US4688075A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit having a pre-attached conductive mounting media and method of making the same
Assignee: Fairchild Semiconductor Corp
•
Filing: 1983-07-22
•
Granted: 1987-08-18
•
Expires: 2003-07-22
Abstract
Abstract A semiconductor wafer having a plurality of integrated circuits is provided. One surface of the wafer includes a plurality of electrical contacts on the circuits which are subsequently attached to leads. The other surface of the wafer is provided with a conductive tape. The wafer is cut, e.g., sawed, resulting in each individual circuit having a pre-attached conductive mounting media. The individual circuits can then be attached to a substrate through the conductive mounting media. Other embodiments are disclosed.
Inventors
- 👤 William S. Phy
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 15:21
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/701; H10W20/00; H10W20/40; H10W70/00; H10W70/40; H10W70/453; H10W70/60; H10W70/67; H10W70/69; H10W70/695; H10W72/071; H10W72/077; H10W72/01; H10W72/013; H10W72/01331; H10W72/073; H10W72/07331; H10W72/07337; H10W72/30; H10W72/351; H10W72/353; H10W72/354
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
65 words
A semiconductor body comprising: an integrated circuit obtained from a semiconductor wafer, wherein a major surface of said integrated circuit consists of a portion of a major surface of said wafer; and an electrically conductive mounting medium attached to the major surface of said integrated circuit, said conductive mounting medium being obtained from an electrically conductive tape attached to the major surface of said wafer.
Claim 2
Dependent Claim
65 words
A semiconductor body comprising: an integrated circuit obtained from a semiconductor wafer, wherein a major surface of said integrated circuit consists of a portion of a major surface of said wafer; and an electrically conductive mounting medium attached to the major surface of said integrated circuit, said conductive mounting medium being obtained from an electrically conductive tape attached to the major surface of said wafer.
Claim 3
Dependent Claim
13 words
A semiconductor body as in claim 1, wherein said conductive tape comprises polymide.
Claim 4
Dependent Claim
15 words
A semiconductor body as in claim 2, wherein said conductive tape comprises a noble metal.
Claim 5
Dependent Claim
15 words
A semiconductor body as in claim 1, wherein said conductive tape comprises polymide and silver.
Claim 6
Independent Claim
107 words
A method of attaching a conductive mounting media to an integrated circuit, comprising the steps of: (a) providing a semiconductor wafer including a plurality of integrated circuits therein, said wafer having a pair of opposing major surfaces, one of the surfaces including a plurality of electrical contacts for each of the integrated circuits; (b) attaching the other of the major surfaces of the wafer to a first major surface of a preformed electrically conductive tape; and (c) separating individual ones of the integrated circuits wherein each of said individual ones includes conductive mounting media attached thereto with said media comprising a portion of the electrically conductive tape.
Claim 7
Independent Claim
107 words
A method of attaching a conductive mounting media to an integrated circuit, comprising the steps of: (a) providing a semiconductor wafer including a plurality of integrated circuits therein, said wafer having a pair of opposing major surfaces, one of the surfaces including a plurality of electrical contacts for each of the integrated circuits; (b) attaching the other of the major surfaces of the wafer to a first major surface of a preformed electrically conductive tape; and (c) separating individual ones of the integrated circuits wherein each of said individual ones includes conductive mounting media attached thereto with said media comprising a portion of the electrically conductive tape.
Claim 8
Dependent Claim
26 words
A method in accordance with claim 5 in which the electrically conductive tape includes a second major surface which is removably attached to a carrier film.
Claim 9
Dependent Claim
39 words
A method in accordance with claim 6 in which the conductive tape has a release characteristic wherein it is relatively more strongly attached to the first major surface of the wafer and less strongly attached to the carrier film.
Claim 10
Dependent Claim
14 words
A method in accordance with claim 6 in which the conductive tape comprises polymide.
Claim 11
Dependent Claim
18 words
A method in accordance with claim 6 in which the conductive tape comprise polymide and a noble metal.
Claim 12
Dependent Claim
21 words
A method in accordance with claim 5 in which the step of separating individual ones of the integrated circuits comprises sawing.
Claim 13
Dependent Claim
20 words
A method in accordance with claim 8 which includes the step of curing the polymide to obtain a predetermined resistivity.
Claim 14
Dependent Claim
14 words
A method in accordance with claim 6 in which the carrier film comprises polyolefine.
Claim 15
Dependent Claim
14 words
A method in accordance with claim 6 in which the carrier film comprises poly-vinyl-chloride.
Claim 16
Dependent Claim
29 words
A method in accordance with claim 5 in which the major surfaces of the tape are each greater in area than the other major surface of the semiconductor wafer.
Claim 17
Dependent Claim
29 words
A method in accordance with claim 14 which includes the step of attaching the individual ones of the integrated circuits to a substrate through the conductive media attached thereto.
Claim 18
Dependent Claim
15 words
A method in accordance with claim 15 in which the substrate comprises an insulating material.
Claim 19
Dependent Claim
14 words
A method in accordance with claim 16 in which the substrate comprises aluminum oxide.
Claim 20
Dependent Claim
15 words
A method in accordance with claim 15 in which the substrate comprises a conducting material.
Claim 21
Dependent Claim
10 words
An integrated circuit made by the method of claim 5.
References Cited (Backward Citations)
CA833197A
Cited
GB1206759A
Cited
US3978578A
Cited
US4078711A
Cited
US4293587A
Cited
US4451972A
Cited
GB2084399A
Cited
US4423548A
Cited
US4390598A
Cited
US4451971A
Cited
US4485553A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-08-17 | 1991-02-16 | 1991-08-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-08-17 | 1995-02-16 | 1995-08-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-08-17 | 1999-02-16 | 1999-08-18 | $7700.00 | Window Closed / Lapsed |