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Process for the production of metal patterns on insulating substrates as well as insulating substrates with metal patterns, especially printed circuits

Assignee: MAX SCHLOTTER & Co KG DR-ING GmbH
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Filing: 1985-05-06
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Granted: 1987-05-19
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Expires: 2005-05-06
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Abstract

Abstract A process is described for the production of metal patterns on insulating substrates, especially of printed circuits, in which the substrates are provided with holes by means of electrical connections and the metal patterns are produced on the surface of the substrate with the aid of a negative mask in accordance with the subtractive process, said process being characterized by the following steps: treatment in gaseous sulfur trioxide; application of a negative mask which corresponds to the conductive pattern to be produced; through-hole-plating and subsequent plating of the conductive pattern, which is effected by the following steps in the process: activation by means of an ionogenic precious metal solution, treatment in a reducing agent solution, chemical or chemical and electrolytic deposit, in which the metal deposit takes place solely on the surface of the metal pattern which is to be produced. In addition, insulating substrates with metal patterns, especially printed circuits, are disclosed.

Inventors

  • 👤 Jiri Roubal

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-04 13:09
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/42; H05K3/38; H05K3/381; H05K3/422; H05K2203/00; H05K2203/08; H05K2203/087; H05K3/425; H05K3/427

Claims Analysis

Total Claims: 19
Claim 1
Independent Claim 158 words
A process for the production of metal patterns on a metal-clad insulating substrate in which said substrate is provided with holes for electrical connection and the metal patterns are produced on the surface of said substrate with the aid of a negative mask according to the substractive process, said process comprising the steps of: (i) treating said substrate with gaseous sulfur trioxide; (ii) applying a negative mask to the sulfur trioxide treated substrate, said negative mask corresponding to the negative image of the conductive pattern to be produced; (iii) activating said substrate by treatment with an ionogenic palladium activating solution having a pH in the range of from 1 to 7; (iv) treating said substrate with a reducing agent solution; and (v) chemically or chemically and electrochemically depositing metal on said substrate, said metal being selectively deposited on the surface of the metal pattern to be produced and on the walls of said holes provided for electrical connection.
Claim 2
Dependent Claim 158 words
A process for the production of metal patterns on a metal-clad insulating substrate in which said substrate is provided with holes for electrical connection and the metal patterns are produced on the surface of said substrate with the aid of a negative mask according to the substractive process, said process comprising the steps of: (i) treating said substrate with gaseous sulfur trioxide; (ii) applying a negative mask to the sulfur trioxide treated substrate, said negative mask corresponding to the negative image of the conductive pattern to be produced; (iii) activating said substrate by treatment with an ionogenic palladium activating solution having a pH in the range of from 1 to 7; (iv) treating said substrate with a reducing agent solution; and (v) chemically or chemically and electrochemically depositing metal on said substrate, said metal being selectively deposited on the surface of the metal pattern to be produced and on the walls of said holes provided for electrical connection.
Claim 3
Dependent Claim 36 words
Process as in claim 1, wherein during the treatment sulfur trioxide in concentrations of 10 mg/l up to concentrations which correspond to the vapor pressure of sulfur trioxide over 65% oleum at 25° C. is used.
Claim 4
Dependent Claim 19 words
Process as in claim 1, wherein the treatment in gaseous sulfur trioxide lasts from 1 second to 20 minutes.
Claim 5
Dependent Claim 19 words
Process as in claim 1, wherein the negative mask is produced by means of photoresist or by screen printing.
Claim 6
Dependent Claim 20 words
Process as in claim 1, wherein one or more compounds which contain basic nitrogen are added to said activating solution.
Claim 7
Dependent Claim 32 words
Process as in claim 5, wherein the ratio of the molar concentration of the compound containing nitrogen, based on nitrogen, to the molar concentration of the palladium salt is at least 2.
Claim 8
Dependent Claim 12 words
Process as in claim 5, wherein the activating solution contains ammonium ions.
Claim 9
Dependent Claim 15 words
Process as in claim 5, wherein the activating solution contains primary, secondary or tertiary amines.
Claim 10
Dependent Claim 21 words
Process as in claim 5, wherein the pH value of the activating solution is adjusted to be from 2 to 3.
Claim 11
Dependent Claim 13 words
Process as in claim 1, wherein the reducing agent solution contains aminoborane compounds.
Claim 12
Dependent Claim 12 words
Process as in claim 10, wherein the reducing agent solution contains dimethylaminoborane.
Claim 13
Dependent Claim 22 words
Process as in claim 1, wherein as the negative mask, solvent soluble or alkali soluble photoresists or screen printing inks are used.
Claim 14
Dependent Claim 17 words
Process as in claim 1, wherein as the chemical deposition bath, a chemical nickel bath is used.
Claim 15
Dependent Claim 16 words
Process as in claim 13, wherein the chemical nickel bath contains aminoborane as the reducing agent.
Claim 16
Dependent Claim 12 words
Process as in claim 13, wherein the chemical nickel bath contains dimethylaminoborane.
Claim 17
Dependent Claim 20 words
Process as in claim 13, wherein the pH value of the chemical nickel bath is set between 5 and 7.
Claim 18
Dependent Claim 15 words
Process as in claim 1 wherein said metal-clad insulating substrate is a printed circuit board.
Claim 19
Dependent Claim 19 words
Process as in claim 1, wherein the treatment in gaseous sulfur trioxide lasts from 5 seconds to 5 minutes.

References Cited (Backward Citations)

US4039714A Cited
US4285991A Cited
US4308301A Cited
EP0044878A1 Cited
US4325780A Cited
DE3146164A1 Cited
US4520046A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1990-05-18 1990-11-17 1991-05-19 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1994-05-18 1994-11-17 1995-05-19 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1998-05-18 1998-11-17 1999-05-19 $7700.00 Window Closed / Lapsed

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