Integrated circuit packages

Claim 1

An integrated circuit package comprising: (a) a base part in the form of a rectangular plate having an upper surface, a lower planar surface, and an outer periphery, (b) an integrated circuit element mounted on the upper surface of said base part, (c) a cap part in the form of a rectangular planar portion having a peripheral flange having an inner surface which is a close fit around the outer periphery of said base part, (d) sealing means sealing said planar portion of said cap part to said base part to form an enclosure for said integrated circuit element, (e) connecting leads extending from said integrated circuit element through said sealing means, each said connecting lead having: (f) a first portion extending outwardly with respect to said sealing means between said planar portion of the cap part and the upper surface of the base part, (g) an intermediate portion extending at right angles to said first portion and between the inner surface of said peripheral flange and the outer periphery of said base part, (h) a second portion for connection to other circuit elements extending at right angles to said intermediate portion and outwardly beyond said peripheral flange in a plane which is substantially coplanar and flush with the lower surface of said base part, (i) a pair of respective inner and outer rectangular lead frames spaced apart of each other and both concentrically surrounding said base part, and supporting said second portions of said connecting leads, and (j) said second portions of said connecting leads fanning outwardly in the space between said inner and outer lead frames.