Patent US2941664A successfully refreshed from Google Patents.
Patent US4670347A successfully refreshed from Google Patents.
US4670347A
Expired / Lapsed
US
⏱️ 0.0 years remaining
RFI/EMI shielding apparatus
Assignee: TOPFLIGHT CORP YORK PA A CORP OF PA
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Filing: 1986-03-12
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Granted: 1987-06-02
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Expires: 2006-03-12
Abstract
Abstract An article of manufacture, and process of producing same, which is utilized for the enhanced attenuation of circuit generated radio frequency and electromagnetic interference, i.e. RFI and EMI. The article of manufacture comprises a centrally disposed silver shielding conductive layer which captures circuit produced electromagnetic radiation and directs same to ground so that it does not affect the environment surrounding the electronic circuitry. The process of producing the article involves the silk screen printing of a silver-solvent compound onto a lower polyester-plastics material thus obviating the need for an adhesive between the silver conductive layer and the lower polyester material. The invention also includes the use of the particular article as a shield for the attenuation of circuit produced radiation.
Inventors
- 👤 Dennis Z. Lasik
- 👤 Michael F. Roman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 01:43
CPC Classifications
H; H05; H05K; H05K9/00; H05K9/0066; G; G01; G01R; G01R1/00; G01R1/02; G01R1/18; H01; H01R; H01R13/00; H01R13/648; H01R13/658; H01R13/6598; H01R13/6599; H10; H10W; H10W42/00; H10W42/20; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10S428/922; Y10S428/9265; Y10S428/928; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31678; Y10T428/31681
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
212 words
A method of making an RFI/EMI shield means (10) for placement around operative electronic circuitry (30) and within a housing (20) which surrounds said electronic circuitry, said method comprising the following steps. (a) providing a prestressed lower polyester plastics layer (11), (b) applying a conductive layer of silver (12) to said lower polyester plastic layer by means of a silk screen printing process wherein said silver conductive layer (12) is applied to said lower polyester plastic layer (11) in liquid ink form which includes binders and solvents for use in the silk screen printing process, (c) curing by heat treatment the combined layers of polyester plastic (11) and conductive silver (12), (d) applying an adhesive layer (13) to said conductive silver layer (12), (e) applying an upper polyester plastic layer (14) to said adhesive layer (13) such that the conductive silver layer (12) is confined within the edge means (15) of said upper and lower polyester plastic layers (11, 14), (f) die cutting and scoring said shield means (10) so as to fit into a desired electronic housing (20), (g) installing said shield means (10) into said electonic housing (20) to reduce the harmful radiation emanating from said electronic circuitry when in operation, said silver conductive layer being connected to electrical ground.
Claim 2
Independent Claim
212 words
A method of making an RFI/EMI shield means (10) for placement around operative electronic circuitry (30) and within a housing (20) which surrounds said electronic circuitry, said method comprising the following steps. (a) providing a prestressed lower polyester plastics layer (11), (b) applying a conductive layer of silver (12) to said lower polyester plastic layer by means of a silk screen printing process wherein said silver conductive layer (12) is applied to said lower polyester plastic layer (11) in liquid ink form which includes binders and solvents for use in the silk screen printing process, (c) curing by heat treatment the combined layers of polyester plastic (11) and conductive silver (12), (d) applying an adhesive layer (13) to said conductive silver layer (12), (e) applying an upper polyester plastic layer (14) to said adhesive layer (13) such that the conductive silver layer (12) is confined within the edge means (15) of said upper and lower polyester plastic layers (11, 14), (f) die cutting and scoring said shield means (10) so as to fit into a desired electronic housing (20), (g) installing said shield means (10) into said electonic housing (20) to reduce the harmful radiation emanating from said electronic circuitry when in operation, said silver conductive layer being connected to electrical ground.
Claim 3
Dependent Claim
223 words
An RFI/EMI shielding apparatus (10) for placement around operative electronic circuitry (30) and within a housing (20) which surrounds said electronic circuitry, said shielding apparatus (10) comprising: a lower polyester plastics layer (11), a silver conductive layer (12) being printed onto said lower plastic layer (11) by means of a silk screen printing process, an adhesive layer (13) being superimposed on said silver conductive layer (12), an upper polyester plastics layer (14) being superimposed onto said adhesive layer (13) for protection of said silver conductive layer (12) upon placement in said electonic housing (20), means for electically grounding said silver conductive layer means (12) whereby harmful radiation emanating from said electronic circuitry (30) is captured and directed to ground to reduce the envitonmental impact of radiation emanating from said operational electronic circuitry (30), wherein said silver conductive layer (12) is confined within the edges (15) of said upper and lower polyester plastic layers (11, 14), said silver conductive layer being accurately deposited within the edges (15) of said lower plastic layer (11) by means of said silk screen printing process, wherein said silver conductive layer (12) is applied to said lower polyester plastic layer (11) in ink form including binders and solvents in the course of the silk screen printing application of said silver conductive layer (12) onto said lower plastic layer (11).
Claim 4
Dependent Claim
223 words
An RFI/EMI shielding apparatus (10) for placement around operative electronic circuitry (30) and within a housing (20) which surrounds said electronic circuitry, said shielding apparatus (10) comprising: a lower polyester plastics layer (11), a silver conductive layer (12) being printed onto said lower plastic layer (11) by means of a silk screen printing process, an adhesive layer (13) being superimposed on said silver conductive layer (12), an upper polyester plastics layer (14) being superimposed onto said adhesive layer (13) for protection of said silver conductive layer (12) upon placement in said electonic housing (20), means for electically grounding said silver conductive layer means (12) whereby harmful radiation emanating from said electronic circuitry (30) is captured and directed to ground to reduce the envitonmental impact of radiation emanating from said operational electronic circuitry (30), wherein said silver conductive layer (12) is confined within the edges (15) of said upper and lower polyester plastic layers (11, 14), said silver conductive layer being accurately deposited within the edges (15) of said lower plastic layer (11) by means of said silk screen printing process, wherein said silver conductive layer (12) is applied to said lower polyester plastic layer (11) in ink form including binders and solvents in the course of the silk screen printing application of said silver conductive layer (12) onto said lower plastic layer (11).
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-06-01 | 1990-12-01 | 1991-06-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-06-01 | 1994-12-01 | 1995-06-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-06-01 | 1998-12-01 | 1999-06-02 | $7700.00 | Window Closed / Lapsed |