Means for handling semiconductor die and the like

Claim 2

A carrier for handling semiconductor chips, wafers, or like objects, said carrier comprising a surface-texturized, fibrous, porous fabric sheet, means for supporting said fabric sheet in a substantially flat condition, an air-impermeable flexible sheet overlying the flat fabric sheet, the overlying flexible sheet having an outer substantially flat surface for support of objects in intimate surface contact therewith, the objects and flexible sheet being held to one another by intimate surface contact and resultant interfacial forces therebetween, means substantially surrounding at least a portion of said fabric sheet upon which objects are supported through the overlying air-impermeable flexible sheet for providing a substantially vacuum-tight seal between the supporting means and air-impermeable flexible sheet, and means for reducing the pressure of gas at said fabric sheet for drawing portions of said flexible sheet into openings in the fabric sheet for withdrawal of portions of the flexible sheet from the objects without the formation of a vacuum between said objects and flexible sheet, surface contact and resultant interfacial forces between the flexible sheet and objects being reduced by said withdrawal of portions of the flexible sheet from the objects to facilitate removal of objects from the flexible sheet.

Claim 3

A carrier as defined in claim 1 wherein said fabric sheet comprises a woven fabric.

Claim 4

A carrier as defined in claim 1 wherein said fabric sheet comprises a knit fabric.

Claim 5

A carrier as defined in claim 1 wherein fibers included in said fabric sheet comprise monofilaments.

Claim 6

A carrier as defined in claim 1 wherein fibers included in said fabric sheet comprise multifilaments.

Claim 7

A carrier as defined in claim 1 wherein fibers included in said fabric sheet comprise yarns.

Claim 8

A carrier as defined in claim 1 wherein said supporting means includes a plane surface upon which said fabric sheet is supported.

Claim 9

A carrier as defined in claim 7 wherein said means for reducing the pressure of gas at said fabric sheet includes means for connecting said fabric sheet to a vacuum source through at least one aperture formed in said supporting means.

Claim 10

A carrier as defined in claim 7 including means forming a plurality of apertures in the plane surface of the supporting means for connection of the fabric sheet to a vacuum source.

Claim 11

A carrier as defined in claim 1 wherein said fabric comprises crossing fibers which pass over and under each other at spaced crossovers, said fabric sheet being supported at crossovers on said supporting means, and said flexible sheet being supported in a flat condition at fabric crossovers.

Claim 12

A carrier as defined in claim 10 wherein said fabric sheet comprises a woven fabric.

Claim 13

A carrier as defined in claim 10 wherein said fabric sheet comprises a knit fabric.

Claim 14

A carrier as defined in claim 10 wherein said fabric sheet is attached at crossover points to said flexible sheet.

Claim 15

A carrier for handling semiconductor chips, wafers, or like objects, said carrier comprising, a porous fabric having generally regularly spaced fiber crossovers at which the fabric is thicker than between crossovers, means for supporting at least a portion of said fabric in a generally flat condition, air-impermeable flexible sheet means engaged with the flat portion of the fabric at fabric crossovers for support of an object in intimate surface contact with the flexible sheet means, the flexible sheet means being located between the supported object and flat portion of the fabric, means substantially surrounding at least a portion of said porous fabric engaged with the air-impermeable flexible sheet for providing a substantially vacuum-tight seal between the supporting means and air-impermeable flexible sheet, and means for reducing the pressure of gas at the fabric for drawing portions of the flexible sheet means over crossovers of the fabric for withdrawing portions of the flexible sheet means from the objects without the formation of a vacuum between said objects and flexible sheet means, surface contact and resultant interfacial forces between the flexible sheet means and supported object being reduced by said withdrawal of portions of the flexible sheet means from the object to facilitate removal of the object from the flexible sheet means.

Claim 16

A carrier for handling semiconductor chips, wafers, or like objects, said carrier comprising, a porous fabric having generally regularly spaced fiber crossovers at which the fabric is thicker than between crossovers, means for supporting at least a portion of said fabric in a generally flat condition, air-impermeable flexible sheet means engaged with the flat portion of the fabric at fabric crossovers for support of an object in intimate surface contact with the flexible sheet means, the flexible sheet means being located between the supported object and flat portion of the fabric, means substantially surrounding at least a portion of said porous fabric engaged with the air-impermeable flexible sheet for providing a substantially vacuum-tight seal between the supporting means and air-impermeable flexible sheet, and means for reducing the pressure of gas at the fabric for drawing portions of the flexible sheet means over crossovers of the fabric for withdrawing portions of the flexible sheet means from the objects without the formation of a vacuum between said objects and flexible sheet means, surface contact and resultant interfacial forces between the flexible sheet means and supported object being reduced by said withdrawal of portions of the flexible sheet means from the object to facilitate removal of the object from the flexible sheet means.

Claim 17

A carrier as defined in claim 14 wherein the fabric is woven.

Claim 18

A carrier as defined in claim 14 wherein the fabric is knit.