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US4687537A Expired / Lapsed US ⏱️ 0.0 years remaining

Epitaxial metal silicide layers

Assignee: Intersil Corp
•
Filing: 1986-04-15
•
Granted: 1987-08-18
•
Expires: 2006-04-15
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Abstract

Abstract A process of forming an epitaxial metal silicide layer on a silicon substrate is disclosed. A thin layer of a first metal that will form an oxide in preference to silicon is initially deposited on the substrate. A preferred first metal is titanium. A layer of palladium, platinum or iridium is deposited thereover. An exceptionally uniform, conductive layer of metal silicide is thereby formed by epitaxial growth without the necessity of a high temperature anneal. The disclosed process is particularly useful in forming ultra thin metal silicide Schottky barriers in devices such as infrared imaging arrays.

Inventors

  • 👤 Dorothy M. Hoffman
  • 👤 Frederick J. Tams, III
  • 👤 Joseph T. McGinn

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-10 02:04
CPC Classifications
H; H10; H10D; H10D64/00; H10D64/01; H10D64/012; H10D64/0121; H10F; H10F30/00; H10F30/20; H10F30/21; H10F30/22; H10F30/227; Y; Y10; Y10S; Y10S117/00; Y10S117/905

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 87 words
A process of forming a layer of a metal silicide on the surface of a silicon substrate comprising depositing at a temperature of from about 200° to 325° C. a first metal which will form an oxide in preference to silicon, said metal being selected from the group consisting of titanium, vanadium, zirconium, tantalum, chromium and hafnium, and depositing thereover a layer of a second metal selected from the group consisting of palladium and platinum whereby the silicide of the second metal is formed by epitaxial growth.
Claim 2
Dependent Claim 87 words
A process of forming a layer of a metal silicide on the surface of a silicon substrate comprising depositing at a temperature of from about 200° to 325° C. a first metal which will form an oxide in preference to silicon, said metal being selected from the group consisting of titanium, vanadium, zirconium, tantalum, chromium and hafnium, and depositing thereover a layer of a second metal selected from the group consisting of palladium and platinum whereby the silicide of the second metal is formed by epitaxial growth.
Claim 3
Dependent Claim 13 words
A process in accordance with claim 1, wherein the first metal is titanium.
Claim 4
Dependent Claim 13 words
A process in accordance with claim 2, wherein the second metal is palladium.
Claim 5
Dependent Claim 29 words
A process in accordance with claim 1, wherein the first metal is deposited to a density of from about 6×10 14 to about 6×10 15 atoms per square centimeter.
Claim 6
Dependent Claim 24 words
A process in accordance with claim 4, wherein the first metal is deposited to a density of about 1.8×10 15 atoms per square centimeter.
Claim 7
Dependent Claim 23 words
A process in accordance with claim 1, wherein the layer of epitaxial metal silicide is from about one to about ten nanometers thick.

References Cited (Backward Citations)

US3757123A Cited
US3841904A Cited
US3927225A Cited
US3889359A Cited
US3968272A Cited
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US4110488A Cited
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US4619035A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1990-08-17 1991-02-16 1991-08-18 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1994-08-17 1995-02-16 1995-08-18 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1998-08-17 1999-02-16 1999-08-18 $7700.00 Window Closed / Lapsed

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