US4675472A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit package and seal therefor
Assignee: Beta Phase Inc
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Filing: 1986-08-04
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Granted: 1987-06-23
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Expires: 2006-08-04
Abstract
Abstract An integrated circuit package having a substrate of ceramic material having a cavity therein, a resilient seal rim connected to the substrate, a lid that may be inserted within said rim and a band of shape-memory alloy surrounding the rim to compress the rim into contact with the lid to seal the package.
Inventors
- 👤 John F. Krumme
- 👤 Darel E. Hodgson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 23:47
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/60; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W72/00; H10W72/071; H10W72/073; H10W72/07351; H10W72/07352; H10W72/30; H10W72/321; H10W72/50; H10W72/531; H10W72/5363; H10W72/541; H10W72/5445; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
183 words
An integrated circuit package comprising: a substrate of material having a coefficient of thermal expansion, said substrate having a cavity therein defined by a bottom and upstanding walls and having conductors operatively connected thereto for electrical interconnection of a component to be inserted within said cavity; a seal rim connected to said walls, said rim having an inside surface and an outside surface, said inside surface defining said opening, said rim fabricated from a material having a coefficient of thermal expansion compatible with the coefficient of thermal expansion of the substrate; a lid having an outer periphery that is complimentary with said inside surface, said lid being insertable within said opening; and a band of shape-memory alloy having a martensite state and an austenite state, said band capable of being expanded dimensionally while in its martensite state to fit outside of said outside surface of said seal rim, a change from its martensite state to its austenite state capable of recovering said band to its non-expanded dimension for operatively pressing said seal rim against the outer periphery of said lid to effect sealing.
Claim 2
Dependent Claim
183 words
An integrated circuit package comprising: a substrate of material having a coefficient of thermal expansion, said substrate having a cavity therein defined by a bottom and upstanding walls and having conductors operatively connected thereto for electrical interconnection of a component to be inserted within said cavity; a seal rim connected to said walls, said rim having an inside surface and an outside surface, said inside surface defining said opening, said rim fabricated from a material having a coefficient of thermal expansion compatible with the coefficient of thermal expansion of the substrate; a lid having an outer periphery that is complimentary with said inside surface, said lid being insertable within said opening; and a band of shape-memory alloy having a martensite state and an austenite state, said band capable of being expanded dimensionally while in its martensite state to fit outside of said outside surface of said seal rim, a change from its martensite state to its austenite state capable of recovering said band to its non-expanded dimension for operatively pressing said seal rim against the outer periphery of said lid to effect sealing.
Claim 3
Dependent Claim
26 words
A package as in claim 1 wherein said seal rim has a generally "U" shaped cross-section said band seating within the confines of said "U" shape.
Claim 4
Dependent Claim
16 words
A package as in claim 1 wherein said seal rim has generally an "L" shaped cross-section.
Claim 5
Dependent Claim
26 words
A package as in claim 1 wherein said band has a round cross-section and comprises a wire that is welded to itself to form a ring.
Claim 6
Dependent Claim
23 words
A package as in claim 1 wherein the outer periphery of said lid is also complementary with said outside surface of the lid.
Claim 7
Dependent Claim
167 words
An integrated circuit package seal comprising: a seal rim capable of being connected to the upper surface of a substrate having a cavity therein to receive an electrical component, said rim having an inside surface and an outside surface, said inside surface defining said opening, said rim fabricated from a material having a coefficient of thermal expansion compatible with the coefficient of thermal expansion of a substrate upon which the seal rim may be connected; a lid having an outer periphery that is complimentary with said inside surface, said lid being insertable within said opening; and a band of shape-memory alloy having a martensite state and an austenite state, said band capable of being expanded dimensionally while in its martensite state to fit outside of said outside surface of said seal rim, a change from its martensite state to its austenite state capable of recovering said band to its non-expanded dimension for operatively pressing said seal rim against the outer periphery of said lid to effect sealing.
Claim 8
Dependent Claim
167 words
An integrated circuit package seal comprising: a seal rim capable of being connected to the upper surface of a substrate having a cavity therein to receive an electrical component, said rim having an inside surface and an outside surface, said inside surface defining said opening, said rim fabricated from a material having a coefficient of thermal expansion compatible with the coefficient of thermal expansion of a substrate upon which the seal rim may be connected; a lid having an outer periphery that is complimentary with said inside surface, said lid being insertable within said opening; and a band of shape-memory alloy having a martensite state and an austenite state, said band capable of being expanded dimensionally while in its martensite state to fit outside of said outside surface of said seal rim, a change from its martensite state to its austenite state capable of recovering said band to its non-expanded dimension for operatively pressing said seal rim against the outer periphery of said lid to effect sealing.
Claim 9
Dependent Claim
27 words
A package seal as in claim 6 wherein said seal rim has a generally "U" shaped cross-section said band seating within the confines of said "U" shape.
Claim 10
Dependent Claim
18 words
A package seal as in claim 6 wherein said seal rim has generally an 37 L" shaped cross-section.
Claim 11
Dependent Claim
27 words
A package seal as in claim 6 wherein said band has a round cross-section and comprises a wire that is welded to itself to form a ring.
Claim 12
Dependent Claim
24 words
A package seal as in claim 6 wherein the outer periphery of said lid is also complementary with said outside surface of the lid.
Claim 13
Dependent Claim
18 words
A package seal as in claim 6 wherein said seal rim and said substrate upstanding walls are integral.
Claim 14
Dependent Claim
173 words
An integrated circuit package comprising: a substrate of material having a coefficient of thermal expansion, said substrate having a cavity therein defined by a bottom and upstanding walls and having conductors operatively connected thereto for electrical interconnection of a component to be inserted within said cavity; a seal rim connected to said walls, said rim having an inside surface and an outside surface, said inside surface defining said opening, said rim fabricated from a material having a coefficient of thermal expansion compatible with the coefficient of thermal expansion of the substrate; a lid having an outer periphery that is complimentary with said outside surface, said lid being insertable over said rim; and a band of shape-memory alloy having a martensite state and an austenite state, said band capable of being expanded dimensionally while in its martensite state to fit outside of said lid, a change from its martensite state to its austenite state capable of recovering said band to its non-expanded dimension operatively pressing said lid against the seal rim to effect sealing.
Claim 15
Dependent Claim
173 words
An integrated circuit package comprising: a substrate of material having a coefficient of thermal expansion, said substrate having a cavity therein defined by a bottom and upstanding walls and having conductors operatively connected thereto for electrical interconnection of a component to be inserted within said cavity; a seal rim connected to said walls, said rim having an inside surface and an outside surface, said inside surface defining said opening, said rim fabricated from a material having a coefficient of thermal expansion compatible with the coefficient of thermal expansion of the substrate; a lid having an outer periphery that is complimentary with said outside surface, said lid being insertable over said rim; and a band of shape-memory alloy having a martensite state and an austenite state, said band capable of being expanded dimensionally while in its martensite state to fit outside of said lid, a change from its martensite state to its austenite state capable of recovering said band to its non-expanded dimension operatively pressing said lid against the seal rim to effect sealing.
Claim 16
Dependent Claim
19 words
A package as in claim 12 wherein the upstanding walls of said substrate and said seal rim are integral.
References Cited (Backward Citations)
US3422320A
Cited
US3602634A
Cited
US3784725A
Cited
US4126758A
Cited
US4355463A
Cited
DD200775A1
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-06-22 | 1990-12-22 | 1991-06-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-06-22 | 1994-12-22 | 1995-06-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-06-22 | 1998-12-22 | 1999-06-23 | $7700.00 | Window Closed / Lapsed |