US3707760A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and device for article working such as fracturing of semiconductor slices and separating semiconductor chips
Assignee: Sieburg Ind Inc
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Filing: 1971-05-19
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Granted: 1973-01-02
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Expires: 1991-05-19
Abstract
Abstract A method and device for separating semiconductor chips are described. A heat-actuated self-expandable substrate material is provided with an expanded memorized shape. Semiconductor chips in their compact array position are supported by the self-expandable substrate which upon heating thereof expands to its memorized shape to separate the chips from one another. Several selfexpandable substrate configurations are shown and an apparatus for scribing and fracturing of a semiconductor slice and separating the chips from their compact position in the fractured array is described. The self-expandable substrate material is characterized by its accurately predictable expansion to provide uniform chip separations suitable for subsequent handling.
Inventors
- 👤 P Citrin
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 06:32
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0428; H10P72/0442; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49789; Y10T29/4979; Y10T29/51; Y10T29/5176
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
54 words
A method of separating articles from a compact position in an array comprising the steps of supporting the articles with a self-expandable substrate of a reduced size and having an expanded shape memory, and heating the self-expandable substrate to cause a self-expansion thereof to its memorized shape and separate the articles from one another.
Claim 2
Independent Claim
54 words
A method of separating articles from a compact position in an array comprising the steps of supporting the articles with a self-expandable substrate of a reduced size and having an expanded shape memory, and heating the self-expandable substrate to cause a self-expansion thereof to its memorized shape and separate the articles from one another.
Claim 3
Dependent Claim
41 words
The method of separating articles from a compact position in an array as claimed in claim 1 wherein the supporting step includes mounting a compact array of the articles with a low tack adhesive on a surface of the self-expandable substrate.
Claim 4
Dependent Claim
52 words
The method of separating articles from a compact position in an array as claimed in claim 2 wherein said mounting step is foLlowed by the steps of scribing the array of articles to define fracture lines and applying pressure on the array of articles to fracture the array along the scribe lines.
Claim 5
Independent Claim
69 words
A method of separating semiconductor chips from their compacted position in a fractured semiconductor slice comprising the steps of supporting the chips in their compact positions with a heat-actuated self-expandable substrate having a memorized expanded shape, applying heat to the self-expandable substrate to cause an expansion thereof to the memorized expanded shape and separate the substrate supported semiconductor chips from one another upon the self expansion of said substrate.
Claim 6
Independent Claim
69 words
A method of separating semiconductor chips from their compacted position in a fractured semiconductor slice comprising the steps of supporting the chips in their compact positions with a heat-actuated self-expandable substrate having a memorized expanded shape, applying heat to the self-expandable substrate to cause an expansion thereof to the memorized expanded shape and separate the substrate supported semiconductor chips from one another upon the self expansion of said substrate.
Claim 7
Dependent Claim
49 words
The method of separating semiconductor chips as claimed in claim 4 and further including the step of forming a compressed heat-actuated self expandable substrate with a memorized expanded shape selected commensurate with the dimensions of the slice and number of chips to be separated upon heating of the substrate.
Claim 8
Dependent Claim
31 words
The method of separating semiconductor chips as claimed in claim 5 wherein the forming step includes forming a heat-actuated self-expandable substrate of rectangular shape with an enlarged rectangular expanded shape memory.
Claim 9
Dependent Claim
34 words
The method of separating semiconductor chips as claimed in claim 5 wherein the forming step includes forming a head-actuated self-expandable substrate having a disc shape with a correspondingly radially enlarged expanded disc shape memory.
Claim 10
Dependent Claim
63 words
The method of separating semiconductor chips as claimed in claim 5 wherein the forming step includes forming a compressed heat-actuated self-expanded substrate having a ring shape with an enlarged expanded ring shape memory, connecting an expandable membrane over a side of the ring substrate with said semiconductor chips supported by the membrane, whereby said membrane is expanded upon the expansion of the ring.
Claim 11
Dependent Claim
81 words
The method of separating semiconductor chips as claimed in claim 4 and further including the steps of forming a heat-actuated self-expandable substrate material having a memorized expanded shape selected to provide accurate and predetermined separation of said semiconductor chips when expanded by the application of heat to memorized expanded shape and working said heat-actuated self-expandable substrate to reduce the size of a chip supporting side thereof by an amount commensurate with producing said accurate and predetermined chip separations upon substrate expansion.
Claim 12
Independent Claim
116 words
A method of working semiconductor slices comprising the steps of supporting a semiconductor slice having a plurality of semiconductor elements arranged in an array with a heat-actuated self-expandable substrate material of reduced size and having a predetermined expanded shape memory, scribing the slice while supported by the self-expandable substrate material and severing the slice along the scribe lines to isolate the semiconductor elements on chips located in a compact array on the self-expandable substrate material, applying heat to the self-expandable substrate material to expand it to its predetermined memorized expanded shape and separate the severed chips from one another while retaining their relative positions and orientation in the array for subsequent ease of removal and use.
Claim 13
Independent Claim
116 words
A method of working semiconductor slices comprising the steps of supporting a semiconductor slice having a plurality of semiconductor elements arranged in an array with a heat-actuated self-expandable substrate material of reduced size and having a predetermined expanded shape memory, scribing the slice while supported by the self-expandable substrate material and severing the slice along the scribe lines to isolate the semiconductor elements on chips located in a compact array on the self-expandable substrate material, applying heat to the self-expandable substrate material to expand it to its predetermined memorized expanded shape and separate the severed chips from one another while retaining their relative positions and orientation in the array for subsequent ease of removal and use.
Claim 14
Dependent Claim
82 words
The method of working semiconductor slices as claimed in claim 10 and further including the steps of forming a heat-actuated self-expandable substrate material having a memorized expanded shape selected to provide accurate and predetermined separation of said semiconductor chips when expanded by the application of heat to the memorized expanded shape and working said heat-actuated self-expandable substrate to reduce the size of a chip supporting side thereof by an amount commensurate with producing said accurate and predetermined chip separations upon substrate expansion.
Claim 15
Independent Claim
71 words
A device for separating semiconductor chips from their compacted position in an array comprisiNg a heat-actuated self-expandable substrate material having a memorized expanded shape selected to provide separation of substrate supported semiconductor chips when expanded by the application of heat to the memorized expanded shape, said self-expandable substrate material having the chip supporting side reduced by an amount commensurate with producing said chip separation upon substrate expansion to the memorized shape.
Claim 16
Independent Claim
71 words
A device for separating semiconductor chips from their compacted position in an array comprisiNg a heat-actuated self-expandable substrate material having a memorized expanded shape selected to provide separation of substrate supported semiconductor chips when expanded by the application of heat to the memorized expanded shape, said self-expandable substrate material having the chip supporting side reduced by an amount commensurate with producing said chip separation upon substrate expansion to the memorized shape.
Claim 17
Dependent Claim
23 words
The device for separating semiconductor chips as claimed in claim 12 wherein the memorized expanded shape is in the form of a dome.
Claim 18
Dependent Claim
23 words
The device for separating semiconductor chips as claimed in claim 12 wherein the memorized expanded shape is in the form of a disc.
Claim 19
Dependent Claim
20 words
The device for separating semiconductor chips as claimed in claim 14 wherein the memorized expanded shape has a rectangular form.
Claim 20
Independent Claim
121 words
An apparatus for working a semiconductor slice having a plurality of semiconductor elements arranged in a compact array with the semiconductor chips to be separated with preserved array orientation comprising means for supporting the semiconductor chips, said supporting means including a heat actuated self-expandable substrate material with a generally flat chip supporting surface, said self-expandable substrate having a memorized expanded dome-shape selected to provide an expanded dome shape chip supporting surface upon heating of the substrate, means for producing a flexible uniformly distributed force against the generally flat chip supporting substrate surface, and means for heating the self-expandable substrate to cause dome-shape expansion thereof against the pressure producing means to fracture the semiconductor slice and separate the chips from one another.
Claim 21
Independent Claim
121 words
An apparatus for working a semiconductor slice having a plurality of semiconductor elements arranged in a compact array with the semiconductor chips to be separated with preserved array orientation comprising means for supporting the semiconductor chips, said supporting means including a heat actuated self-expandable substrate material with a generally flat chip supporting surface, said self-expandable substrate having a memorized expanded dome-shape selected to provide an expanded dome shape chip supporting surface upon heating of the substrate, means for producing a flexible uniformly distributed force against the generally flat chip supporting substrate surface, and means for heating the self-expandable substrate to cause dome-shape expansion thereof against the pressure producing means to fracture the semiconductor slice and separate the chips from one another.
References Cited (Backward Citations)
US3448510A
Cited
US3559855A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-01-02 | 1976-07-03 | 1977-01-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-01-02 | 1980-07-03 | 1981-01-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-01-02 | 1984-07-03 | 1985-01-02 | $7700.00 | Window Closed / Lapsed |