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Patent US4661435A successfully refreshed from Google Patents.
US4661435A
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Photosensitive polyamic acid derivative, compounds used in the manufacture of the derivative, method of manufacturing polyimide pattern on a substrate, and semiconductor device comprising a polyimide pattern obtained by using the said method
Assignee: US Philips Corp
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Filing: 1986-02-10
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Granted: 1987-04-28
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Expires: 2006-02-10
Abstract
Abstract A photosensitive polyamic acid derivative, compounds used in the manufacture of the derivative, method of manufacturing a polyimide pattern on a substrate, and semiconductor device comprising a polyimide pattern obtained by using the said method.
Inventors
- 👤 Lourens Minnema
- 👤 Johan M. van der Zande
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 08:54
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/004; G03F7/038; G03F7/0387; G03F7/027; G03F7/032; G03F7/037
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
197 words
A method for producing a semiconductor device having a semiconductor body comprising at least one semiconductor element having a polyimide pattern on a substrate comprising the steps of treating a polyamic acid with a compound of the formula: ##STR22## wherein R 2 is hydrogen or methyl, R 6 is hydrogen or methyl, R 7 is isopropyl or cyclohexyl and z is an integer of 2-4; with a compound of the formula: ##STR23## wherein R 2 and z are defined above, with a compound of the formula ##STR24## wherein R 1 is alkyl of 1-8 carbon atoms, R 4 and R 5 each independently are hydrogen, methyl or phenyl, n is 0 or 1 and m is an integer of 1-6, or with a compound of the formula ##STR25## wherein R 1 and m are defined as above; applying the resultant photosensitive polyimide acid derivative onto said substrate to form a layer of photosensitive polyamic acid derivative, subjecting said layer to a desired light pattern, developing said exposed layer to thereby form a polyamic acid derivative pattern and the said polyamic derivative pattern is subjected to a thermal treartment thereby converting the polyamic acid derivative to a polyimide.
Claim 2
Independent Claim
197 words
A method for producing a semiconductor device having a semiconductor body comprising at least one semiconductor element having a polyimide pattern on a substrate comprising the steps of treating a polyamic acid with a compound of the formula: ##STR22## wherein R 2 is hydrogen or methyl, R 6 is hydrogen or methyl, R 7 is isopropyl or cyclohexyl and z is an integer of 2-4; with a compound of the formula: ##STR23## wherein R 2 and z are defined above, with a compound of the formula ##STR24## wherein R 1 is alkyl of 1-8 carbon atoms, R 4 and R 5 each independently are hydrogen, methyl or phenyl, n is 0 or 1 and m is an integer of 1-6, or with a compound of the formula ##STR25## wherein R 1 and m are defined as above; applying the resultant photosensitive polyimide acid derivative onto said substrate to form a layer of photosensitive polyamic acid derivative, subjecting said layer to a desired light pattern, developing said exposed layer to thereby form a polyamic acid derivative pattern and the said polyamic derivative pattern is subjected to a thermal treartment thereby converting the polyamic acid derivative to a polyimide.
Claim 3
Dependent Claim
53 words
A method of claim 1 wherein polyamic acid is treated with a compound of the formula: ##STR26## wherein R 2 has a meaning given herein before, R 6 is a hydrogen atom or a metal group, R 7 is an isopropyl group or a cyclohexyl group, and C has a value of 2-4.
Claim 4
Dependent Claim
32 words
The method of claim 1 wherein the polyamic acid is treated with a compound of the formula in which R 7 is isopropyl or cyclohexyl and C has a value of 2-4.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1990-04-27 | 1990-10-27 | 1991-04-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1994-04-27 | 1994-10-27 | 1995-04-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1998-04-27 | 1998-10-27 | 1999-04-28 | $7700.00 | Window Closed / Lapsed |