regions, to a depth equal to approximately one-half that of the first oxide regions; (f) thermally oxidizing only the second cavities so as to form second oxide regions therein, the second oxide regions being coplanar with the first oxide regions; and (g) epitaxially depositing silicon on those portions of the monocrystalline silicon layer on the first oxide regions so as to form a continuous monocrystalline silicon sheet over the first and second oxide regions.
Claim 3
Dependent Claim 49 words
A method in accordance with claim 1 further comprising: forming the first cavities so as to have bottoms parallel to the substrate surface and walls perpendicular to the bottoms; and forming an oxidation barrier layer on the walls of the first cavities prior to forming the first oxide regions.
Claim 4
Dependent Claim 43 words
A method in accordance with claim 2 further comprising: forming an oxidation barrier layer over the walls and bottoms of the first cavities; and anisotropically etching the oxidation barrier layer such that it is selectively removed from the bottoms of the first cavities.
Claim 5
Dependent Claim 49 words
A method in accordance with claim 1 further comprising: forming the second cavities so as to have bottoms parallel to the substrate surface and walls perpendicular to the bottoms; and forming an oxidation barrier layer on the walls of the second cavities prior to forming the second oxide regions.
Claim 6
Dependent Claim 43 words
A method in accordance with claim 2 further comprising: forming an oxidation barrier layer over the walls and bottoms of the second cavities; and anisotropically etching the oxidation barrier layer such that it is selectively removed from the bottoms of the second cavities.

References Cited (Backward Citations)

US3290753A Cited
GB1358438A Cited
US3902936A Cited
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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1990-11-02 1991-05-04 1991-11-03 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1994-11-02 1995-05-04 1995-11-03 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1998-11-02 1999-05-04 1999-11-03 $7700.00 Window Closed / Lapsed

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