US4674182A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for producing printed wiring board with flexible auxiliary board
Assignee: Toshiba Corp
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Filing: 1986-05-20
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Granted: 1987-06-23
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Expires: 2006-05-20
Abstract
Abstract A printed wiring board comprising a main printed wiring board provided with a first wiring pattern, and an auxiliary flexible printed wiring board, provided with a second wiring pattern for modifying the first wiring pattern and bonded to the main printed wiring board so as to electrically connect the second wiring pattern to a desired part of the first wiring pattern. The auxiliary board may be affixed to the main board with a pressure-sensitive adhesive or thermosetting adhesive. The auxiliary board may be provided with marks for facilitating alignment, holes to provide access to the main board, a dummy pattern for preventing tears of the flexible auxiliary board, and a second dummy pattern to prevent warping from uneven stresses applied to the flexible auxiliary board by differences in thermal expansion of the auxiliary board and the pattern printed thereon. A method of making the board is also disclosed and claimed.
Inventors
- 👤 Yutaka Igarashi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 06:24
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/36; H05K3/22; H05K3/225; H05K1/00; H05K1/02; H05K1/0277; H05K1/028; H05K1/0281; H05K1/14; H05K1/141; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/096; H05K2201/09654; H05K2201/09781; H05K2201/20; H05K2201/2009; H05K3/30; H05K3/303; H05K3/305; H05K3/32; H05K3/34; H05K3/3447; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/4913; Y10T29/49139
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
224 words
A method for modifying first printed circuit patterns on a main printed wiring board which has first conductive lands for soldering as part of said first circuit patterns and at least two first through holes at said first conductive lands with second printed circuit patterns on a flexible printed wiring board, including steps of: forming said flexible wiring board having a non-conductive flexible substrate and said second circuit patterns with second conductive lands for soldering; adhering an adhesive material having a pressure-sensitive adhesive character on both surfaces on said flexible wiring board; making at least two second holes at said second lands through said flexible wiring board and said adhesive material adhered theron; adhering said flexible wiring board on said main board with said adhesive material adhered on said flexible wiring board with said at least two second through holes of said flexible board aligned with said first ones of said main board corresponding thereto; mounting electronic component parts on said main board so that their leads extend through the first through holes of the main board and the second ones of the flexible wiring board aligned with respect to it; and soldering together said leads of the electronic component parts and the first lands of the main printed wiring board and the second lands of the flexible wiring board to establish electrical connection.
Claim 2
Independent Claim
224 words
A method for modifying first printed circuit patterns on a main printed wiring board which has first conductive lands for soldering as part of said first circuit patterns and at least two first through holes at said first conductive lands with second printed circuit patterns on a flexible printed wiring board, including steps of: forming said flexible wiring board having a non-conductive flexible substrate and said second circuit patterns with second conductive lands for soldering; adhering an adhesive material having a pressure-sensitive adhesive character on both surfaces on said flexible wiring board; making at least two second holes at said second lands through said flexible wiring board and said adhesive material adhered theron; adhering said flexible wiring board on said main board with said adhesive material adhered on said flexible wiring board with said at least two second through holes of said flexible board aligned with said first ones of said main board corresponding thereto; mounting electronic component parts on said main board so that their leads extend through the first through holes of the main board and the second ones of the flexible wiring board aligned with respect to it; and soldering together said leads of the electronic component parts and the first lands of the main printed wiring board and the second lands of the flexible wiring board to establish electrical connection.
Claim 3
Dependent Claim
39 words
The method of claim 1, wherein openings of said second through holes made in said step of making at least two second through holes are larger than an opening of said first through holes of the main wiring board.
Claim 4
Dependent Claim
75 words
The method of claim 1, wherein said step of forming said flexible wiring board includes forming at least two positioning marks for aligning said flexible wiring board with respect to said main wiring board, and said positioning marks are aligned with respect to the first lands, part of the first circuit patterns or the first through holes of said main board corresponding thereto in said step of adhering said flexible board on the main board.
Claim 5
Dependent Claim
47 words
The method of claim 3, wherein said positioning marks are formed of the same conductor material as the material of the second wiring patterns of said flexible wiring board and are formed simultaneously together with said second pattern in the step of forming said flexible wiring board.
Claim 6
Dependent Claim
55 words
The method of claim 1, wherein said step of making at least two second through holes includes forming a perforation or perforations corresonding to a part or parts of said first circuit patterns of said main wiring board for observing said part or parts through said flexible wiring board adhered theron with said adhesive material.
Claim 7
Independent Claim
244 words
A method for modifying first printed circuit patterns on a main printed wiring board which has first conductive lands for soldering as part of said first circuit patterns and at least two first through holes at said first conductive lands with second printed circuit patterns on a flexible printed wiring board, including steps of: forming said flexible wiring board having a non-conductive flexible substrate and said second circuit patterns with second conductive lands for soldering; applying a thermosetting adhesive material on a surface of the flexible printed wiring board which is to be bonded to the main wiring board; making at least two second holes at said second lands through said flexible wiring board and said adhesive material applied thereto; aligning said flexible wiring board with respect to the main wiring board with said at least two through holes of said flexible board aligned with said first ones of said main board corresponding thereto; heating said adhesive material to the bond the flexible wiring board to main wiring board by means of the adhesive material; mounting electronic component parts on said main board so that their leads extend through the first through holes of the main board and the second ones of the flexible wiring board aligned with respect to it; and soldering together said leads of the electronic component parts and the first lands of the main printed wiring board and the second lands of the flexible wiring board to establish electrical connection.
Claim 8
Independent Claim
244 words
A method for modifying first printed circuit patterns on a main printed wiring board which has first conductive lands for soldering as part of said first circuit patterns and at least two first through holes at said first conductive lands with second printed circuit patterns on a flexible printed wiring board, including steps of: forming said flexible wiring board having a non-conductive flexible substrate and said second circuit patterns with second conductive lands for soldering; applying a thermosetting adhesive material on a surface of the flexible printed wiring board which is to be bonded to the main wiring board; making at least two second holes at said second lands through said flexible wiring board and said adhesive material applied thereto; aligning said flexible wiring board with respect to the main wiring board with said at least two through holes of said flexible board aligned with said first ones of said main board corresponding thereto; heating said adhesive material to the bond the flexible wiring board to main wiring board by means of the adhesive material; mounting electronic component parts on said main board so that their leads extend through the first through holes of the main board and the second ones of the flexible wiring board aligned with respect to it; and soldering together said leads of the electronic component parts and the first lands of the main printed wiring board and the second lands of the flexible wiring board to establish electrical connection.
Claim 9
Dependent Claim
39 words
The method of claim 6, wherein openings of said second through holes made in said step of making at least two second through holes are larger than an opening of said first through holes of the main wiring board.
Claim 10
Dependent Claim
76 words
The method of claim 6 wherein said step of forming said flexible wiring board includes forming at least two positioning marks for aligning said flexible wiring board with respect to said main wiring board, and said positioning marks are aligned with respect to the first lands, part of the first circuit patterns or the first through holes of said main board corresponding thereto in said step of aligning said flexible board with respect to main board.
Claim 11
Dependent Claim
47 words
The method of claim 8, wherein said positioning marks are formed of the same conductor material as the material of the second wiring patterns of said flexible wiring board and are formed simultaneously together with said second pattern in the step of forming said flexible wiring board.
Claim 12
Dependent Claim
55 words
The method of claim 6, wherein said step of making at least two second through holes includes forming a perforation or perforations corresponding to a part of parts of said first circuit patterns of said main wiring board for observing said part or parts through said flexible wiring board adhered thereon with said adhesive material.
Claim 13
Independent Claim
217 words
A method for modifying a main printed circuit board comprising a main printed wiring board which has first printed circuit patterns with first conductive lands for soldering and at least two first through holes at the first lands, and electronic component parts mounted thereon of which leads extend through the first through holes and are soldered to said first lands with second printed circuit patterns on a flexible printed wiring board, including steps of: forming said flexible wiring board having a non-conductive flexible substrate and said second circuit patterns with second conductive lands for soldering; adhering an adhesive material having a pressure-sensitive adhesive character on both surfaces on said flexible wiring board; making at least two second holes at said second lands through said flexible wiring board and said adhesive material adhered thereon; adhering said flexible wiring board on said main board with said adhesive material adhered on said flexible wiring board with said at least two second through holes of said flexible board aligned with said first one of said main board corresponding thereto and leads of said electronic component parts inserted in it, soldering together said leads of the electronic component parts and the first lands of the main printed wiring board and the second lands of the flexible wiring board to establish electrical connection.
Claim 14
Independent Claim
217 words
A method for modifying a main printed circuit board comprising a main printed wiring board which has first printed circuit patterns with first conductive lands for soldering and at least two first through holes at the first lands, and electronic component parts mounted thereon of which leads extend through the first through holes and are soldered to said first lands with second printed circuit patterns on a flexible printed wiring board, including steps of: forming said flexible wiring board having a non-conductive flexible substrate and said second circuit patterns with second conductive lands for soldering; adhering an adhesive material having a pressure-sensitive adhesive character on both surfaces on said flexible wiring board; making at least two second holes at said second lands through said flexible wiring board and said adhesive material adhered thereon; adhering said flexible wiring board on said main board with said adhesive material adhered on said flexible wiring board with said at least two second through holes of said flexible board aligned with said first one of said main board corresponding thereto and leads of said electronic component parts inserted in it, soldering together said leads of the electronic component parts and the first lands of the main printed wiring board and the second lands of the flexible wiring board to establish electrical connection.
Claim 15
Dependent Claim
39 words
The method of claim 11, wherein openings of said second through holes made in said step of making at least two second through holes are larger than an opening of said first through holes of the main wiring board.
Claim 16
Dependent Claim
75 words
The method of claim 11, wherein said step of forming said flexible wiring board includes forming at least two positioning marks for aligning said flexible wiring board with respect to said main wiring board, and said positioning marks are aligned with respect to the first lands, part of the first circuit patterns or the first through holes of said main board corresponding thereto in said step of adhering said flexible board on the main board.
Claim 17
Dependent Claim
47 words
The method of claim 12, wherein said positioning marks are formed of the same conductor material as the material of the second wiring patterns of said flexible wiring board and are formed simultaneously together with said second pattern in the step of forming said flexible wiring board.
Claim 18
Dependent Claim
55 words
The method of claim 11, wherein said step of making at least two second through holes includes forming a perforation or perforations corresponding to a part or parts of said first circuit patterns of said main wiring board for observing said part or parts through said flexible wiring board adhered thereon with said adhesive material.
References Cited (Backward Citations)
US3712740A
Cited
DE1952273A1
Cited
US3683105A
Cited
US3795047A
Cited
US3912852A
Cited
DE2836092A1
Cited
US4449769A
Cited
US4338149A
Cited
US4495546A
Cited
FR2515917A3
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-06-22 | 1990-12-22 | 1991-06-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-06-22 | 1994-12-22 | 1995-06-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-06-22 | 1998-12-22 | 1999-06-23 | $7700.00 | Window Closed / Lapsed |