Non-sintering epoxy resins prepared from triglycidyl ethers and epihalohydrins

Claim 2

A solid, non-sintering epoxy resin represented by the following formula ##STR4## wherein Q is a trivalent aliphatic, cycoaliphatic or aromatic hydrocarbon group having from 1 to about 12 carbon atoms; each R is independently hydrogen or an alkyl group having from 1 to about 3 carbon atoms; each R' is independently hydrogen or a hydrocarbyl group having from 1 to about 12 carbon atoms; and each X is independently hydrogen, a monovalent hydrocarbyl group having from 1 to about 6 carbon atoms or a halogen; and n has an average value from 1 to about 3.

Claim 3

A solid, non-sintering epoxy resin which results from reacting in the presence or absence of a solvent at least one trihydric phenol and at least one epihalohydrin in the presence of an alkali metal hydroxide wherein the components are employed in amounts which provide a ratio of the equivalents of epihalohydrin to equivalents of phenolic hydroxide of not greater than about 1.5:1 and a ratio of equivalents of alkali metal hydroxide to phenolic hydroxyl is from about 0.8:1 to about 1.2:1.

Claim 4

A solid, non-sintering epoxy resin which results from reacting in the presence or absence of a solvent at least one trihydric phenol and at least one epihalohydrin in the presence of an alkali metal hydroxide wherein the components are employed in amounts which provide a ratio of the equivalents of epihalohydrin to equivalents of phenolic hydroxide of not greater than about 1.5:1 and a ratio of equivalents of alkali metal hydroxide to phenolic hydroxyl is from about 0.8:1 to about 1.2:1.

Claim 5

A solid, non-sintering epoxy resin of claim 2 wherein the components are employed in amounts which provide a ratio of the equivalents of epihalohydrin to equivalents of phenolic hydroxyl of from about 1.3:1 to about 1.5:1 and a ratio of equivalents of alkali metal hydroxide to phenolic hydroxyl is from about 0.85:1 to about 1.1:1.

Claim 6

A solid, non-sintering epoxy resin of claim 3 wherein the components are employed in amounts which provide a ratio of the equivalents of epihalohydrin to equivalents of phenolic hydroxyl of from about 1.4:1 to about 1.5:1 and a ratio of equivalents of alkali metal hydroxide to phenolic hydroxyl is from about 0.9:1 to about 1.0:1.

Claim 7

A solid, non-sintering epoxy resin of claim 4 wherein said epihalohydrin is epichlorohydrin, said trihydric phenol is 1,1,1-tri(hydroxyphenyl)methane and said alkali metal hydroxide is sodium hydroxide.

Claim 8

A process for preparing solid, non-sintering epoxy resins from trihydric phenols and epihalohydrins which process comprises reacting at least one trihydric phenol with at least one epihalohydrin optionally in the presence of at least one suitable solvent while intermittently or continuously adding aqueous alkali metal hydroxide to the reaction mixture and continuously removing water by azeotroping and/or codistilling with the epihalohydrin and/or a suitable solvent, subsequently removing any unreacted epihalohydrin and solvent and water washing the resultant product to remove any alkali metal halide salt therefrom and recovering the resultant solid, non-sintering epoxy resin having a Mettler softening point of at least 78° C. and wherein the components are employed in amounts which provide a ratio of the equivalents of epihalohydrin to equivalents of phenolic hydroxide of not greater than 1.5:1 and a ratio of equivalents of alkali metal hydroxide to phenolic hydroxyl is from about 0.9:1 to about 1.1:1 and the reaction is conducted at a temperature of from about 55° C. to about 80° C.

Claim 9

A process for preparing solid, non-sintering epoxy resins from trihydric phenols and epihalohydrins which process comprises reacting at least one trihydric phenol with at least one epihalohydrin optionally in the presence of at least one suitable solvent while intermittently or continuously adding aqueous alkali metal hydroxide to the reaction mixture and continuously removing water by azeotroping and/or codistilling with the epihalohydrin and/or a suitable solvent, subsequently removing any unreacted epihalohydrin and solvent and water washing the resultant product to remove any alkali metal halide salt therefrom and recovering the resultant solid, non-sintering epoxy resin having a Mettler softening point of at least 78° C. and wherein the components are employed in amounts which provide a ratio of the equivalents of epihalohydrin to equivalents of phenolic hydroxide of not greater than 1.5:1 and a ratio of equivalents of alkali metal hydroxide to phenolic hydroxyl is from about 0.9:1 to about 1.1:1 and the reaction is conducted at a temperature of from about 55° C. to about 80° C.

Claim 10

A process of claim 6 wherein the components are employed in amounts which provide a ratio of the equivalents of epihalohydrin to equivalents of phenolic hydroxide of from about 1.4:1 to about 1.5:1 and a ratio of equivalents of alkali metal hydroxide to phenolic hydroxyl is from about 0.9:1 to about 1.0:1.

Claim 11

A process of claim 7 wherein the components are employed in amounts which provide a ratio of the equivalents of epihalohydrin to equivalents of phenolic hydroxide of from about 1.4:1 to about 1.5:1 and a ratio of equivalents of alkali metal hydroxide to phenolic hydroxyl is from about 0.9:1 to about 1.0:1.

Claim 12

A process of claim 8 wherein said epihalohydrin is epichlorohydrin, said trihydric phenol is 1,1,1-tri(hydroxyphenyl)methane and said alkali metal hydroxide is sodium hydroxide and the reaction is conducted in the presence of methyl isobutyl ketone or toluene.

Claim 13

A curable composition which comprises (1) an epoxy resin of claim 1 and a curing quantity of a suitable curing agent for the epoxy resin.

Claim 14

A curable composition which comprises (1) an epoxy resin of claim 2 and a curing quantity of a suitable curing agent for the epoxy resin.

Claim 15

A curable composition which comprises (1) an epoxy resin of claim 3 and a curing quantity of a suitable curing agent for the epoxy resin.

Claim 16

A curable composition which comprises (1) an epoxy resin of claim 4 and a curing quantity of a suitable curing agent for the epoxy resin.

Claim 17

A curable composition which comprises (1) an epoxy resin of claim 5 and a curing quantity of a suitable curing agent for the epoxy resin.

Claim 18

The composition resulting from subjecting the curable composition of claim 10 to conditions sufficient to effect a cure.

Claim 19

The composition resulting from subjecting the curable composition of claim 11 to conditions sufficient to effect a cure.

Claim 20

The composition resulting from subjecting the curable composition of claim 12 to conditions sufficient to effect a cure.

Claim 21

The composition resulting from subjecting the curable composition of claim 13 to conditions sufficient to effect a cure.

Claim 22

The composition resulting from subjecting the curable composition of claim 14 to conditions sufficient to effect a cure.