US4681656A
Expired / Lapsed
US
⏱️ 0.0 years remaining
IC carrier system
Assignee: Individual
•
Filing: 1985-05-01
•
Granted: 1987-07-21
•
Expires: 2005-05-01
Abstract
Abstract A method of laser-machining IC carrier bodies from a sheet ceramic blank, and the IC carrier products produced from such laser-machining. The ceramic blank, preferably of alumina or beryllia, is high temperature fired to permanently fix its size and shape prior to the laser-machining, permitting a matrix of IC carrier bodies to be laser-machined to close tolerances, whereby metallization conductors can be located on the bodies also to close tolerances, and lower temperature firing may be employed to fix such conductors without disturbing any of the tolerances. Novel elongated peripheral groove vias in the carrier bodies permit the sequential laser-machining of elongated slots to form the via grooves and scribe recesses. The novel elongated slot via grooves permit efficient vacuum drawing of metallization paste through the slots and restriction of the metallization to flat sides of the slots whereby insulative slot ends enable all carriers in a matrix to be electrically isolated for multiple electrical testing of the carriers in matrix or array form.
Inventors
- 👤 James E. Byrum
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 23:44
CPC Classifications
C; C04; C04B; C04B41/00; C04B41/009; C04B41/45; C04B41/50; C04B41/51; C04B41/5111; C04B41/52; C04B41/80; C04B41/81; C04B41/85; C04B41/88; C04B41/89; H; H05; H05K; H05K3/00; H05K3/0011; H05K3/0017; H05K3/0026; H05K3/0029; H05K3/40; H05K3/403; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/095; H10W99/00; C04B2111/00; C04B2111/00474; C04B2111/00844; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K1/09; H05K1/092; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/09036; H05K2201/09063; H05K2201/09145; H05K2201/09181; H05K2203/00; H05K2203/07; H05K2203/0703; H05K2203/0723; H05K2203/08; H05K2203/085; H05K3/0044; H05K3/0052; H05K3/22; H05K3/24; H05K3/245; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3442; H05K3/4038; H05K3/4053; H05K3/4061; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/751; H10W90/754; Y; Y10; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052; Y10T156/1056; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/49155; Y10T29/49163
Claims Analysis
Total Claims: 31
Claim 1
Independent Claim
92 words
The method of making a matrix of IC carriers which comprises: providing a generally flat sheet ceramic blank which has been sintered by means of a primary, high temperature firing; laser-machining a first plurality of parallel, straightline sequences of elongated, substantially straight-sided slots in said fired ceramic blank; and laser-machining a second plurality of said sequences in said fired ceramic blank which is orthogonal to and intersecting with said first plurality of sequences; said IC carriers being defined between adjacent pairs of said first sequences and adjacent pairs of said second sequences.
Claim 2
Independent Claim
92 words
The method of making a matrix of IC carriers which comprises: providing a generally flat sheet ceramic blank which has been sintered by means of a primary, high temperature firing; laser-machining a first plurality of parallel, straightline sequences of elongated, substantially straight-sided slots in said fired ceramic blank; and laser-machining a second plurality of said sequences in said fired ceramic blank which is orthogonal to and intersecting with said first plurality of sequences; said IC carriers being defined between adjacent pairs of said first sequences and adjacent pairs of said second sequences.
Claim 3
Dependent Claim
10 words
The method of claim 1, wherein said blank comprises alumina.
Claim 4
Dependent Claim
10 words
The method of claim 1, wherein said blank comprises beryllia.
Claim 5
Dependent Claim
21 words
The method of claim 1, wherein said primary, high temperature firing was at a temperature of at least approximately 1550° C.
Claim 6
Dependent Claim
25 words
The method of claim 1, wherein each of said sequences comprises an alternating sequence of a plurality of said slots and a plurality of scribes.
Claim 7
Dependent Claim
22 words
The method of claim 5, wherein each of said scribes is made by laser-machining a series of closely spaced, discrete scribe recesses.
Claim 8
Dependent Claim
31 words
The method of claim 6, wherein said slots and said scribe recesses are laser-machined in sequence by the same laser, and wherein said laser is in the middle infrared radiation range.
Claim 9
Dependent Claim
13 words
The method of claim 7, wherein said laser is a carbon dioxide laser.
Claim 10
Dependent Claim
16 words
The method of claim 7, wherein said scribe recesses are laser-machined to a substantially conical configuration.
Claim 11
Dependent Claim
30 words
The method of claim 9, wherein said scribe recesses extend from a flat surface of said ceramic blank through not more than approximately one-half of the thickness of said blank.
Claim 12
Dependent Claim
27 words
The method of claim 1, wherein the substantially straight sides of said slots are substantially flat and oriented substantially normal to the general plane of said blank.
Claim 13
Dependent Claim
38 words
The method of claim 1, wherein "X's" of four of said slots are laser-machined so as to communicate with each other where at least some of said first sequences intersect with at least some of said second sequences.
Claim 14
Dependent Claim
81 words
The method of claim 7, wherein the laser-machining of said slots is performed while delivering a focused laser beam to said blank through laser delivery means located at a first level spaced from and parallel to the general plane of said blank, and said laser-machining of said scribe recesses is performed while delivering a focused laser beam to said blank through said laser delivery means located at a second level spaced from and parallel to the general plane of said blank
Claim 15
Dependent Claim
19 words
The method of claim 13, wherein said second level is spaced further from said blank than said first level.
Claim 16
Dependent Claim
17 words
The method of claim 1, which comprises applying conductive metallization material to said blank after said laser-machining.
Claim 17
Dependent Claim
24 words
The method of claim 15, which comprises fixing said metallization material by secondary firing at a temperature substantially lower than said primary firing temperature.
Claim 18
Dependent Claim
13 words
The method of claim 15, wherein said metallization material comprises noble metal material.
Claim 19
Dependent Claim
27 words
The method of claim 17, wherein said noble metal material comprises one or more noble metals selected from the group consisting of gold, platinum, palladium and silver.
Claim 20
Dependent Claim
39 words
The method of claim 18, which comprises fixing said noble metal material by a secondary firing at a temperature substantially lower than said primary firing temperature and in the range of from approximately 850° C. to approximately 1000° C.
Claim 21
Dependent Claim
13 words
The method of claim 15, wherein said metallization material comprises refractory metal material.
Claim 22
Dependent Claim
26 words
The method of claim 20, wherein said refractory metal material comprises one or more refractory metals selected from the group consisting of tungsten, molybdenum and manganese.
Claim 23
Dependent Claim
33 words
The method of claim 21, which comprises fixing said refractory metal material by a secondary firing at a temperature substantially lower than said primary firing temperature and not greater than approximately 1425° C.
Claim 24
Dependent Claim
34 words
The method of claim 15, wherein said metallization material comprises a first layer of refractory metal material bonded to said blank, and a second layer of noble metal material bonded to said first layer
Claim 25
Dependent Claim
61 words
The method of claim 23, which comprises fixing said first layer by a first secondary firing at a temperature substantially lower than said primary firing temperature prior to application of said second layer, and then after application of said second layer, fixing said second layer by a second secondary firing at a temperature substantially lower than said first secondary firing temperature.
Claim 26
Dependent Claim
45 words
The method of claim 15, wherein said metallization comprises a first layer of refractory metal material bonded to said blank, a second layer of nickel metal material bonded to said first layer, and a third layer of noble metal material bonded to said second layer.
Claim 27
Dependent Claim
68 words
The method of claim 25, which comprises fixing said first layer by a first secondary firing at a temperature substantially lower than said primary firing temperature prior to application of said second and third layers, and then after application of said second and third layers, simultaneously fixing said second and third layers by a second secondary firing at a temperature substantially lower than said first secondary firing temperature.
Claim 28
Dependent Claim
70 words
The method of claim 15, which comprises: electrolessly applying a very thin first plating of copper over substantially the entire said ceramic matrix; electrolytically applying a second plating of copper over limited patterned areas of said first plating; electrolytically applying a third plating of noble metal material over said second plating; and etching away said first plating of copper where it is not covered by said second and third platings.
Claim 29
Dependent Claim
46 words
The method of claim 27, which comprises electrolytically applying a plating of nickel over said second plating of copper before applying said third plating of noble metal material, and then applying said third plating of noble metal material over said nickel plating and performing said etching.
Claim 30
Dependent Claim
94 words
The method of claim 15, which comprises: sputtering a very thin first layer of titanium-tungsten over substantially the entire said ceramic matrix; sputtering a thin second layer of copper over substantially the entire said first layer; electrolytically plating a third layer of copper over limited patterned area of said second layer; electrolytically plating a fourth layer of nickel over said third layer; electrolytically plating a fifth layer of noble metal over said fourth layer; and etching away said first and second layers where they are not covered by said third, fourth and fifth layers.
Claim 31
Dependent Claim
103 words
The method of claim 15, which comprises vacuum drawing metallization paste through said slots so as to apply said metallization paste discretely to said substantially flat sides of said slots and excluding it from the ends of said slots, whereby the ends of said slots consist of electrically insulative ceramic material and all of said IC carriers in said matrix remain electrically isolated from each other; and firing said metallization paste at a secondary firing temperature substantially lower than said primary firing temperature to fix said metallization on said substantially flat sides of said slots and excluded from the ends of said slots.
References Cited (Backward Citations)
US3882059A
Cited
US3926746A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-07-20 | 1991-01-19 | 1991-07-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-07-20 | 1995-01-19 | 1995-07-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-07-20 | 1999-01-19 | 1999-07-21 | $7700.00 | Window Closed / Lapsed |