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US4668471A
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Copper alloy lead material for leads of a semiconductor device
Assignee: TAMAGAWA KIKAI KINZOKU NO 6-2 GINZA 1-CHOME CHUO-KU TOKYO JAPAN A CORP OF JAPAN KK
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Filing: 1985-12-17
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Granted: 1987-05-26
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Expires: 2005-12-17
Abstract
Abstract A copper alloy lead material for leads of a semiconductor device, which consists essentially of from 2 to 2.4 percent by weight iron, from 0.001 to 0.1 percent by weight phosphorus, from 0.01 to 1 percent by weight zinc, from 0.001 to 0.1 percent by weight magnesium, and the balance of copper and inevitable impurities. The copper alloy lead material possesses satisfactory properties such as elongation and electrical conductivity required of a material for leads in a semiconductor device, and further exhibits excellent strength and heat resistance enough to be used as leads in semiconductor devices having high wiring densities, and at the same time possesses improved soldering reliability to the substrate of the semiconductor device as compared to a conventional copper alloy lead material.
Inventors
- 👤 Rensei Futatsuka
- 👤 Seiji Kumagai
- 👤 Masuhiro Izumida
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 23:52
CPC Classifications
C; C22; C22C; C22C9/00; H; H10; H10W; H10W70/00; H10W70/40; H10W70/456; H10W72/00; H10W72/01; H10W72/0198
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
55 words
A copper alloy lead material. for leads of a semiconductor device, which consists essentially of from 2 to 2.4 percent by weight iron, from 0.001 to 0.1 percent by weight phosphorus, from 0.01 to 1 percent by weight zinc, from 0.001 to 0.1 percent by weight magnesium, and the balance of copper and inevitable impurities.
Claim 2
Dependent Claim
55 words
A copper alloy lead material. for leads of a semiconductor device, which consists essentially of from 2 to 2.4 percent by weight iron, from 0.001 to 0.1 percent by weight phosphorus, from 0.01 to 1 percent by weight zinc, from 0.001 to 0.1 percent by weight magnesium, and the balance of copper and inevitable impurities.
Claim 3
Independent Claim
218 words
A method of using a copper alloy as leads of a semiconductor device, comprising the steps of: (a) melting said copper alloy into a molten copper alloy having a predetermined chemical composition; (b) preparing a material for leads from said molten copper alloy; (c) forming said material for leads into a lead frame having a shape suitable for use in said semiconductor device which is to be manufactured; (d) mounting semiconductor chips on said lead frame at its predetermined surface portions; (e) connecting elements of said semiconductor chips to said lead frame by wire bonding; (f) encapsulating at least said semiconductor chips, wire bonding portions, and said surface portions of said lead frame on which said semiconductor chips have been mounted; (g) cutting said lead frame along boundaries between adjacent ones of said semiconductor chip-mounted surface portions, to form leads of said semiconductor device; and (h) plating at least part of surfaces of said leads by a solder, so as to enable soldering of said leads to the substrate of said semiconductor device, said copper alloy consisting essentially of from 2 to 2.4 percent by weight iron, from 0.001 to 0.1 percent by weight phosphorus 0.01 to 1 percent by weight zinc, from 0.001 to 0.1 percent by weight magnesium, and the balance of copper and inevitable impurities.
Claim 4
Independent Claim
218 words
A method of using a copper alloy as leads of a semiconductor device, comprising the steps of: (a) melting said copper alloy into a molten copper alloy having a predetermined chemical composition; (b) preparing a material for leads from said molten copper alloy; (c) forming said material for leads into a lead frame having a shape suitable for use in said semiconductor device which is to be manufactured; (d) mounting semiconductor chips on said lead frame at its predetermined surface portions; (e) connecting elements of said semiconductor chips to said lead frame by wire bonding; (f) encapsulating at least said semiconductor chips, wire bonding portions, and said surface portions of said lead frame on which said semiconductor chips have been mounted; (g) cutting said lead frame along boundaries between adjacent ones of said semiconductor chip-mounted surface portions, to form leads of said semiconductor device; and (h) plating at least part of surfaces of said leads by a solder, so as to enable soldering of said leads to the substrate of said semiconductor device, said copper alloy consisting essentially of from 2 to 2.4 percent by weight iron, from 0.001 to 0.1 percent by weight phosphorus 0.01 to 1 percent by weight zinc, from 0.001 to 0.1 percent by weight magnesium, and the balance of copper and inevitable impurities.
Claim 5
Dependent Claim
54 words
A semiconductor device having leads said leads comprising a copper alloy consisting essentially of from 2 to 2.4 percent by weight iron, from 0.001 to 0.1 percent by weight phosphorus, from 0.01 to 1 percent by weight zinc, from 0.001 to 0.1 percent by weight magnesium, and the balance of copper and inevitable impurities.
Claim 6
Dependent Claim
54 words
A semiconductor device having leads said leads comprising a copper alloy consisting essentially of from 2 to 2.4 percent by weight iron, from 0.001 to 0.1 percent by weight phosphorus, from 0.01 to 1 percent by weight zinc, from 0.001 to 0.1 percent by weight magnesium, and the balance of copper and inevitable impurities.
Claim 7
Dependent Claim
52 words
The semiconductor of claim 3 wherein said copper alloy consists essentially of from 2.02 to 2.39 percent by weight iron, from 0.0018 to 0.097 percent by weight phosphorus, from 0.012 to 0.960 percent by weight zinc, from 0.002 to 0.098 percent by weight magnesium, and the balance of copper and inevitable impurities.
Claim 8
Dependent Claim
26 words
The semiconductor device of claim 4 wherein said copper alloy contains 2.02 percent by weight iron, 0.0018 percent phosphorus, 0.012 percent zinc and 0.002 percent magnesium.
Claim 9
Dependent Claim
26 words
The semiconductor device of claim 4 wherein said copper alloy contains 2.08 percent by weight iron, 0.011 percent phosphorus, 0.022 percent zinc and 0.013 percent magnesium.
Claim 10
Dependent Claim
26 words
The semiconductor device of claim 4 wherein said copper alloy contains 2.14 percent by weight iron, 0.020 percent phosphorus, 0.087 percent zinc and 0.025 percent magnesium.
Claim 11
Dependent Claim
26 words
The semiconductor device of claim 4 wherein said copper alloy contains 2.21 percent by weight iron, 0.036 percent phosphorus, 0.190 percent zinc and 0.054 percent magnesium.
Claim 12
Dependent Claim
26 words
The semiconductor device of claim 4 wherein said copper alloy contains 2.32 percent by weight iron, 0.064 percent phosphorus, 0.680 percent zinc and 0.071 percent magnesium.
Claim 13
Dependent Claim
26 words
The semiconductor device of claim 4 wherein said copper alloy contains 2.39 percent by weight iron, 0.097 percent phosphorus, 0.960 percent zinc and 0.098 percent magnesium.
Claim 14
Dependent Claim
61 words
The copper alloy lead material for leads of a semiconductor device of claim 1 wherein said copper alloy consists essentially of from 2.02 to 2.39 percent by weight iron, from 0.0018 to 0.097 percent by weight phosphorus, from 0.012 to 0.960 percent by weight zinc, from 0.002 to 0.098 percent by weight magnesium, and the balance of copper and inevitable impurities.
Claim 15
Dependent Claim
34 words
The copper alloy lead material for leads of a semiconductor device of claim 11 wherein said copper alloy contains 2.02 percent by weight iron, 0.018 percent phosphorus, 0.012 percent zinc and 0.002 percent magnesium.
Claim 16
Dependent Claim
33 words
The copper alloy lead material for leads of a semiconductor device of claim 11 wherein said copper alloy 2.08 percent by weight iron, 0.011 percent phosphorus, 0.022 percent zinc and 0.013 percent magnesium.
Claim 17
Dependent Claim
34 words
The copper alloy lead material for leads of a semiconductor device of claim 11 wherein said copper alloy contains 2.14 percent by weight iron, 0.020 percent phosphorus, 0.087 percent zinc and 0.025 percent magnesium.
Claim 18
Dependent Claim
34 words
The copper alloy lead material for leads of a semiconductor device of claim 11 wherein said copper alloy contains 2.21 percent by weight iron, 0.036 percent phosphorus, 0.190 percent zinc and 0.054 percent magnesium.
Claim 19
Dependent Claim
34 words
The copper alloy lead material for leads of a semiconductor device of claim 11 wherein said copper alloy contains 2.32 percent by weight iron, 0.064 percent phosphorus, 0.680 percent zinc and 0.071 percent magnesium.
Claim 20
Dependent Claim
34 words
The copper alloy lead material for leads of a semiconductor device of claim 11 wherein said copper alloy contains 2.39 percent by weight iron, 0.097 percent phosphorus, 0.960 percent zinc and 0.098 percent magnesium.
References Cited (Backward Citations)
US4269623A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1990-05-25 | 1990-11-24 | 1991-05-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-05-25 | 1994-11-24 | 1995-05-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-05-25 | 1998-11-24 | 1999-05-26 | $7700.00 | Window Closed / Lapsed |