Abstract Apparatus for simultaneously soldering all the leads of a multi-lead SMP device to the pads of a substrate utilizes a gas laser having a cylindrical resonant cavity terminated at one end by a mirror that reflects energy back into the laser cavity. A plurality of beamlets corresponding to the number of leads of the SMP device are coupled out of the laser through holes in the mirror. All the beamlets have substantially the same amount of radiant energy. Each beamlet enters the near end of a different one of a corresponding number of elongate flexible optical wave guides extending away from the mirror toward an imaging lens. The far end of each optical wave guide is arranged so that its position can be moved. That enables the far ends of the wave guides to be arranged in different patterns to match the various patterns of leads of different SMP devices. The beamlets emerging from the far ends of the optical wave guides are focussed by the imaging lens on the joints to be soldered. The radiant energy of those beamlets is turned into heat and causes the solder at the joints to reflow so that all the soldered connections are made at the same time.
Apparatus for simultaneously joining the leads of a multi-lead device to pads on a substrate, the apparatus comprising, (a) a laser having a resonant cavity, (b) a mirror disposed at one end of the resonant cavity, the mirror having a plurality of holes for outputting a plurality of beamlets of substantially collimated radiant energy, there being a beamlet for each lead to be simultaneously bonded of the multi-lead device, (c) a corresponding plurality of elongate flexible optical wave guides, each beamlet entering the near end of a different one of the optical wave guides, (d) adjustable means attached to each of the flexible optical wave guides for enabling the far end of each of those wave guides to be moved in two orthogonal planes whereby the far end of each of the optical wave guides may be independently positioned in different patterns which match the arrangement of the leads of different multi-lead devices, (e) means for focussing the beamlets emerging from the far ends of the wave guides upon the joints to be bonded such that the beamlets impinge upon the joints to be bonded at an acute angle to the substrate.
Claim 2
Dependent Claim
192 words
Apparatus for simultaneously joining the leads of a multi-lead device to pads on a substrate, the apparatus comprising, (a) a laser having a resonant cavity, (b) a mirror disposed at one end of the resonant cavity, the mirror having a plurality of holes for outputting a plurality of beamlets of substantially collimated radiant energy, there being a beamlet for each lead to be simultaneously bonded of the multi-lead device, (c) a corresponding plurality of elongate flexible optical wave guides, each beamlet entering the near end of a different one of the optical wave guides, (d) adjustable means attached to each of the flexible optical wave guides for enabling the far end of each of those wave guides to be moved in two orthogonal planes whereby the far end of each of the optical wave guides may be independently positioned in different patterns which match the arrangement of the leads of different multi-lead devices, (e) means for focussing the beamlets emerging from the far ends of the wave guides upon the joints to be bonded such that the beamlets impinge upon the joints to be bonded at an acute angle to the substrate.
Claim 3
Dependent Claim
16 words
The invention according to claim 1, wherein the elongate flexible optical wave guides are copper tubes.
Claim 4
Dependent Claim
27 words
The invention according to claim 1, wherein the plurality of holes in the mirror are all of the same size and are symmetrically disposed about a circle.
Claim 5
Dependent Claim
28 words
The invention according to claim 3, wherein the resonant cavity of the laser is cylindrical and the circle is concentric with the longitudinal axis of the resonant cavity.