US4698131A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Replaceable image sensor array
Assignee: Xerox Corp
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Filing: 1985-12-13
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Granted: 1987-10-06
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Expires: 2005-12-13
Abstract
Abstract An image sensor array and method of fabrication which facilitates replacement of a defective one in a series of arrays butted together to form a longer scanning array in which a (110) silicon wafer having a row of photosites has separation lines etched thereon by orientation dependent etching along the (111) planes, with the separation lines for the opposite ends of the array each consisting of first and second partial boundary lines longitudinally offset from one another connected by a third boundary line so that the ends of the array have a has a generally L-shaped offset permitting bi-directional separating and aligned inserting movement when replacing a defective array. In a second embodiment, the arrays are formed on (100) silicon with alternating `nail` head and `mesa` head shapes to facilitate removal and replacement of a defective array.
Inventors
- 👤 Mehdi N. Araghi
- 👤 Jagdish C. Tandon
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 21:22
CPC Classifications
H; H10; H10P; H10P50/00; H10P50/60; H10P50/64; H10P50/642; H10P50/644; H10F; H10F39/00; H10F39/10; H10F39/107; H10F39/12
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
246 words
A method of fabricating a sensor array on a chip for assembly with other like arrays in abutting end to end relationship to form a longer composite array and which is capable of being removed and replaced without damaging the other arrays or causing loss of image quality, comprising the steps of: (a) forming at least one row of photosites on a relatively large (110) silicon wafer; (b) orientating dependent etching edge separation lines along the (111) plane of said wafer to delineate the top and bottom edges of said chip; (c) orientating dependent etching end separation lines along the (111) plane of said wafer to delineate chip ends having a generally L-shaped offset therein by etching a first separation line between two adjacent photosites in said photosite row extending from one edge of said chip toward the chip interior, a second separation line longitudinally offset from the first separation line and extending from a point spaced opposite the terminus of said first separation line to the other edge of said chip, and a third separation line connecting the termini of the first and second separation lines, said first, second and third lines cooperating to form end separation lines with said generally L-shaped offset; and (d) separating said chip from said wafer along said separation lines to provide a generally rectangular shaped chip, each end of said chip having a generally L-shaped offset for interlocking abutment and alignment with complementary offset ends of other like arrays.
Claim 2
Independent Claim
246 words
A method of fabricating a sensor array on a chip for assembly with other like arrays in abutting end to end relationship to form a longer composite array and which is capable of being removed and replaced without damaging the other arrays or causing loss of image quality, comprising the steps of: (a) forming at least one row of photosites on a relatively large (110) silicon wafer; (b) orientating dependent etching edge separation lines along the (111) plane of said wafer to delineate the top and bottom edges of said chip; (c) orientating dependent etching end separation lines along the (111) plane of said wafer to delineate chip ends having a generally L-shaped offset therein by etching a first separation line between two adjacent photosites in said photosite row extending from one edge of said chip toward the chip interior, a second separation line longitudinally offset from the first separation line and extending from a point spaced opposite the terminus of said first separation line to the other edge of said chip, and a third separation line connecting the termini of the first and second separation lines, said first, second and third lines cooperating to form end separation lines with said generally L-shaped offset; and (d) separating said chip from said wafer along said separation lines to provide a generally rectangular shaped chip, each end of said chip having a generally L-shaped offset for interlocking abutment and alignment with complementary offset ends of other like arrays.
Claim 3
Dependent Claim
36 words
The method according to claim 1 including the step of: offsetting said second separation line outwardly of said first separation line whereby on separation of said chip from said wafer, a generally T-shaped chip is formed.
Claim 4
Dependent Claim
37 words
The method according to claim 1 including the step of: offsetting said second separation line inwardly of said first separation line whereby on separation of said chip from said wafer, a generally inverted T-shaped chip is formed.
Claim 5
Independent Claim
241 words
A method of fabricating a sensor array on a chip for assembly with other like arrays in abutting end to end relationship to form a longer composite array and which is capable of being removed and replaced without damaging the other arrays or causing loss of image quality, comprising the steps of: (a) orientating dependent etching edge separation lines along the (111) plane of a relatively larger (110) silicon wafer to delineate the top and bottom edges of said chip; (b) orientating dependent etching end separation lines along the (111) plane of said wafer to delineate chip ends having a generally L-shaped offset therein by etching a first separation line extending from one edge of said chip toward the chip interior, a second separation line longitudinally offset from the first separation line and extending from a point spaced opposite the terminus of said first separation line to the other edge of said chip, and a third separation line connecting the termini of the first and second separation lines, said first, second and third lines cooperating to form end separation lines with said generally L-shaped offset; and (c) separating said chip from said wafer along said separation lines to provide a generally rectangular shaped chip, each end of said chip having a generally L-shaped offset for interlocking abutment and alignment with the complementary offset ends of other like arrays; and (d) forming at least one row of photosites on said silicon wafer.
Claim 6
Independent Claim
241 words
A method of fabricating a sensor array on a chip for assembly with other like arrays in abutting end to end relationship to form a longer composite array and which is capable of being removed and replaced without damaging the other arrays or causing loss of image quality, comprising the steps of: (a) orientating dependent etching edge separation lines along the (111) plane of a relatively larger (110) silicon wafer to delineate the top and bottom edges of said chip; (b) orientating dependent etching end separation lines along the (111) plane of said wafer to delineate chip ends having a generally L-shaped offset therein by etching a first separation line extending from one edge of said chip toward the chip interior, a second separation line longitudinally offset from the first separation line and extending from a point spaced opposite the terminus of said first separation line to the other edge of said chip, and a third separation line connecting the termini of the first and second separation lines, said first, second and third lines cooperating to form end separation lines with said generally L-shaped offset; and (c) separating said chip from said wafer along said separation lines to provide a generally rectangular shaped chip, each end of said chip having a generally L-shaped offset for interlocking abutment and alignment with the complementary offset ends of other like arrays; and (d) forming at least one row of photosites on said silicon wafer.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-10-05 | 1991-04-06 | 1991-10-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-10-05 | 1995-04-06 | 1995-10-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-10-05 | 1999-04-06 | 1999-10-06 | $7700.00 | Window Closed / Lapsed |