Patent US4685807A successfully refreshed from Google Patents.
US4685807A
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US
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Optical microlithography apparatus with a local alignment system
Assignee: Commissariat à l'Énergie Atomique et Aux Énergies Alternatives
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Filing: 1985-02-15
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Granted: 1987-08-11
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Expires: 2005-02-15
Abstract
Abstract An optical microlithography apparatus with a local alignment system is applicable to the production of integrated circuits. The local alignment system comprises a beam splitter between the photoreduction lens and the integrated circuit wafer, a sighting lens, an illumination source and an alignment pattern in the focal plane of the sighting lens. The source illuminates an area of the wafer around the position finding mark associated with each integrated circuit. The image of said mark is reflected into the focal plane of the sighting lens. A means then displaces the wafer in order to bring about coincidence between the image of the position finding mark and the alignment pattern.
Inventors
- 👤 Bernard Picard
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 12:55
CPC Classifications
G; G03; G03F; G03F9/00; G03F9/70
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
164 words
An optical microlithography apparatus comprising a displacable support receiving a wafer over which are distributed chips to be irradiated, each chip being provided with at least one position finding mark, said apparatus further comprising an optical system and a system for the local alignment of the wafer, said optical system comprising a radiation source, a convergent lens, a reticle and a photoreduction lens for displaying the image of the reticle on a chip of the wafer, wherein the said local alignment system comprises a beam splitter between the photoreduction lens and the wafer, a source for illuminating the wafer by said beam splitter, means for collecting the image of the illuminated area around the position finding mark by said beam splitter said collecting means having a focal plane, an alignment pattern located in the focal plane of said collecting means and a means for controlling the displacement of the wafer support for aligning the image of the position finding mark on the alignment pattern.
Claim 2
Dependent Claim
164 words
An optical microlithography apparatus comprising a displacable support receiving a wafer over which are distributed chips to be irradiated, each chip being provided with at least one position finding mark, said apparatus further comprising an optical system and a system for the local alignment of the wafer, said optical system comprising a radiation source, a convergent lens, a reticle and a photoreduction lens for displaying the image of the reticle on a chip of the wafer, wherein the said local alignment system comprises a beam splitter between the photoreduction lens and the wafer, a source for illuminating the wafer by said beam splitter, means for collecting the image of the illuminated area around the position finding mark by said beam splitter said collecting means having a focal plane, an alignment pattern located in the focal plane of said collecting means and a means for controlling the displacement of the wafer support for aligning the image of the position finding mark on the alignment pattern.
Claim 3
Dependent Claim
16 words
An optical microlithography apparatus according to claim 1, wherein the illumination source supplies a monochromatic beam.
Claim 4
Dependent Claim
17 words
An optical microlithography apparatus according to claim 1, wherein the illumination source supplies a wide spectrum beam.
Claim 5
Dependent Claim
25 words
An optical microlithography apparatus according to claim 3, wherein said apparatus comprises at least one detachable filter, which intercepts the beam from the illumination source.
Claim 6
Dependent Claim
108 words
An optical microlithography apparatus according to claim 1 adapted for a wafer in which at least a second position finding mark is associated with each chip of said wafer, wherein said apparatus comprises second means for collecting the image of the illuminated area around said second position finding mark, the focal plane of said second means for collecting being the same as the focal plane of the means for collecting, and a second alignment pattern located in the focal plane of said second means for collecting, the displacement means controlling the displacement of the wafer support in order to align both position finding marks with an alignment pattern.
Claim 7
Dependent Claim
43 words
An optical microlithography apparatus according to claim 5, wherein each means for collecting the image of the illuminated area around a position finding mark is a sighting lens, an alignment pattern being located in the focal plane of each of said sighting lenses.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-08-10 | 1991-02-09 | 1991-08-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-08-10 | 1995-02-09 | 1995-08-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-08-10 | 1999-02-09 | 1999-08-11 | $7700.00 | Window Closed / Lapsed |