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US4666569A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of making multilayer ohmic contact to thin film p-type II-VI semiconductor

Assignee: BP Technology Ventures Ltd
•
Filing: 1986-06-02
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Granted: 1987-05-19
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Expires: 2006-06-02
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Abstract

Abstract A method of making an ohmic content to a thin film of a II-VI compound semiconductor. The contact is made by etching the film with an acidic solution and thereafter treating the etched surface with an alkaline solution. A layer of copper 5 to 50 angstroms thick is deposited on the etched and treated surface and covered by a different metal. The contact may be heat treated to improve its performance.

Inventors

  • 👤 Bulent M. Basol

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-30 04:35
CPC Classifications
H; H10; H10D; H10D64/00; H10D64/01; H10D64/011; H10D64/60; H10D64/62; H10P; H10P14/00; H10P14/40; H10P14/46; H10P14/47

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 157 words
A method of forming an ohmic contact to a thin film of a p-type semiconductor compound formed of at least one of the metal elements of Class IIB of the Periodic Table of Elements and one of the non-metal elements of Class VIA of the Periodic Table of Elements, comprising: (a) etching the surface of a thin film of a p-type semiconductor compound formed of at least one of the metal elements of Class 11B of the Periodic Table of Elements and one of the non-metal elements of Class VIA of the Periodic Table of Elements with an acidic solution to form a non-metal-rich surface; (b) treating the surface of the acid-etched film with a strong basic solution; (c) depositing on said etched and treated surface a layer of copper metal having a layer thickness of from about 5 Angstroms to about 50 Angstroms; and (d) depositing on said copper layer a layer of a different metal.
Claim 2
Independent Claim 157 words
A method of forming an ohmic contact to a thin film of a p-type semiconductor compound formed of at least one of the metal elements of Class IIB of the Periodic Table of Elements and one of the non-metal elements of Class VIA of the Periodic Table of Elements, comprising: (a) etching the surface of a thin film of a p-type semiconductor compound formed of at least one of the metal elements of Class 11B of the Periodic Table of Elements and one of the non-metal elements of Class VIA of the Periodic Table of Elements with an acidic solution to form a non-metal-rich surface; (b) treating the surface of the acid-etched film with a strong basic solution; (c) depositing on said etched and treated surface a layer of copper metal having a layer thickness of from about 5 Angstroms to about 50 Angstroms; and (d) depositing on said copper layer a layer of a different metal.
Claim 3
Dependent Claim 25 words
The method in accordance with claim 1 wherein said depositing of said copper layer and said layer of conductive metal is performed by vapor depositing.
Claim 4
Dependent Claim 24 words
The method in accordance with claim 1 wherein said depositing of said copper layer and said layer of conductive metal is performed by electrodepositing.
Claim 5
Dependent Claim 24 words
The method in accordance with claim 1 wherein said method additionally comprises: (e) heat treating said deposited layers so as to anneal said layers.
Claim 6
Dependent Claim 23 words
The method in accordance with claim 4 wherein said layers are heat treated at a temperature between about 80° C. and 250° C.
Claim 7
Dependent Claim 30 words
The method in accordance with claim 1 wherein said different metal is selected from the group consisting of nickel, gold, silver, molybdenum, chromium, platinum, palladium, and mixtures and alloys thereof.

References Cited (Backward Citations)

US3370207A Cited
US3268309A Cited
US3465428A Cited
US4065781A Cited
US4000508A Cited
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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1990-05-18 1990-11-17 1991-05-19 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1994-05-18 1994-11-17 1995-05-19 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1998-05-18 1998-11-17 1999-05-19 $7700.00 Window Closed / Lapsed

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