US3673309A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated semiconductor circuit package and method
Assignee: Olivetti SpA
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Filing: 1969-11-03
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Granted: 1972-06-27
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Expires: 1989-11-03
Abstract
Abstract An integrated circuit package features a hermetically sealed cap bonded to a substrate by a printed glass frame. Printed circuit metallization extends under the cap and frame from the central area of the substrate surface to the edge of the surface. Connecting lugs are bonded to this metallization at the extremities of the substrate surface. At the central area of the substrate surface, the means for connecting the inner portion of the metallization to the integrated circuit terminals traverses and insulated support member. The printed metallization paths can cross each other and are insulated by printed insulation at the crossing points.
Inventors
- 👤 Claudio Dalmasso
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 11:19
CPC Classifications
H; H10; H10W; H10W42/00; H10W42/121; H10W70/00; H10W70/40; H10W70/421; H10W70/435; H10W70/60; H10W70/611; H10W70/62; H10W70/65; H10W74/00; H10W74/10; H10W74/111; H10W74/124; H10W76/00; H10W76/40; H10W90/00; H10W90/701; H10W90/811
Claims Analysis
Total Claims: 32
Claim 1
Independent Claim
104 words
In a circuit package containing an active element affixed to a planar substrate and a plurality of conductors printed on said planar substrate and including means for connecting said element to said conductors, the improvement comprising: means for elevating said connecting means above the surface of said element, said elevating means being located on said substrate between said conductors and said element and between said substrate and said connecting means, said active element, said elevating means, and said printed conductors being coplanar in that said element, said elevating means, and said conductors all rest on the same substantially flat portion of said planar substrate.
Claim 2
Dependent Claim
104 words
In a circuit package containing an active element affixed to a planar substrate and a plurality of conductors printed on said planar substrate and including means for connecting said element to said conductors, the improvement comprising: means for elevating said connecting means above the surface of said element, said elevating means being located on said substrate between said conductors and said element and between said substrate and said connecting means, said active element, said elevating means, and said printed conductors being coplanar in that said element, said elevating means, and said conductors all rest on the same substantially flat portion of said planar substrate.
Claim 3
Independent Claim
117 words
A method of assembling a portion of a circuit package including an active semiconductor element supported on a planar substrate and a plurality of electrical conduction paths printed on said planar substrate, wherein the improvement comprises: affixing elevating means on a substantially flat portion of said planar substrate between said paths and said element; and, affixing a plurality of conductors to said element and said paths with said conductors passing over said elevating means, said elevating means being positioned between said element and said paths, said active element, said elevating means, and said paths being co-planar in that said element, elevating means, and conductors all are affixed to the same substantially flat portion of said planar substrate.
Claim 4
Independent Claim
117 words
A method of assembling a portion of a circuit package including an active semiconductor element supported on a planar substrate and a plurality of electrical conduction paths printed on said planar substrate, wherein the improvement comprises: affixing elevating means on a substantially flat portion of said planar substrate between said paths and said element; and, affixing a plurality of conductors to said element and said paths with said conductors passing over said elevating means, said elevating means being positioned between said element and said paths, said active element, said elevating means, and said paths being co-planar in that said element, elevating means, and conductors all are affixed to the same substantially flat portion of said planar substrate.
Claim 5
Dependent Claim
203 words
A semiconductor circuit package for providing protection to enclosed circuit elements and provIding electronic communication paths between an external electronic environment and said elements, said package comprising: a plurality of conductor paths supported by an insulating substrate, said paths comprising a printed film of conductive material; a closed, glass, insulative frame, said frame surrounding said circuit elements and comprising a printed film of glass deposited over said substrate and said conductor paths, said conductor paths extending from the region internal to said frame to the region external to said frame and passing under said frame; a layer of conductive material printed over a portion of said frame; said conductor paths and said conductive layer comprising metal particles in a glass matrix; means electrically connecting said printed conductor paths to said circuit elements, said paths and said circuit elements being bonded to said connecting means; means for elevating said connecting means above the edges of said elements, said elevating means being located on said substrate between said conductor paths and said elements and between said substrate and said connecting means, said elevating means comprising an insulating ring adhesively cemented to said substrate; and, a cap brazed to said conductive layer enclosing said circuit elements.
Claim 6
Dependent Claim
203 words
A semiconductor circuit package for providing protection to enclosed circuit elements and provIding electronic communication paths between an external electronic environment and said elements, said package comprising: a plurality of conductor paths supported by an insulating substrate, said paths comprising a printed film of conductive material; a closed, glass, insulative frame, said frame surrounding said circuit elements and comprising a printed film of glass deposited over said substrate and said conductor paths, said conductor paths extending from the region internal to said frame to the region external to said frame and passing under said frame; a layer of conductive material printed over a portion of said frame; said conductor paths and said conductive layer comprising metal particles in a glass matrix; means electrically connecting said printed conductor paths to said circuit elements, said paths and said circuit elements being bonded to said connecting means; means for elevating said connecting means above the edges of said elements, said elevating means being located on said substrate between said conductor paths and said elements and between said substrate and said connecting means, said elevating means comprising an insulating ring adhesively cemented to said substrate; and, a cap brazed to said conductive layer enclosing said circuit elements.
Claim 7
Dependent Claim
224 words
A semiconductor circuit package for providing protection to enclosed circuit elements and providing electronic communication paths between an external electronic environment and said elements, said package comprising: a plurality of conductor paths supported by an insulating substrate, said paths comprising a printed film of conductive material; a closed, glass, insulative frame, said frame surrounding said circuit elements and comprising a printed film of glass deposited over said substrate and said conductor paths, said conductor paths extending from the region internal to said frame to the region external to said frame and passing under said frame; a layer of conductive material printed over a portion of said frame; said conductor paths and said conductive layer comprising metal particles in a glass matrix; means electrically connecting said printed conductor paths to said circuit elements, said paths and elements being bonded to said connecting means, said connecting means comprising a plurality of metal tongues; means for elevating said connecting means above the edges of said elements, said elevating means being located on said substrate between said conductor paths and said elements and between said substrate and said connecting means, said elevating means comprising a frame of insulating material, said insulating frame being affixed to said tongues and being positioned between said tongues and said substrate; and, a cap brazed to said conductive layer enclosing said circuit elements.
Claim 8
Dependent Claim
224 words
A semiconductor circuit package for providing protection to enclosed circuit elements and providing electronic communication paths between an external electronic environment and said elements, said package comprising: a plurality of conductor paths supported by an insulating substrate, said paths comprising a printed film of conductive material; a closed, glass, insulative frame, said frame surrounding said circuit elements and comprising a printed film of glass deposited over said substrate and said conductor paths, said conductor paths extending from the region internal to said frame to the region external to said frame and passing under said frame; a layer of conductive material printed over a portion of said frame; said conductor paths and said conductive layer comprising metal particles in a glass matrix; means electrically connecting said printed conductor paths to said circuit elements, said paths and elements being bonded to said connecting means, said connecting means comprising a plurality of metal tongues; means for elevating said connecting means above the edges of said elements, said elevating means being located on said substrate between said conductor paths and said elements and between said substrate and said connecting means, said elevating means comprising a frame of insulating material, said insulating frame being affixed to said tongues and being positioned between said tongues and said substrate; and, a cap brazed to said conductive layer enclosing said circuit elements.
Claim 9
Dependent Claim
86 words
In a circuit package containing an active element affixed to a substrate and a plurality of conductors printed on said substrate and including means for connecting said element to said conductors, the improvement comprising: means for elevating said connecting means above the surface of said element, said elevating means being located between said conductors and said element and between said substrate and said connecting means, said elevating means comprising an insulating ring and said connecting means comprising wires, said ring being adhesively bonded to said substrate.
Claim 10
Dependent Claim
86 words
In a circuit package containing an active element affixed to a substrate and a plurality of conductors printed on said substrate and including means for connecting said element to said conductors, the improvement comprising: means for elevating said connecting means above the surface of said element, said elevating means being located between said conductors and said element and between said substrate and said connecting means, said elevating means comprising an insulating ring and said connecting means comprising wires, said ring being adhesively bonded to said substrate.
Claim 11
Dependent Claim
13 words
A package as claimed in claim 5 wherein said insulating ring is plastic.
Claim 12
Dependent Claim
93 words
In a circuit package containing an active element affixed to a substrate and a plurality of conductors printed on said substrate and including means for connecting said element to said conductors, the improvement comprising: means for elevating said connecting means above the surface of said element, said elevating means being located between said conductors and said element and between said substrate and said connecting means, said elevating means comprising an insulating frame and said connEcting means comprising metallic tongues, said tongues being affixed to said frame, said frame being located on said substrate.
Claim 13
Dependent Claim
93 words
In a circuit package containing an active element affixed to a substrate and a plurality of conductors printed on said substrate and including means for connecting said element to said conductors, the improvement comprising: means for elevating said connecting means above the surface of said element, said elevating means being located between said conductors and said element and between said substrate and said connecting means, said elevating means comprising an insulating frame and said connEcting means comprising metallic tongues, said tongues being affixed to said frame, said frame being located on said substrate.
Claim 14
Independent Claim
119 words
A method of assembling a portion of a circuit package including an active semiconductor element supported by a substrate and a plurality of electrical conduction paths printed on said substrate, wherein the improvement comprises: affixing elevating means on said substrate between said paths and said elements, and affixing a plurality of conductors to said element and said paths with said conductors passing over said elevating means, which elevating means is positioned between said element and said paths, said elevating means comprising a frame of insulating material, said conductors comprising wires which are located over said frame after said frame is affixed, said elevating means being placed about said circuit element prior to and independently of said conductor affixing step.
Claim 15
Independent Claim
119 words
A method of assembling a portion of a circuit package including an active semiconductor element supported by a substrate and a plurality of electrical conduction paths printed on said substrate, wherein the improvement comprises: affixing elevating means on said substrate between said paths and said elements, and affixing a plurality of conductors to said element and said paths with said conductors passing over said elevating means, which elevating means is positioned between said element and said paths, said elevating means comprising a frame of insulating material, said conductors comprising wires which are located over said frame after said frame is affixed, said elevating means being placed about said circuit element prior to and independently of said conductor affixing step.
Claim 16
Dependent Claim
19 words
The package according to claim 8, wherein said tongues are bonded to said active element and said printed conductors.
Claim 17
Dependent Claim
47 words
The package according to claim 5, wherein said tongues are bonded to said active element and said printed conductors by means of electrically conductive cement; and, said frame is cemented to said substrate, said active element being affixed to said substrate by said tongues and said frame.
Claim 18
Independent Claim
137 words
A method of assembling a portion of a circuit package including an active semiconductor element supported by a substrate and a plurality of electrical conduction paths printed on said substrate, wherein the improvement comprises: affixing elevating means on said substrate between said paths and said elements and affixing a plurality of conductors to said element and said paths with said conductors passing over said elevating means, which elevating means is positioned between said element and said paths, said plurality of conductors comprising a plurality of metal tongues, said means for elevating comprising an insulating frame; said method including affixing said plurality of metallic tongues to said insulating frame and locating said frame on said substrate after said tongues have been affixed to said frame so that said affixed tongues are aligned with said element and said paths.
Claim 19
Independent Claim
137 words
A method of assembling a portion of a circuit package including an active semiconductor element supported by a substrate and a plurality of electrical conduction paths printed on said substrate, wherein the improvement comprises: affixing elevating means on said substrate between said paths and said elements and affixing a plurality of conductors to said element and said paths with said conductors passing over said elevating means, which elevating means is positioned between said element and said paths, said plurality of conductors comprising a plurality of metal tongues, said means for elevating comprising an insulating frame; said method including affixing said plurality of metallic tongues to said insulating frame and locating said frame on said substrate after said tongues have been affixed to said frame so that said affixed tongues are aligned with said element and said paths.
Claim 20
Dependent Claim
202 words
A circuit package comprising: a. a substrate including a planar surface; b. an active circuit element supported by said surface; c. a plurality of printed conductors supported by said surface, said conductors comprising a printed film including metal particles in a matrix of insulative material; d. a closed frame comprising a film of said insulative material printed over a portion of said substrate and conductors, said frame being limited to leave uncovered the inner and outer ends of said conductors; e. means for connecting said circuit element to said inner ends of said conductors; f. elevating means, located between said element and said inner ends of said conductors and between said substrate surface and said connecting means for elevating said connecting means, said elevating means comprising an insulating ring and said connecting means comprising wires, said ring being at least as thick as said element to support said wires above the surface of said element; g. a protective cap affixed to said closed frame said cap enclosing a region internal to said frame; h. metallic lugs affixed to said uncovered outer ends of said conductors; and i. a protective encapsulation enclosing said package with the exception of outer portions of said lugs.
Claim 21
Dependent Claim
202 words
A circuit package comprising: a. a substrate including a planar surface; b. an active circuit element supported by said surface; c. a plurality of printed conductors supported by said surface, said conductors comprising a printed film including metal particles in a matrix of insulative material; d. a closed frame comprising a film of said insulative material printed over a portion of said substrate and conductors, said frame being limited to leave uncovered the inner and outer ends of said conductors; e. means for connecting said circuit element to said inner ends of said conductors; f. elevating means, located between said element and said inner ends of said conductors and between said substrate surface and said connecting means for elevating said connecting means, said elevating means comprising an insulating ring and said connecting means comprising wires, said ring being at least as thick as said element to support said wires above the surface of said element; g. a protective cap affixed to said closed frame said cap enclosing a region internal to said frame; h. metallic lugs affixed to said uncovered outer ends of said conductors; and i. a protective encapsulation enclosing said package with the exception of outer portions of said lugs.
Claim 22
Dependent Claim
13 words
A package as claimed in claim 12 wherein said insulative material is glass.
Claim 23
Dependent Claim
13 words
A package as claimed in claim 13 wherein said insulating ring is plastic.
Claim 24
Dependent Claim
22 words
The method according to claim 14, wherein said tongues are bonded to said active element and said connecting means by ultrasonic bonding.
Claim 25
Dependent Claim
221 words
A circuit package comprising: a. a substrate including a planar surface; b. an active circuit element supported by said surface; c. a pluraliTy of printed conductors supported by said surface, said conductors comprising a printed film including metal particles in a matrix of non-conductive material; d. a closed frame comprising a film of said non-conductive material printed over a portion of said substrate and conductors, said closed frame being limited to leave uncovered the inner and outer ends of said conductors; e. means for connecting said circuit element to said inner ends of said conductors; f. elevating means, located between said element and said inner ends of said conductors and between said substrate surface and said connecting means for elevating said connecting means, said connecting means comprising metallic tongues, said elevating means comprising an insulating frame, said tongues being affixed to said insulating frame, said insulating frame being affixed to said substrate; g. a protective cap affixed to said closed frame by means of a metallic layer printed on said frame and a metal preform disposed between said metallic layer and said cap, and enclosing a region internal to said closed frame; h. metallic lugs affixed to said uncovered outer ends of said conductors; and i. a protective encapsulation enclosing said package with the exception of outer portions of said lugs.
Claim 26
Dependent Claim
221 words
A circuit package comprising: a. a substrate including a planar surface; b. an active circuit element supported by said surface; c. a pluraliTy of printed conductors supported by said surface, said conductors comprising a printed film including metal particles in a matrix of non-conductive material; d. a closed frame comprising a film of said non-conductive material printed over a portion of said substrate and conductors, said closed frame being limited to leave uncovered the inner and outer ends of said conductors; e. means for connecting said circuit element to said inner ends of said conductors; f. elevating means, located between said element and said inner ends of said conductors and between said substrate surface and said connecting means for elevating said connecting means, said connecting means comprising metallic tongues, said elevating means comprising an insulating frame, said tongues being affixed to said insulating frame, said insulating frame being affixed to said substrate; g. a protective cap affixed to said closed frame by means of a metallic layer printed on said frame and a metal preform disposed between said metallic layer and said cap, and enclosing a region internal to said closed frame; h. metallic lugs affixed to said uncovered outer ends of said conductors; and i. a protective encapsulation enclosing said package with the exception of outer portions of said lugs.
Claim 27
Dependent Claim
13 words
A package as claimed in claim 16 wherein said non-conductive material is glass.
Claim 28
Dependent Claim
13 words
A package as claimed in claim 17 wherein said insulating frame is plastic.
Claim 29
Independent Claim
161 words
A method of making a circuit package including a semiconductor circuit chip affixed to a substrate, comprising: printing a plurality of metallization paths on said substrate, said paths extending from a region adjacent to said chip to a region adjacent to the edge of said substrate; printing a closed frame of insulating material about said chip, said closed frame being printed over said paths leaving exposed the ends of said paths in said regions adjacent to said chip and adjacent to said substrate edge; locating a wire elevation frame on said substrate in said region adjacent to said chip between said paths and said chip; affixing wires over said elevation frame to said paths and said chip; printing a metallic base on a portion of said closed insulating frame; placing a metal preformed element on said base; placing a protective cap in contact with said preformed element; and melting said preformed elements to fix said cap to said closed insulating frame.
Claim 30
Independent Claim
161 words
A method of making a circuit package including a semiconductor circuit chip affixed to a substrate, comprising: printing a plurality of metallization paths on said substrate, said paths extending from a region adjacent to said chip to a region adjacent to the edge of said substrate; printing a closed frame of insulating material about said chip, said closed frame being printed over said paths leaving exposed the ends of said paths in said regions adjacent to said chip and adjacent to said substrate edge; locating a wire elevation frame on said substrate in said region adjacent to said chip between said paths and said chip; affixing wires over said elevation frame to said paths and said chip; printing a metallic base on a portion of said closed insulating frame; placing a metal preformed element on said base; placing a protective cap in contact with said preformed element; and melting said preformed elements to fix said cap to said closed insulating frame.
Claim 31
Independent Claim
196 words
A method of making a circuit package including a semiconductor circuit chip affixed to a substrate, comprising: printing a plurality of metallization paths on said substrate, said paths extending from a region adjacent to said chip to a region adjacent to the edge of said substrate; printing a closed frame of insulating material about said chip, said closed frame being printed over said paths leaving exposed the ends of said paths in said regions adjacent to said chip and adjacent to said substrate edge; affixing a plurality of metal tongues to an insulating elevation frame, said tongues and said elevation frame forming a unitary structure, said tongues being disposed to correspond with the relative locations of said paths and said chip; affixing said unitary structure to said substrate, said chip, and said paths, said elevation frame being affixed to said substrate, and said tongues being affixed to said chip and said paths; printing a metallic base on a portion of said closed insulating frame; placing a metal performed element on said base; placing a protective cap in contact with said preformed elements; and melting said preformed elements to fix said cap to said closed insulating frame.
Claim 32
Independent Claim
196 words
A method of making a circuit package including a semiconductor circuit chip affixed to a substrate, comprising: printing a plurality of metallization paths on said substrate, said paths extending from a region adjacent to said chip to a region adjacent to the edge of said substrate; printing a closed frame of insulating material about said chip, said closed frame being printed over said paths leaving exposed the ends of said paths in said regions adjacent to said chip and adjacent to said substrate edge; affixing a plurality of metal tongues to an insulating elevation frame, said tongues and said elevation frame forming a unitary structure, said tongues being disposed to correspond with the relative locations of said paths and said chip; affixing said unitary structure to said substrate, said chip, and said paths, said elevation frame being affixed to said substrate, and said tongues being affixed to said chip and said paths; printing a metallic base on a portion of said closed insulating frame; placing a metal performed element on said base; placing a protective cap in contact with said preformed elements; and melting said preformed elements to fix said cap to said closed insulating frame.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-06-27 | 1975-12-27 | 1976-06-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-06-27 | 1979-12-27 | 1980-06-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-06-27 | 1983-12-27 | 1984-06-27 | $7700.00 | Window Closed / Lapsed |